| SUMITOMO BAKELITE COMPANY LIMITED Patent applications |
| Patent application number | Title | Published |
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| 20120064458 | OPTICAL WAVEGUIDES AND METHODS THEREOF - Embodiments in accordance with the present invention provide waveguide structures and methods of forming such structures where core and laterally adjacent cladding regions are defined. Some embodiments of the present invention provide waveguide structures where core regions are collectively surrounded by laterally adjacent cladding regions and cladding layers and methods of forming such structures. | 03-15-2012 |
| 20120012989 | METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor wafer bonding product according to the present invention, including: a step of preparing a spacer formation film including a support base and a spacer formation layer; a step of attaching the spacer formation layer of the spacer formation film to a semiconductor wafer; a step of selectively exposing the spacer formation layer with an exposure light via a mask, which is placed at a side of the support base of the spacer formation film, so as to be passed through the support base; a step of removing the support base; a step of developing the spacer formation layer to form a spacer on the semiconductor wafer; and a step of bonding a transparent substrate to a surface of the spacer opposite to the semiconductor wafer. | 01-19-2012 |
| 20110256367 | PREPREG, METHOD FOR MANUFACTURING PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied. | 10-20-2011 |
| 20110243499 | OPTICAL WAVEGUIDE AND OPTICAL WAVEGUIDE MANUFACTURING MEMBER - An optical waveguide includes a clad layer, a core layer and a clad layer which are laminated together in this order from a lower side thereof. Within the core layer, a core portion and a side clad portion provided adjacent to the core portion so as to surround side surfaces of the core portion are formed. Further, a part of the side clad portion prevents a left side end of the core portion from being exposed outside. A mirror formation region is constituted from a region consisting of such a part of the side clad portion and a part of each of the clad layers located thereabove and therebelow. This mirror formation region is subjected to digging processing so that a concave portion is formed. An inner surface of this concave portion serves as the mirror. From the mirror, a material other than a material constituting the core portion, that is, a material constituting each of the clad layers and a material constituting the side clad portion are exposed. | 10-06-2011 |
| 20110120754 | MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE - A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C. or lower. | 05-26-2011 |
| 20110110623 | OPTICAL WAVEGUIDE FILM, LAMINATED TYPE OPTICAL WAVEGUIDE FILM, OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE ASSEMBLY, OPTICAL WIRING LINE, OPTICAL/ELECTRICAL COMBINATION SUBSTRATE AND ELECTRONIC DEVICE - An optical waveguide film includes at least one optical waveguide area having an X-direction and a Y-direction orthogonal to the X-direction. Such an optical waveguide film includes a plurality of core portions arranged side by side within the same layer so as to extend along the X-direction, each of the core portions having side surfaces, and the core portions adjoining to each other in the Y-direction being arranged through a gap therebetween; and a plurality of cladding portions provided so as to cover the side surfaces of each of the core portions, each of the cladding portions formed of a resin having an optical refractive index smaller than that of each of the core portions, and the cladding portion between the adjoining core portions providing each gap. In the optical waveguide film, a size of the gap between the adjoining core portions varies along the X-direction in at least a part of the optical waveguide area. This makes it possible to precisely match a gap between core portions in a cut end surface with a desired value by selection of cutting positions of the optical waveguide film even when the optical waveguide film is shrunken. | 05-12-2011 |
| 20110065141 | Method of Diagnosing Pancreatic Cancer with the Use of N-Binding Type Sugar Chains - The present invention is to provide a novel marker for diagnosing pancreatic cancer, a method for determining if a subject has pancreatic cancer utilizing the marker, etc. The present inventors collected blood from patients of 78 cases in total including patients of 24 cases with pancreaticobiliary-duct benign disorder (16 gallstone cases and 8 pancreatitis cases) and patients of 54 cases with pancreatic cancer, and mass spectrometry was performed on N-linked sugar chains in plasma. From the 74 mass-spectrometric peaks detected, 65 sugar chains were extracted based on the results of PAM analysis. These extracted sugar chains were then used to predict pancreatic cancer or pancreaticobiliary-duct benign disorder, to correctly diagnose 74% cases. Further, a T-test was performed between the two groups, the group of pancreaticobiliary-duct benign disorder and the group of pancreatic cancer, which identified two sugar chains, the sugar chain of m/z 3031 and the sugar chain of m/z 2362, as sugar chains demonstrating significant difference (p<0.05) and exhibiting 2-fold or greater difference in expression levels between the two groups. The rate of correct detection when using these sugar chains was calculated with six classifiers, all of which gave the result of about 70% correct detection. | 03-17-2011 |
| 20110006419 | FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A film for use in manufacturing a semiconductor device having at least one semiconductor element of the present invention is characterized by comprising: a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity. Further, it is preferred that in the film of the present invention, the semiconductor element is of a flip-chip type and has a functional surface, and the bonding layer is adapted to be bonded to the functional surface of the semiconductor element. | 01-13-2011 |
| 20100300619 | PREPREG, METHOD FOR MANUFACTURING PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided. The prepreg according to the present invention includes a core layer including a sheet-shaped base member and having one surface and the other surface which is opposite to the one surface, the first resin layer provided on the one surface of the core layer and formed of a first resin composition, and the second resin layer provided on the other surface of the core layer and formed of a second resin composition, wherein at least one of a requirement that a thickness of the first resin layer is different from that of the second resin layer and a requirement that a constitution of the first resin composition is different from that of the second resin composition is satisfied. | 12-02-2010 |
| 20100273003 | RESIN COMPOSITION, PREPREG, AND LAMINATE - A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit. | 10-28-2010 |
| 20100213597 | SEMICONDUCTOR ELEMENT MOUNTING BOARD - A semiconductor element mounting board includes: aboard having surfaces; a semiconductor element mounted on one of the surfaces of the board; a first layer into which the semiconductor element is embedded, the first layer being provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In such a semiconductor element mounting board, each of the surface layers has rigidity higher than that of each of the first and second layers. It is preferred that in the case where a Young's modulus of each surface layer at 25° C. is defined as X GPa and a Young's modulus of the first layer at 25° C. is defined as Y GPa, the X and the Y satisfy a relation of 0.5≦X−Y≦13. | 08-26-2010 |
| 20100186938 | HEAT TRANSFER SHEET AND HEAT DISSIPATION STRUCTURE - A heat transfer sheet of the present invention includes a heat transfer layer having a first portion and a second portion provided in a position different from the first portion in a planar view of the heat transfer layer, the second portion being capable of expanding and contracting in a thickness direction of the heat transfer layer at an expansion ratio larger than that of the first portion depending on temperature changes in an object from which heat is to be dissipated. In a state that the heat transfer sheet is used, in the case where a temperature of the heat transfer layer is a predetermined temperature or lower, thermal conductivity between the object and a dissipation member is lowered due to creation of a gap between the second portion and the object and/or the dissipation member, whereas in the case where the temperature of the heat transfer layer is a predetermined temperature or higher, the thermal conductivity between the object and the dissipation member is increased due to substantial elimination of the gap. | 07-29-2010 |
| 20100181684 | RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE - A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer. | 07-22-2010 |
| 20100173164 | ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME - The adhesive film of the present invention is adapted to be used for bonding a semiconductor element and a substrate together or bonding semiconductor elements together. The adhesive film is formed of a resin composition containing an epoxy resin, an acrylic resin, and an acrylic oligomer having a weight average molecular weight of 6,000 or less. The resin composition is characterized in that in the case where an amount of the acrylic resin contained in the resin composition is defined as Wa and an amount of the acrylic oligomer contained therein is defined as Wb, a ratio of Wa/Wb is in the range of 0.5 to 4. Further, the semiconductor device of the present invention is characterized in that a semiconductor element and a substrate or semiconductor elements are bonded together using the above mentioned adhesive film. | 07-08-2010 |
| 20100164126 | RESIN COMPOSITION, RESIN SPACER FILM, AND SEMICONDUCTOR DEVICE - The present invention provides a resin composition. The resin composition is used for a resin spacer provided in a semiconductor device. The semiconductor device comprises of a substrate, a semiconductor element mounted on an interposer so as to face the substrate, and the resin spacer provided between the substrate and the interposer or the semiconductor element for bonding them together in a state that a space is formed between the substrate and the semiconductor element. The resin composition comprises an alkali solubility resin, a photopolimerization resin, and a particulate filler. An average particle size of the particulate filler is in the range of 0.05 to 0.35 μm. An amount of the particulate filler contained in the resin composition is in the range of 1 to 40 wt %. Further, the present invention also provides a resin spacer film. The resin spacer film is constituted of the resin composition described above. | 07-01-2010 |
| 20100129960 | METHOD FOR BONDING SEMICONDUCTOR WAFERS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a method for bonding semiconductor wafers of the present invention, a bonding layer containing a flux-active curing agent and a thermosetting resin is interposed between a first semiconductor wafer and a second semiconductor wafer, thereby producing a semiconductor wafer stacked body in which the first and second semiconductor wafers are stacked together, and then the semiconductor wafer stacked body is compressed in a thickness direction thereof while heating it so that the first and second semiconductor wafers are fixed together by melting and solidifying solder bumps while curing the thermosetting resin, thereby producing a semiconductor wafer bonded body in which first connector portions and second connector portions are electrically connected together through solidified products obtained by melting and solidifying the solder bumps. | 05-27-2010 |
| 20100067861 | LIGHT GUIDE AND LIGHT GUIDE STRUCTURE - An optical waveguide structure has excellent heat resistance and a low water absorbing property and can be manufactured with a low material cost. Such an optical waveguide structure includes: an optical waveguide having two surfaces, a core layer including core portions and cladding portions each having a refractive index lower than that of each of the core portions, the core layer having two surfaces, and cladding layers provided so as to make contact with the two surfaces of the core layer and having a refractive index lower than that of each of the core portions; and conductor layers provided on the two surfaces of the optical waveguide. In the optical waveguide structure, each of the cladding layers is formed of a norbornene-based polymer as a major component thereof. Further, it is preferred that the norbornene-based polymer is composed of molecules each represented by the following formula 1 as a major component thereof: | 03-18-2010 |
| 20100044888 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT - A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature. | 02-25-2010 |
| 20100044081 | LAMINATED BODY, METHOD OF MANUFACTURING SUSBTRATE, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A laminated body of the present invention includes a resin layer in which a core portion composed of a fiber base member having a thickness of 25 μm or less is embedded, the resin layer having two surfaces, and the resin layer through which at least one via-hole is adapted to be formed, and a metal layer bonded to at least one of the two surfaces of the resin layer, and the metal layer having at least one opening portion provided so as to correspond to the via-hole to be formed. Further, a method of manufacturing a substrate of the present invention includes preparing the above laminated body, forming the via-hole so as to pass through the resin layer by irradiating a laser beam onto the resin layer, and removing the metal layer from the resin layer after the via-hole is formed. Further, a substrate of the present invention is manufactured by using the above method. Furthermore, a semiconductor device of the present invention includes the above substrate, and a semiconductor element mounted on the substrate. | 02-25-2010 |
| 20100032826 | SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION - A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75° C. of the cured member is 15 to 35 ppm/° C., the glass transition temperature of at least one buildup layer is 170° C. or more, and the coefficient of linear expansion of at 25 to 75° C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination. | 02-11-2010 |
| 20100025093 | MULTILAYERED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - A multilayered circuit board of the present invention has a single-side laminated structure and does not include a core substrate having via-holes formed therethrough and vias for providing electrical connection through the via-holes. The multilayered circuit board includes a plurality of pairs of layers, each pair including a conductor circuit layer and an insulator layer, wherein a glass transition temperature of each insulator layer is 170° C. or higher, a coefficient of thermal expansion at the glass transition temperature or lower of each insulator layer is 35 ppm or less, and a modulus of elasticity of each insulator layer is 5 GPa or more. | 02-04-2010 |
| 20090215912 | Decomposition Reaction Apparatus, System For Producing Raw Material For Recycled Resin Composition, Method For Producing Raw Material For Recycled Resin Composition, Raw Material For Recycled Resin Composition, And Formed Article - A decomposition reaction apparatus for the decomposition treatment of a thermosetting resin, which comprises a reaction apparatus comprising an introduction section for introducing a resin composition containing the thermosetting resin and a solvent containing a monomer component of the thermosetting resin or a component similar to the monomer component, a decomposition reaction section for heating and pressuring the resin composition and the above solvent so as for the solvent to have a supercritical state or a subcritical state, to thereby prepare a treated and recovered product containing a recycled resin formed by the reduction of the molecular weight of the above thermosetting resin, and a discharge section for discharging the treated and recovered product. In the above reaction apparatus, the introduction of the resin composition and the solvent, the decomposition treatment of the thermosetting resin in the decomposition reaction section and the discharge of the treated and recovered product from the discharge section are all carried out continuously, and therefore, a raw material for a recycled resin composition using an industrial or general waste containing a thermosetting resin as the above resin composition can be produced continuously. | 08-27-2009 |
| 20090202752 | Adhesive Film - An adhesive film used for bonding a semiconductor component or a liquid crystal display component with a substrate, the adhesive film being composed of a resin composition containing a curable resin and a filler, and the adhesive film showing a water vapor transmission rate of 30 [g/m | 08-13-2009 |
| 20090166818 | Positive Photosensitive Resin Composition, and Semiconductor Device and Display Therewith - Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (C) a compound having two or more oxetanyl groups in one molecule and (D) a catalyst for accelerating the ring-opening reaction of the oxetanyl groups of the compound (C). | 07-02-2009 |
| 20090068752 | Method for Preparing Analysis Sample, Analysis Sample and Sugar Chain Capture Agent - A method for preparing an analysis sample which involves the sugar chain capture step comprising a reaction of capturing a sugar chain and/or a sugar derivative from a biological sample by using a sugar chain capture agent and the excision step comprising excising a compound containing a moiety capturing the sugar chain and/or the sugar derivative from the sugar chain capture agent after the completion of the sugar chain capture reaction and releasing the compound. | 03-12-2009 |
