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TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.

TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD. Patent applications
Patent application numberTitlePublished
20130058049PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS - A package system includes at least one active circuitry disposed over a substrate. A passivation structure is disposed over the at least one active circuitry. The passivation structure has at least one opening that is configured to expose at least one first electrical pad. At least one passive electrical component is disposed over the passivation structure. The at least one passive electrical component is electrically coupled with the at least one first electrical pad.03-07-2013