20150064294 | Release Device Applied in Electronic Package - The present invention relates to a release device applied in electronic package, wherein the release device is attached to the inner surface of a transfer modeling mold for electronic package. In the present invention, the release device consists of a substrate and a release layer formed on the substrate, wherein the substrate is made of a plastic material with the thickness of 0.016 mm˜0.5 mm, and the plastic material can be PET, PP, PC, PE, PI, or PVC. Differing from the substrate, the release layer is made of a pure silica gel or a silica gel/rubber compound with the thickness of 0.02 mm˜2 mm. The release device can provide a releasing force for facilitating the modeled device formed by using the transfer modeling mold be easily separated from the mold, and avoid part of manufacture material from remaining in the inner surface of the mold. | 03-05-2015 |