| 20090061241 | TIN ELECTROLYTIC PLATING SOLUTION FOR ELECTRONIC PARTS, METHOD FOR TIN ELECTROLYTIC PLATING OF ELECTRONIC PARTS, AND TIN ELECTROPLATED ELECTRONIC PARTS - A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method. | 03-05-2009 |
