TAIWAN SEMICONDUCTOR MANUFACTURING COMPANTY, LTD.
|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANTY, LTD. Patent applications|
|Patent application number||Title||Published|
|20120241784||LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS AND METHODS OF MAKING THE SAME - A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.||09-27-2012|