| Taiwan TFT LCD Association Patent applications |
| Patent application number | Title | Published |
|---|
| 20110230044 | CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME - A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing. | 09-22-2011 |
| 20110096286 | Method of fabricating liquid crystal display - A first substrate and a second substrate are provided. An alignment process is performed on a surface of the first substrate and a surface of the second substrate respectively. A liquid crystal mixture is prepared, where the liquid crystal mixture includes a liquid crystal molecule and a liquid crystal monomer having a functional group of diacrylates, and the liquid crystal monomer having the functional group of diacrylates occupies 0.01-2 wt % of the liquid crystal mixture. The first substrate and the second substrate are assembled, and the liquid crystal mixture is filled therebetween. A polymerization curing process is performed such that the liquid crystal monomer having the functional group of diacrylates is polymerized to respectively form a liquid crystal polymer film on the aligned surfaces of the first and second substrates. The method enhances anchoring energy and reduces problems of V-T shift, surface gliding, and residual image. | 04-28-2011 |
| 20110069266 | OPTICALLY COMPENSATED BIREFRINGENCE MODE LIQUID CRYSTAL DISPLAY PANEL - An OCB mode liquid crystal display panel having a plurality of pixel regions includes a first substrate, a second substrate, dot liquid crystal polymer patterns and an OCB liquid crystal material. The first substrate has a first alignment treated layer thereon, the second substrate has a second alignment treated layer thereon, and the dot liquid crystal polymer patterns are on the first alignment treated layer and the second alignment treated layer. Each of the dot liquid crystal polymer patterns has an area between 1˜225 μm | 03-24-2011 |
| 20110043736 | LIQUID CRYSTAL DISPLAY AND BIAXIAL COMPENSATION FILM - A liquid crystal display including a liquid crystal panel and a biaxial compensation film is provided. The liquid crystal panel has a first surface and a second surface. The biaxial compensation film is disposed on the first surface and includes a C-plate compensation film and nano-structures on the C-plate compensation film serving as an A-plate compensation film. | 02-24-2011 |
| 20100163869 | BONDING INSPECTION STRUCTURE - A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening. | 07-01-2010 |
| 20100163281 | BASE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD OF FABRICATING THEREOF - A base of circuit board, a circuit board, and a method of fabricating thereof are provided. The circuit board includes a substrate, a plurality of elastic bumps and a patterned circuit layer. The elastic bumps arranged in at least an array are located on the substrate. The patterned circuit layer is located on a portion of the elastic bumps and a portion of the substrate. The base of the circuit board and the method of fabricating thereof are also included in the present invention. | 07-01-2010 |
| 20100136785 | DIRECT PATTERNING METHOD FOR MANUFACTURING A METAL LAYER OF A SEMICONDUCTOR DEVICE - A direct patterning method for manufacturing a metal layer of a semiconductor device is provided. The claimed method reduces the materials and hours required by prior methods such as the thin film depositing method for a substrate, and the photolithographic method for manufacturing a transistor. | 06-03-2010 |
| 20100128025 | METHOD OF MANUFACTURING AND DRIVING OCB LIQUID CRYSTAL PANEL - A method of manufacturing and driving an optically compensated birefringence (OCB) mode liquid crystal (LC) panel is provided. In the method, the OCB LC panel is applied which is characterized that a closed structure region with HAN, VA or Bend property is around a display region of the OCB LC panel. Thereafter, the OCB LC panel is driven by a mode of multistage voltage variation. The mode of multistage voltage variation includes applying a high voltage to LC molecules in the OCB LC panel for transferring them to a bend or a VA state, decaying the high voltage to a low voltage above a bend state holding voltage of the OCB LC panel, and turning off the voltage to zero so as to maintain the configuration of LC molecules in the OCB LC panel in a π-twist state. | 05-27-2010 |
| 20100103520 | OPTICAL SHEET, DISPLAY APPARATUS AND FABRICATING METHOD THEREOF - An optical sheet suitable for linear polarized light to pass through is provided. The optical sheet includes a substrate and a retardation film. The retardation film herein is located on the substrate and has a plurality of optical axes with different extending directions. The linear polarized light after passing through the retardation film is converted into a plurality of linear polarized light with different polarization directions, wherein the retardation film substantially has a phase retardation of λ/2 at anywhere of the area where the linear polarized light passes through and λ is the wavelength of the linear polarized light. Besides, the present invention also provides a display apparatus, a fabricating method of an optical sheet and a fabricating method of a display apparatus. | 04-29-2010 |
| 20100044696 | THIN FILM TRANSISTOR AND LIQUID CRYSTAL DISPLAY - A thin film transistor is provided. The thin film transistor includes a substrate, a gate, a source/drain, an insulating layer, and a semiconductor active layer. The gate and the source/drain are respectively deposited on the substrate and are separated by the insulating layer on the substrate. The semiconductor active layer connects the source and the drain. The material of the semiconductor active layer is a semiconductor precursor which produces semiconductor property after being irradiated by a light source. A liquid crystal display which includes the above thin film transistor is also provided. | 02-25-2010 |
| 20090305473 | METHOD FOR FABRICATING THIN FILM TRANSISTOR - A method for fabricating a thin film transistor is provided. A gate is formed on a substrate. A gate insulating layer is formed on the substrate to cover the gate. A metal oxide material layer is formed on the gate insulating layer. A photoresist layer is formed on the metal oxide material layer, in which a thickness of the photoresist layer above the gate is larger than that of the photoresist layer above two sides adjacent to the gate. A portion of the metal oxide material layer is removed to form a metal oxide active layer by using the photoresist layer as a mask. The photoresist layer above the two sides adjacent to the gate is removed and the remaining photoresist layer covers a portion of the metal oxide active layer. A source and a drain are formed on the metal oxide active layer covered by the photoresist layer. | 12-10-2009 |
| 20090253233 | METHOD OF FABRICATING BONDING STRUCTURE - A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween. | 10-08-2009 |
| 20090246988 | CONTACT STRUCTURE AND FORMING METHOD THEREOF AND CONNECTING STRUCTURE THEREOF - A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad. | 10-01-2009 |
| 20090243093 | CONTACT STRUCTURE AND CONNECTING STRUCTURE - A contact structure disposed on a substrate is provided. The contact structure includes at least one pad, at least one polymer bump and at least one conductive layer. The pad is disposed on the substrate and the polymer bump is disposed on the substrate. The polymer bump has a curved surface having a plurality of concave-convex structures. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad. | 10-01-2009 |
| 20090206478 | FLIP CHIP DEVICE AND MANUFACTURING METHOD THEREOF - A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced. | 08-20-2009 |
| 20090200686 | ELECTRICAL CONNECTING STRUCTURE AND BONDING STRUCTURE - A electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump. | 08-13-2009 |
| 20090162568 | MANUFACTURING METHOD OF OPTICAL FILM - A method of manufacturing an optical film includes steps of providing a substrate first and performing an alignment treatment on the surface of the substrate or forming an alignment layer on the substrate. A first liquid crystal layer is then coated on the aligned surface of the substrate or on the surface of the alignment layer, and thereafter, a first curing step is performed. After a second alignment layer is coated on the surface of the first liquid crystal layer, a second curing step is performed so as to form a multi-layer including the first and second liquid crystal layers. | 06-25-2009 |
| 20090149015 | MANUFACTURING METHOD OF CONTACT STRUCTURE - A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad. | 06-11-2009 |
| 20090096778 | METHOD AND APPARATUS OF DETECTING IMAGE-STICKING OF DISPLAY DEVICE - A method of measuring image-sticking of a display device based on a vision model is described. A display device is provided, and a test frame is displayed on the display device. The test frame has a pattern formed by a maximum gray level and a minimum gray level. After burning-in the test frame for a period of time, a gray frame at a medium gray level is displayed on the display device. The test frame, including portions of extreme black and extreme white, leaves image-sticking on the gray pattern at a medium gray level at the same time. Next, an image capture device is used to capture the image-sticking on the display device after burn-in. Finally, a vision model is employed to simulate the human visual perception on the image-sticking and to grade the image-sticking according to the human eye sensitivity for viewing the image-sticking on the display device. | 04-16-2009 |
| 20090093093 | METHOD OF FABRICATING THIN FILM TRANSISTOR - A method for fabricating a thin film transistor (TFT) is provided. A substrate having a gate, a dielectric layer, a channel layer and an ohmic contact layer formed thereon is provided. Next, a metal layer is formed over the substrate covering the ohmic contact layer. Next, the metal layer and the ohmic contact layer are simultaneously etched by a wet etching process to form a source/drain and expose the channel layer. Because the wet etching process can be used to selectively etch the ohmic contact layer, damage to the underlying channel layer may be negligible. Thus, the reliability of the device may be promoted. Furthermore, the process may be simplified, the production yield and the throughput of TFT may be increased. | 04-09-2009 |
| 20080284011 | BUMP STRUCTURE - A bump structure including at least one contact pad, at least one first polymer bump, at least one second polymer bump, and a conductive layer is provided. The contact pad is disposed on a substrate, and the first polymer bump is also disposed on the substrate. The second polymer bump is disposed on the substrate and is connected to the first polymer bump. The conductive layer covers the first polymer bump and electrically connects the contact pad. | 11-20-2008 |
| 20080278674 | METHOD FOR FABRICATING REFLECTIVE OPTICAL FILM AND REFLECTIVE POLARIZING FILM AND METHOD FOR FABRICATING THE SAME - A method for fabricating a reflective optical film is provided. A substrate is first provided. Next, a phase retardation film is formed on at least one side of the substrate by means of coating. Afterward, a cholesteric liquid crystal (CLC) layer is formed on the phase retardation film by means of coating. Hence, the conventional external bond fabrication process can be simplified. Further, the undesired optical results caused by the more disordered alignment in the upper layer of CLC being more disordered compared to that in the lower layer of CLC and the failure to display the compensation effect can be overcome. | 11-13-2008 |
| 20080266492 | LIGHT EMITTING OPTICAL FILM AND MANUFACTURE METHOD THEREOF AND LIQUID CRYSTAL DISPLAY DEVICE - A light emitting optical film at least including a substrate, an alignment layer and a polarized light emitting liquid crystal film is provided, in which the polarized light emitting liquid crystal film includes liquid crystal and light-emitting dye. The alignment layer is located on one side of the substrate, and the polarized light emitting liquid crystal film is located on the alignment layer. The light emitting optical film can be applied to polarizing film, phase retardation film or color filter. Moreover, it is unnecessary to use conventional backlight module because overall arrangement of liquid crystal can fully emit uniform polarized light, whereby greatly reducing cost of conventional backlight module. | 10-30-2008 |
| 20080197352 | BUMP STRUCTURE ON SUBSTRATE - A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality. | 08-21-2008 |
