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Taiwn Semiconductor Manufacturing Company, Ltd.

Taiwn Semiconductor Manufacturing Company, Ltd. Patent applications
Patent application numberTitlePublished
20110193198Corner Stress Release Structure Design for Increasing Circuit Routing Areas - An integrated circuit structure includes a semiconductor chip, which further includes a corner and a seal ring dispatched adjacent edges of the semiconductor chip; and a corner stress release (CSR) structure adjacent the corner and physically adjoining the seal ring. The CSR structure includes a portion in a top metallization layer. A circuit component selected from the group consisting essentially of an interconnect structure and an active circuit is directly underlying the CSR structure.08-11-2011