Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
TAIWAN SEIMCONDUCTOR MANUFACTURING COMPANY, LTD.
| TAIWAN SEIMCONDUCTOR MANUFACTURING COMPANY, LTD. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110193219 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER - A semiconductor device includes a bump structure over a pad region. The bump structure includes a copper layer and a lead-free solder layer over the copper layer. The lead-free solder layer is a SnAg layer, and the Ag content in the SnAg layer is less than 1.6 weight percent. | 08-11-2011 |