| SUMITOMO BAKELITE COMPANY, LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120111621 | RESIN COMPOSITION, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 μm to 10 μm, boehmite particles having an average particle diameter of 0.2 μm to 5 μm, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm. | 05-10-2012 |
| 20120070474 | POLYMER COMPOUND FOR BIOMEDICAL USE AND BIOCHIP SUBSTRATE USING SUCH A POLYMER COMPOUND - A biochip substrate capable of realizing the high detection accuracy by restricting a nonspecific adsorption or bonding of a substance to be detected, when used for a detection or analysis of protein, nucleic acids and the like. The biochip substrate is for fixing a biologically active substance on a surface of a solid substrate, and characterized in that it has a layer comprising a polymer compound obtained by copolymerizing an ethylenically unsaturated polymerizable monomer having an alkylene glycol residue, an ethylenically unsaturated polymerizable monomer having a functional group for fixing a biologically active substance and an ethylenically unsaturated polymerizable monomer having a cross-linkable functional group, on the surface of the substrate. | 03-22-2012 |
| 20120068106 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME - A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. | 03-22-2012 |
| 20110308848 | RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE - Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body. | 12-22-2011 |
| 20110221017 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM, AND LIGHT-RECEIVING DEVICE - A photosensitive resin composition includes (A) an alkali-soluble resin, (B) an epoxy resin, and (C) a photopolymerization initiator, the epoxy resin (B) being an epoxy resin having a naphthalene skeleton and/or an epoxy resin having a triphenylmethane skeleton. A semiconductor device including a semiconductor wafer, a transparent substrate, and a spacer formed by a photosensitive adhesive film produced using the photosensitive resin composition does not suffer from condensation of dew. A light-receiving device having excellent reliability can also be obtained. | 09-15-2011 |
| 20110083890 | EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 μm or more and 5.0 μm or less. | 04-14-2011 |
| 20110051387 | METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUCT, PRINTED WIRING BOARD, INTERPOSER AND SEMICONDUCTOR APPARATUS - An object of the present invention is to provide an electroless nickel-palladium-gold plating method which is able, when performed on a plating target surface such as terminals of a printed wiring board, terminals of other electronic components, and other resin substrates with a fine metal pattern, to prevent abnormal metal deposition on a resin surface which is an undercoat and to provide a high-quality plated surface. Another object of the present invention is to provide a plated product with a high-quality plated surface, particularly such as an interposer and motherboard, and a semiconductor apparatus using the same. These objects were achieved by the electroless nickel-palladium-gold plating method of the present invention, which is a method for plating target objects such as terminals of a printed wiring board and in which at least one surface treatment selected from a treatment with a solution of pH 10 to 14 and a plasma treatment is performed at an optional step after the step of providing a palladium catalyst and before the step of performing electroless palladium plating. | 03-03-2011 |
| 20110039736 | METHOD OF IMMOBILIZING BIOLOGICALLY ACTIVE SUBSTANCE - An object of the present invention is to provide a method of immobilizing the biologically active substance which has an excellent capability of immobilizing a target biologically active substance, and exhibits low nonspecific adsorption of the biologically active substance to provide a high S/N ratio, without using a functional group for fixing the biologically active substance and without having a process of inactivating the functional group for fixing the biologically active substance after immobilizing the biologically active substance. The above object is achieved by a method of immobilizing a biologically active substance comprising the step of: bringing a solution into contact with a compound-side surface of an immobilizing substrate to immobilize the biologically active substance on a surface of the immobilizing substrate, the solution being prepared by dissolving the biologically active substance in a phosphate buffer having a phosphate concentration of 0.1 M or more, and the immobilizing substrate comprising a substrate and a compound containing a hydrophilic group inhibiting nonspecific adsorption on a surface of the substrate. | 02-17-2011 |
| 20110007489 | EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. | 01-13-2011 |
| 20100065315 | RESIN COMPOSITION, INSULATING SHEET WITH BASE, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 μm to 0.8 μm, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment. | 03-18-2010 |
| 20090198008 | RESIN FOR RUBBER COMPOUNDING AND RUBBER COMPOSITION - It is a main object of the present invention to provide an alkylphenol resin for rubber compounding to obtain a rubber composition having high tackiness, and a rubber composition using the same. | 08-06-2009 |
| 20090176298 | Polymer Compound For Medical Material, And Biochip Substrate Using The Polymer Compound - A main object of the invention is to provide a polymer compound for medicine which has an excellent capability of fixing a biologically active substance and has such chemical/physical stability that the compound is less dissolved or deteriorated in a washing step, in particular, which can be suitably applied to a plastic substrate surface. | 07-09-2009 |
| 20090118431 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME - A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same. | 05-07-2009 |
| 20080255335 | Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same - A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): | 10-16-2008 |
