TAIWAN SEIMCONDUCTOR MANUFACTURING COMPANY, LTD.
|TAIWAN SEIMCONDUCTOR MANUFACTURING COMPANY, LTD. Patent applications|
|Patent application number||Title||Published|
|20110193219||SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER - A semiconductor device includes a bump structure over a pad region. The bump structure includes a copper layer and a lead-free solder layer over the copper layer. The lead-free solder layer is a SnAg layer, and the Ag content in the SnAg layer is less than 1.6 weight percent.||08-11-2011|