| 20110097533 | THIN FILM ENCAPSULATION METHOD - This invention discloses a thin film encapsulation method, which applies a PECVD method, deposition thin film on the device surface to separate the devices' active area from the water vapor and oxygen in the air, so as to realize the physical protection and thus to accomplish the device encapsulation, specifically, comprising the following procedures: (1) Placing the devices to be encapsulated in the PECVD chamber, and fixing the mask to control the encapsulation area; (2) Depositing the inorganic layer, the polymer layer and the graded composition layer by using the organic silica precursor through the PECVD method under the plasma condition and obtain the required encapsulation structure. | 04-28-2011 |
