| TAIWAN SEMICONDUCTOR MAUFACTURING COMPANY, LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110027944 | METHOD OF FORMING ELECTRICAL CONNECTIONS - A method of forming electrical connections to a semiconductor wafer. A semiconductor wafer comprising an insulation layer is provided. The insulation layer has a surface. A patterned mask layer is formed over the surface of the insulation layer. The patterned mask layer exposes portions of the surface of the insulation layer through a plurality of holes. The portions of the plurality of holes are filled with a metal material comprising copper to form elongated columns of the metal material. The elongated columns of the metal material have a sidewall surface. The patterned mask layer is removed to expose the sidewall surface of the elongated columns of the metal material. A protection layer is formed on the exposed sidewall surface of the elongated columns of the metal material. | 02-03-2011 |
| 20100102411 | PHOTODETECTOR FOR BACKSIDE-ILLUMINATED SENSOR - A backside-illuminated sensor including a semiconductor substrate. The semiconductor substrate has a front surface and a back surface. A plurality of pixels are formed on the front surface of the semiconductor substrate. At least one pixel includes a photogate structure. The photogate structure has a metal gate that includes a reflective layer. | 04-29-2010 |
