| TAIYO HOLDINGS CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120125672 | PHOTOCURABLE RESIN COMPOSITION - Provided is a photocurable resin composition, which has sensitivity equal to or greater than existing compositions, has alkali development properties, and which produces a cured product that does not become brittle with changes in temperature, and which also has excellent reliability in terms of water resistance, electrical insulating properties, PCT resistance, and the like. The photocurable resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, a vinyl group-containing elastomer, and a styryl group-containing compound. | 05-24-2012 |
| 20120111620 | PHOTOCURABLE RESIN COMPOSITION - Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like. | 05-10-2012 |
| 20120061128 | PHOTOSENSITIVE RESIN, CURABLE RESIN COMPOSITION CONTAINING THE SAME, DRY FILM THEREOF, AND PRINTED CIRCUIT BOARD USING THEM - A carboxyl group-containing photosensitive resin is obtained by reacting an α,β-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; | 03-15-2012 |
| 20110278053 | DRY FILM AND MULTILAYER PRINTED WIRING BOARD - A dry film includes a supporting base film and a thin membrane of a thermosetting resin composition. The thin membrane of the thermosetting resin composition is formed on the supporting base film. The thermosetting resin composition includes a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. The solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. The semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10 A ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2. | 11-17-2011 |
| 20110149541 | HEAT CURABLE ADHESIVE AND RESIN LAMINATED-TYPE IC CARD - Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin. | 06-23-2011 |
