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TAIWAN SEMICONDUCTOR MANUFACTURING COMPANTY, LTD.
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANTY, LTD. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20120241784 | LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS AND METHODS OF MAKING THE SAME - A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material. | 09-27-2012 |