TAIFLEX SCIENTIFIC CO., LTD.
|TAIFLEX SCIENTIFIC CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20150322274||THERMALLY CURABLE SOLDER-RESISTANT INK AND METHOD OF MAKING THE SAME - A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.||11-12-2015|
|20150257296||COVER LAYER WITH HIGH THERMAL RESISTANCE AND HIGH REFLECTIVITY FOR A PRINTED CIRCUIT BOARD - A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.||09-10-2015|
|20150194553||THERMALLY CONDUCTIVE ENCAPSULATE AND SOLAR CELL MODULE COMPRISING THE SAME - A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in||07-09-2015|
|20150108388||Light Absorbing Composition And Light-Absorbing Structure Made Therefrom - Provided is a light-absorbing composition, which is prepared by melt-extruding a mixture containing light-absorbing particle agglomerates and a polymer. The light-absorbing particle agglomerates comprises a dispersant and light-absorbing particles capped with the dispersant, and the light-absorbing particle agglomerates dispersed in the light-absorbing composition and have an average particle size ranging from 10 nanometers to 800 nanometers. Accordingly, the light-absorbing composition can effectively absorb near-infrared light and store infrared heat, and thereby providing infrared-absorbing, heat-insulating and heat-storing abilities. Furthermore, a light-absorbing structure made from the light-absorbing composition has good transparency, higher infrared absorbance, light-absorbing and heat-releasing efficiencies, and is thereby beneficial to keep the temperature equilibrium of buildings or vehicles.||04-23-2015|
|20140370263||PLASTICIZABLE HEAT-INSULATING COMPOSITION, TRANSPARENT HEAT-INSULATING INTERMEDIATE SHEET AND TRANSPARENT HEAT-INSULATING SANDWICH-STRUCTURED PANEL - A plasticizable heat-insulating composition compatible with polyvinyl acetal resins and mixed with polyvinyl acetal resin for forming a mixture for a plasticizing process for making a transparent intermediate heat-insulating sheet, as well as a transparent heat-insulating sandwich-structured panel that demonstrates high transparency, high wide-range near infrared absorbance and high heat-insulation index, so as to improve their heat-insulating and energy-saving functions.||12-18-2014|
|20090142583||Composition of anti-glare coating - A composition of an anti-glare coating has a resin, multiple particles and a dispersant. The resin is selected from the group consisting of thermosetting resin and light-curing resin. The particles have a dimension that is from about 30 nanometers (nm) to about 10 micrometers (μm). Because the dispersant stabilizes and keeps a separation distance between each two particles, the particles cannot aggregate in or precipitate out of the anti-glare coating. Thus, the anti-glare coating can be coated easily on the substrate and a surface of the anti-glare film is uniform to provide an improved anti-glare effect. Moreover, the dispersant allows adjustment of haze, gloss and distinctness of image of a substrate coated with the anti-glare coating.||06-04-2009|
Patent applications by TAIFLEX SCIENTIFIC CO., LTD.