| SUMITOMO BAKELITE CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120129101 | Self-Imageable Film Forming Polymer, Compositions Thereof and Devices and Structures Made Therefrom - Polymers and compositions for forming self-imageable films encompassing such polymers that encompass norbornene-type repeating unit having at least one phenolic functionality and maleic anhydride-type repeating unit, which can be formulated to be either positive tone imaging or negative tone imaging. The films formed thereby are useful as self-imageable layers in the manufacture of microelectronic, such as semiconductor, and optoelectronic devices. | 05-24-2012 |
| 20120118939 | PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE - The process for manufacturing the semiconductor device and the apparatus, which achieve stable production of semiconductor devices with improved connection reliability, is presented. First terminals of circuit boards | 05-17-2012 |
| 20120118789 | COVER TAPE FOR PACKAGING ELECTRONIC PART AND ELECTRONIC PART PACKAGE - The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape ( | 05-17-2012 |
| 20120101501 | ENDOSCOPIC HIGH-FREQUENCY HEMOSTATIC FORCEPS - A hemostatic forceps ( | 04-26-2012 |
| 20120100484 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME - A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: | 04-26-2012 |
| 20120071724 | ENDOSCOPE HOOD AND ENDOSCOPE WITH THE SAME MOUNTED THEREON - An endoscope hood ( | 03-22-2012 |
| 20120070902 | METHOD FOR ANALYSIS OF SUGAR CHAINS BY MASS SPECTROMETRY - Provided is a highly accurate means for analyzing a sugar chain contained in a biological sample by MALDI-TOF MS or such a mass spectrometry method. In the present invention, it was found to be possible to improve the ionization efficiency of a sugar chain by methylating the hydroxyl groups of the sample sugar chain before conducting the MALDI-TOF MS analysis, and by so doing to carry out quantitative analysis and structural analysis of the sample sugar chain with high accuracy. | 03-22-2012 |
| 20120046661 | HIGH-FREQUENCY TREATMENT INSTRUMENT - A high-frequency treatment instrument ( | 02-23-2012 |
| 20110318938 | TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this.
| 12-29-2011 |
| 20110311790 | CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USING THE CONDUCTIVE CONNECTING MATERIAL, AND METHOD FOR PRODUCING A CONNECTING TERMINAL - The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising: a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified. | 12-22-2011 |
| 20110295217 | CATHETER AND METHOD OF MANUFACTURING CATHETER - A main lumen ( | 12-01-2011 |
| 20110286713 | PHOTOSENSITIVE RESIN COMPOSITION, OPTICAL WAVEGUIDE FILM, FILM FOR FORMING OPTICAL WAVEGUIDE, OPTICAL INTERCONNECT, OPTO-ELECTRIC HYBRID CIRCUIT BOARD, ELECTRONIC DEVICE, AND A METHOD OF MANUFACTURING AN OPTICAL WAVEGUIDE FILM - A photosensitive resin composition which includes (A) a cyclic olefin; (B) at least either one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group, having a refractive index different from that of the component (A); and (C) a photoacid generator, is provided. | 11-24-2011 |
| 20110270229 | CATHETER - A catheter ( | 11-03-2011 |
| 20110263095 | TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same. | 10-27-2011 |
| 20110253222 | MICROFLUIDIC DEVICE - The present invention is to provide a microfluidic device capable of allowing a fluid to stably flow in a microchannel without using an external source such as a pump or a suction device, and the microfluidic device, provided with a microchannel to which a sample liquid is transported, includes: an inlet reservoir which reserves a sample liquid to be introduced into said microchannel; an inlet which is provided on a sample-introduced side of the microchannel, and communicates with the inlet reservoir; an outlet provided on a sample-discharged side of the microchannel; and an open channel which is provided as communicating with the outlet, and part of at least one surface of which is opened to the outside atmosphere, wherein the inlet is provided at a higher position in a gravity direction than the outlet. | 10-20-2011 |
| 20110244400 | Norbornene-Type Polymers, Compositions Thereof and Lithographic Process Using Such Compositions - Embodiments in accordance with the present invention provide for non-self imageable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming top-coat layers for overlying photoresist layers in immersion lithographic process and the process thereof. | 10-06-2011 |
| 20110221075 | METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE - Provided is a method of manufacturing an electronic device comprising a first electronic component having a first terminal and a second electronic component having a second terminal, wherein said first electric component is electrically connected to said second electronic component by connecting said first terminal to said second terminal with solder, | 09-15-2011 |
| 20110200937 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME - The present invention provides a positive photosensitive resin composition for spray coating, which comprises an alkali-soluble resin, a compound which generates an acid when exposed to light and a solvent, and which has a viscosity of 0.5 to 200 cP. By using the positive photosensitive resin composition, it is possible to form a coating film having a uniform thickness on the inner surface of a hole having a high aspect ratio. By using a coating film pattern, which is obtained by exposing and developing a predetermined region of the obtained coating film, as an insulating film or mask for forming an insulating film pattern, it is possible to suppress generation of leakage current in a hole and to form a through electrode with a high yield. | 08-18-2011 |
| 20110184077 | METHOD FOR DECOMPOSING POLYMER MATERIAL, METHOD FOR PRODUCING RECYCLED RESIN, AND METHOD FOR RECOVERING INORGANIC FILLER - The present invention is a method for decomposing a polymer material by chemically decomposing a polymer material containing a first monomer and a second monomer in a mixture of the polymer material with the first monomer or a derivative of the first monomer to produce a chemical raw material. A relationship between a proportion of number of molecules of the second monomer to number of molecules of the first monomer in a reaction system for decomposing the polymer material and the molecular weight of the chemical raw material produced in the reaction system is acquired in advance (S | 07-28-2011 |
| 20110172351 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE - An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%. | 07-14-2011 |
| 20110162711 | WAVELENGTH-CONVERTING COMPOSITION AND PHOTOVOLTAIC DEVICE COMPRISING LAYER COMPOSED OF WAVELENGTH-CONVERTING COMPOSITION - There is provided a wavelength-converting composition and a photovoltaic device in which a wavelength-converting substance can be uniformly dispersed without causing an increase in manufacturing costs. The wavelength-converting composition contains a curing resin and a wavelength-converting substance for converting the wavelength of absorbed light. | 07-07-2011 |
| 20110158596 | OPTICAL WAVEGUIDE, OPTICAL WIRING LINE, OPTICAL/ELECTRICAL COMBINATION SUBSTRATE AND ELECTRONIC DEVICE - An optical waveguide is provided. The optical waveguide includes a plurality of core portions and a plurality of clad portions in which each core portion being provided between a pair of clad portions. Each of the plurality of clad portions comprises: a low refractive-index area being in contact with the core portion, wherein a refractive index of the low refractive-index area is lower than that of the plurality of core portions; and a plurality of high refractive-index areas separated from the core portion through the low refractive-index area, wherein a refractive index of the plurality of high refractive-index areas is higher than the refractive index of the low refractive-index area. The plurality of high refractive-index areas are provided in the clad portion in an aligned manner or in a scattered manner. The plurality of high refractive-index areas are constituted of the same kind of material as a constituent material of the plurality of core portions. The plurality of high refractive-index areas make light scattered. Such light does not enter the plurality of core portions and involuntarily enters the plurality of clad portions. By doing so, it is possible to prevent the light from reaching light receiving elements, so that it is possible to improve quality of optical communications. | 06-30-2011 |
| 20110149532 | LAMINATE, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - Disclosed is a laminate including an insulating resin layer and a metallic foil formed in contact with the insulating resin layer. The laminate is characterized in that the interface stress between the insulating resin layer and the metallic foil represented by the following formula (1) is not more than 7×10 | 06-23-2011 |
| 20110136952 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM - A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). | 06-09-2011 |
| 20110124775 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME - Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The semiconductor encapsulating resin composition includes a phenol resin (A) containing a polymer (A0) having structural units represented by the following general formulae (1) and (2), and composed of one or more components having an aromatic group having at least one alkyl group with 1 to 3 carbon atoms at least at one end; an epoxy resin (B); and an inorganic filler (C), | 05-26-2011 |
| 20110120630 | MANUFACTURING PROCESS FOR A PREPREG WITH A CARRIER, PREPREG WITH A CARRIER, MANUFACTURING PROCESS FOR A THIN DOUBLE-SIDED PLATE, THIN DOUBLE-SIDED PLATE AND MANUFACTURING PROCESS FOR A MULTILAYER-PRINTED CIRCUIT BOARD - A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin. | 05-26-2011 |
| 20110101484 | LIGHT-RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a device including at least one light-receiving unit | 05-05-2011 |
| 20110089549 | SEMICONDUCTOR DEVICE - A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are combined with the copper wire having predetermined properties. | 04-21-2011 |
| 20110089033 | METHOD OF PREPARING SUGAR CHAIN SAMPLE, SUGAR CHAIN SAMPLE, AND METHOD OF ANALYZING SUGAR CHAIN - A method of preparing a sugar chain sample, for reducing unreacted labeling reagent in a sample solution containing a labeled sugar chain, includes (process 1) a process of bringing the sample solution containing the labeled sugar chain into contact with monolithic silica, so as to allow the monolithic silica to adsorb a sugar chain component; (process 2) a process of washing the monolithic silica with a washing liquid; and (process 3) a process of bringing the monolithic silica into contact with an eluant, so as to elute the adsorbed sugar chain. | 04-21-2011 |
| 20110085771 | ELECTRONIC APPARATUS, CELLULAR PHONE, FLEXIBLE CABLE AND METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE FORMING BODY - According to the electronic apparatus and cellular phone of the present invention, in an optical waveguide forming body of a flexible cable, an air layer is provided in a deforming section which experiences bending deformation as a result of the movement of a second body relative to a first body (either a pivoting or sliding movement), and the position of this air layer becomes located on the outer circumferential side of a core when the deforming section undergoes bending deformation. As a result of this, it is possible to ensure sufficient flexibility and to also achieve a sufficient improvement in the folding endurance of the core portion for this optical waveguide forming body to be utilized in practical applications. Moreover, it is possible to suppress light loss and achieve high-speed, large-capacity transmissions even when the optical waveguide forming body of a flexible cable experiences bending deformation due to the relative movement of the second body relative to the first body. | 04-14-2011 |
| 20110068483 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device of the present invention includes a coating process in which a pasty thermosetting resin composition having a flux activity is coated on at least either one of a substrate and a semiconductor chip; a bonding process in which the substrate and the semiconductor chip are electrically bonded while placing the pasty thermosetting resin composition in between; a curing process in which the pasty thermosetting resin composition is cured under heating; and a cooling process, succeeding to the curing process, in which cooling is performed at a cooling rate between 10[° C./hour] or above and 50[° C./hour] or below. | 03-24-2011 |
| 20110039157 | ANODIC CARBON MATERIAL FOR LITHIUM SECONDARY BATTERY, METHOD FOR MANUFACTURING THE SAME, LITHIUM SECONDARY BATTERY ANODE, AND LITHIUM SECONDARY BATTERY - The invention aims to improve the charge/discharge cycle characteristics of an anodic carbon material for a lithium secondary battery. An anodic carbon material for a lithium secondary battery according to the present invention comprises: particles containing carbon, or a metal or metalloid, or an alloy, oxide, nitride, or carbide thereof, the particle capable of absorbing and releasing lithium ions; a resinous carbon material enclosing the particles; and a network structure formed from carbon nanofibers and/or carbon nanotubes that bond to the surfaces of the particles and that enclose the particles. | 02-17-2011 |
| 20110037174 | METHOD OF MANUFACTURING SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR COMPONENT - A method of manufacturing a semiconductor component of the present invention has: obtaining a semiconductor wafer having stud electrodes formed on a functional surface thereof, and a circuit board having solder bumps on one surface and having electrode pads on the other surface thereof; bonding the semiconductor wafer and the circuit board, while providing a resin layer having a flux activity between the semiconductor wafer and the circuit board, and so as to bring the stud electrodes into contact with the solder bumps, while penetrating the resin layer having a flux activity, to thereby obtain a bonded structure; applying a solder material onto the electrode pads of the bonded structure; and dicing the bonded structure to obtain a plurality of semiconductor components. | 02-17-2011 |
| 20110031000 | RESIN COMPOSITION, CARRIER MATERIAL WITH RESIN, MULTI-LAYERED PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE - There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c). | 02-10-2011 |
| 20110024172 | MULTILAYER CIRCUIT BOARD, INSULATING SHEET, AND SEMICONDUCTOR PACKAGE USING MULTILAYER CIRCUIT BOARD - Semiconductor chip mounting yield and semiconductor package reliability deteriorate due to warpage of a multilayer circuit board. A multilayer circuit board ( | 02-03-2011 |
| 20110024162 | FLEXIBLE WIRING UNIT AND ELECTRONIC APPARATUS - A flexible wiring unit ( | 02-03-2011 |
| 20110014453 | RESIN SHEET WITH COPPER FOIL, MULTILAYER PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 μm provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin. | 01-20-2011 |
| 20110008611 | PHOTOSENSITIVE RESIN COMPOSITION, FILM FOR PHOTOSENSITIVE RESIN SPACER, AND SEMICONDUCTOR DEVICE - Disclosed is a photosensitive resin composition which is used as a photosensitive resin spacer for forming a cavity section between a substrate and a semiconductor element, including (A) an alkali-soluble resin, (B) a photopolymerizable resin, (C) a filler and (D) a photosensitizing agent, wherein the average particle diameter of said filler is in the range of 5 to 25 nm and the content of said filler is in the range of 1 to 15 weight %. Also disclosed is a film for a photosensitive resin spacer which is composed of the photosensitive resin composition described above. | 01-13-2011 |
| 20110006441 | RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - The object of the present invention can be achieved by an adhesive film for semiconductor element, including: a (meth) acrylic ester copolymer (A); and a silica (B), wherein the (meth) acrylic ester copolymer (A) has a hydroxyl group and a carboxylic group, or has an epoxy group, and has a weight-average molecular weight of 100,000 to 1,000,000, wherein the silica (B) has mean particle diameter of 1 to 100 nm, and wherein none of a thermosetting resin and a curing agent (C) is contained in non-volatile components, or total contents of the thermosetting resin and the curing agent (C) in the non-volatile components is equal to or lower than 5 wt %. | 01-13-2011 |
| 20110005811 | METHOD OF MANUFACTURING RIGID-FLEX CIRCUIT BOARD, AND THE RIGID-FLEX CIRCUIT BOARD - A method of manufacturing a rigid-flex circuit board includes preparing a first and a second coverlay film ( | 01-13-2011 |
| 20110000702 | CIRCUIT BOARD - A signal line ( | 01-06-2011 |
| 20100331060 | CONNECTOR UNIT AND ELECTRONIC EQUIPMENT - A connector unit includes a flexible substrate | 12-30-2010 |
| 20100326712 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - There are provided a circuit board, which has little outflow of an interlayer adhesive to be used for a multilayer lamination while keeping a connection reliability, and a method for manufacturing the circuit board. The circuit board ( | 12-30-2010 |
| 20100320620 | ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE ADHESIVE FILM - An adhesive film for a semiconductor containing an (A) ester (meth)acrylate copolymer and a (B) thermoplastic resin other than the ester (meth)acrylate copolymer, and composed so as to satisfy the following formula (1) for two hours from 10 minutes after starting measurement, in which γ represents an amount of shearing strain produced upon undergoing a shearing stress of 3000 Pa at a frequency of 1 Hz and a temperature of 175° C. on parallel plates of 20 mm in diameter, exhibits superior filling performance in surface unevenness of a substrate through an encapsulating material sealing process, despite that semiconductor chips are stacked in multiple layers in the semiconductor device and hence a wire bonding process imposes a longer thermal history. | 12-23-2010 |
| 20100318094 | GUIDE TUBE HAVING BALLOONS FOR PUNCTURE - A guide tube equipped with a balloon for puncture, includes a main body tube | 12-16-2010 |
| 20100313416 | METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND METHOD FOR MANUFACTURING SAME - The method for providing the solder connection of the present invention is a method for providing a solder connection, which electrically connects a first electronic component having a solder bump to a second electronic component having a protruded electrode to provide electrical connection between the first solder bump and the protruded electrode, wherein a relation of: A+B>C is satisfied, where a height of the first solder bump from one surface of the first electronic component is presented as A [μm], a height of the protruded electrode before the compressive deformation from one surface of the second electronic component is presented as B [μm], and a thickness of the adhesive agent layer is presented as C [μm], and further comprising: disposing the adhesive agent layer in the first electronic component; and deforming the first solder bump and the protruded electrode and providing a contact of the above-described protruded electrode with the above-described first solder bump, so that the sum of the height A [μm] of the first the solder bump and the height B [μm] of the above-described protruded electrode is substantially equivalent to the thickness C [μm] of the above-described adhesive agent layer. | 12-16-2010 |
| 20100312261 | SHEATH FOR GASTROSTOMA, SHEATHED DILATOR, SHEATH FOR GASTROSTOMA WITH INSERTION AID, GASTROSTOMY CATHETER KIT, AND METHOD OF SPLITTING SHEATH FOR GASTROSTOMA - The present invention provides a sheath for gastrostoma ( | 12-09-2010 |
| 20100311958 | CARRIER, METHOD AND REAGENT FOR OBTAINING SMALL RNA - An object of the present invention is to provide a carrier which enables to obtain a small RNA in high yield yet in high purity, a simple method for obtaining a small RNA and/or a target nucleic acid of small RNA using the same, and a reagent and a kit comprising the above-described carrier. | 12-09-2010 |
| 20100297439 | PHOTOSENSITIVE ADHESIVE RESIN COMPOSITION, ADHESIVE FILM AND LIGHT-RECEIVING DEVICE - A photosensitive adhesive resin composition includes (A) a compound having a hydroxyl group or a carboxyl group, and a (meth)acryloyl group, (B) a resin which cures with the compound (A) by thermal treatment, (C) a compound having a (meth)acryloyl group and not having a hydroxyl group and a carboxyl group, (D) a phenol resin or a phenol compound, and (E) a photoactive compound. The photosensitive adhesive resin composition has excellent developability, and is used for producing a spacer formed between a transparent substrate and a substrate on which a semiconductor element is formed. An adhesive film and a light-receiving device are produced using the photosensitive adhesive resin composition. | 11-25-2010 |
| 20100282497 | CIRCUIT BOARD - Release papers ( | 11-11-2010 |
| 20100279114 | PREPREG MANUFACTURING METHOD AND PREPREG - The invention offers a method of manufacturing a prepreg capable of impregnating a fiber substrate with a liquid resin with a high degree of impregnation, and a prepreg obtained by this method. The invention is a method of manufacturing a prepreg by impregnating a long fiber substrate with a liquid resin using a kiss roller whose bottom portion is immersed in a liquid resin, including a step of impregnating the fiber substrate with a liquid resin from one surface thereof, by conveying the fiber substrate while maintaining contact with a circumferential surface of the kiss roller which is not immersed in resin, and performing this step at least twice in succession, and a prepreg obtained by this manufacturing method. | 11-04-2010 |
| 20100266826 | COVER TAPE FOR ELECTRONIC COMPONENT PACKING BODY AND ELECTRONIC COMPONENT PACKING BODY - A cover tape for packaging electronic components that causes no contamination of sealing bar by the outflow of cushion layer and attains superior adhesion characteristic with the carrier tape is provided. | 10-21-2010 |
| 20100258938 | SUBSTRATE AND SEMICONDUCTOR DEVICE - A substrate ( | 10-14-2010 |
| 20100258713 | LIGHT RECEIVING DEVICE AND METHOD OF MANUFACTURING LIGHT RECEIVING DEVICE - A light receiving device | 10-14-2010 |
| 20100239977 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE - A positive-type photosensitive resin composition includes (A) a polyamide resin that includes a structural unit shown by the following formula (1) and a structural unit shown by the following formula (2), and (B) a photosensitive compound, the polyamide resin (A) having a weight average molecular weight (Mw) of 5000 to 80,000, and a cured film obtained by curing the positive-type photosensitive resin composition at 250° C. having a tensile modulus of elasticity of 2.0 to 4.0 GPa and a tensile elongation of 10 to 100%. | 09-23-2010 |
| 20100227170 | EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, INSULATING RESIN SHEET, AND PROCESS FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R | 09-09-2010 |
| 20100226606 | SUBSTRATE FOR MOUNTING AN OPTICAL ELEMENT, OPTICAL CIRCUIT SUBSTRATE, AND SUBSTRATE ON WHICH AN OPTICAL ELEMENT IS MOUNTED - A substrate on which an optical element is mounted is provided, including: an optical element; an optical circuit substrate which is formed by an optical waveguide layer having a core portion and cladding portions; and an electrical circuit substrate on which is provided a mounting portion that is used for mounting the optical element, wherein the optical element is mounted on the electrical circuit substrate via the optical circuit substrate and wherein the optical circuit substrate has an optical element mounted thereon and is provided with a receptor structure having a conductive portion that conducts electricity between an electrode of the optical element and an electrode of the electrical circuit substrate. | 09-09-2010 |
| 20100204405 | RELEASE FILM - There is provided a practical release film that maintains the excellent properties of a release film using syndiotactic polystyrene, and also has excellent embeddability. | 08-12-2010 |
| 20100203307 | ADHESIVE TAPE - Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy resin, and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorus compound. This adhesive tape can be used as an interlayer material for circuit boards or multilayer flexible printed wiring boards. | 08-12-2010 |
| 20100196808 | Positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device therewith - An objective of the present invention is to achieve both prevention of scum generation in an open area and improvement in sensitivity in patterning process of the positive photosensitive resin composition. This objective can be achieved by a positive photosensitive resin composition comprising an alkali-soluble resin (A) containing an ingredient having a molecular weight of 80,000 or more in 0.5% or less and a photosensitizing agent (B), wherein the amount of said photosensitizing agent (B) is 10 parts by weight or more and 40 parts by weight or less to 100 parts by weight of said alkali-soluble resin (A). | 08-05-2010 |
| 20100193122 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE - There is provided a process for manufacturing an electronic device, comprising an electronic component (a light receiving unit | 08-05-2010 |
| 20100183985 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - A process for producing a semiconductor device includes a circuit formation step of forming circuit wiring on a semiconductor wafer using a chemically-amplified resist, and a cured film formation step of forming a cured film that protects the circuit wiring after forming the circuit wiring, the cured film being formed of a cured material of a photosensitive resin composition that comprises an alkali-soluble resin having a polybenzoxazole structure or a polybenzoxazole precursor structure, a compound that generates an acid upon exposure to light, and a solvent. The photosensitive resin composition substantially does not contain N-methyl-2-pyrrolidone. The process can suppress a T-top phenomenon or the like that may occur when forming a circuit on a semiconductor wafer using a chemically-amplified resist in the production of semiconductor devices. | 07-22-2010 |
| 20100183983 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE - A process of this invention contains forming a resin composition containing a filler and a photocurable resin over a substrate (a transparent substrate | 07-22-2010 |
| 20100183849 | RESIN SHEET FOR CIRCUIT BOARD AND PRODUCTION PROCESS THEREFOR - A resin sheet ( | 07-22-2010 |
| 20100172058 | FLEXIBLE WIRING UNIT AND ELECTRONIC DEVICE - A reciprocating motion of a head unit produces a change in front-to-back length of the lower face of a flexible substrate opposing a metal base. However, between the lower face of the flexible substrate and the upper face of the metal base opposing each other, a non-conductive substrate spacer of a predetermined plate thickness is constantly interposed. Such structure suppresses fluctuation in impedance of the flexible substrate arising from fluctuation in capacitance between the flexible substrate and the metal base, within a predetermined range. Consequently, with the structure that the moving heat unit is connected to the flexible substrate, a communication error of the flexible substrate, can be prevented. | 07-08-2010 |
| 20100166610 | Passive One-Way Valve and Microfluidic Device - This passive one-way valve is used in a connection portion between first and second flow channels, and includes: an inlet portion into which a fluid from the first flow channel flows; an elastic portion for blocking the inlet portion; a rigid portion for supporting the elastic portion from a side opposite to the inlet portion across the elastic portion; a gap portion formed around the rigid portion; and an outlet portion which is in communication with the gap portion for letting the fluid flow out into the second flow channel. Furthermore, the inlet portion is hermetically sealed by the elastic portion being pressed against the inlet portion side by the rigid portion. According to this passive one-way valve, it is possible to provide a simple and inexpensive passive one-way valve without requiring special equipment such as a vacuum pump and pressurized air, and to provide a microfluidic device using the same. | 07-01-2010 |
| 20100155964 | Adhesive Tape, Semiconductor Package and Electronics - An adhesive tape electrically connecting conductive members contains a resin, a solder powder and a curing agent having flux activity, wherein the solder powder and the curing agent having flux activity are contained in the resin. | 06-24-2010 |
| 20100147581 | FLEXIBLE SUBSTRATE AND OPENING/CLOSING ELECTRONIC DEVICE - A flexible substrate ( | 06-17-2010 |
| 20100130672 | POLYMER FOR FORMING INSULATING FILM, COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE HAVING SAME - A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film. | 05-27-2010 |
| 20100120937 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like. | 05-13-2010 |
| 20100112272 | FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE - A film for use in manufacturing semiconductor devices of the present invention includes a bonding layer having a first surface and a second surface, a first adhesive layer bonding to the second surface of the bonding layer and a second adhesive layer bonding to the first adhesive layer at a side opposite to the bonding layer wherein the second adhesive layer has an outer peripheral portion extending beyond an outer peripheral edge of the first adhesive layer. Further, the film is used in dicing a semiconductor wafer in a state that the semiconductor wafer is bonded to the first surface of the bonding layer while a wafer ring is bonded to the outer peripheral portion of the second adhesive layer wherein the bonding force A | 05-06-2010 |
| 20100101843 | INSULATING RESIN SHEET LAMINATE AND MULTI-LAYER PRINTED CIRCUIT BOARD INCLUDING INSULATING RESIN SHEET LAMINATE - Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant. | 04-29-2010 |
| 20100078830 | ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt % of film forming resin; (B) 30 to 80 wt % of curable resin; and (C) 1 to 20 wt % of curing agent having flux activity. | 04-01-2010 |
| 20100078201 | LAMINATED BODY, CIRCUIT BOARD INCLUDING LAMINATED BODY, SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING LAMINATED BODY - There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less. | 04-01-2010 |
| 20100076156 | PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, PROTECTIVE FILM, AND ELECTRONIC EQUIPMENT - The photosensitive resin composition of the present invention includes an alkali solubility resin including molecules each composed of a main chain having one end and the other end opposite to the one end, an organic group bonded to the one end thereof, the organic group having at least one unsaturated group, and a substituent group bonded to at least one of the other end of the main chain and a branch thereof, the substituent group having a cyclic chemical structure containing nitrogen atoms, and a photosensitive agent. Further, the insulating film of the present invention is composed of a cured product of the above photosensitive resin composition. Furthermore, the protective film of the present invention is composed of a cured product of the above photosensitive resin composition. Moreover, the Electronic equipment of the present invention is provided with the above protective film and insulating film. | 03-25-2010 |
| 20100075222 | SLURRY FOR SECONDARY BATTERY ELECTRODE, ELECTRODE FOR SECONDARY BATTERY, PROCESS FOR PRODUCTION OF ELECTRODE FOR SECONDARY BATTERY, AND SECONDARY BATTERY - There is provided a slurry for a secondary battery electrode and an electrode for a secondary battery that produce satisfactory charge-discharge characteristics for secondary batteries, as well as a secondary battery that exhibits satisfactory charge-discharge characteristics. | 03-25-2010 |
| 20100065317 | PREPREG WITH CARRIER AND PROCESS FOR MANUFACTURING SAME, MULTI-LAYERED PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable. | 03-18-2010 |
| 20100062378 | OPTICAL WAVEGUIDES AND METHODS THEREOF - Embodiments in accordance with the present invention provide waveguide structures and methods of forming such structures where core and laterally adjacent cladding regions are defined. Some embodiments of the present invention provide waveguide structures where core regions are collectively surrounded by laterally adjacent cladding regions and cladding layers and methods of forming such structures. | 03-11-2010 |
| 20100062273 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME - A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided. | 03-11-2010 |
| 20100061688 | OPTICAL WAVEGUIDES AND METHODS THEREOF - Embodiments in accordance with the present invention provide waveguide structures and methods of forming such structures where core and laterally adjacent cladding regions are defined. Some embodiments of the present invention provide waveguide structures where core regions are collectively surrounded by laterally adjacent cladding regions and cladding layers and methods of forming such structures. | 03-11-2010 |
| 20100044648 | CONDUCTIVE PASTE - This is to provide a conductive paste with higher electroconductivity containing, as raw materials: a metallic powder; a thermosetting resin; and a flux-activating compound having a carboxyl group and a phenolic hydroxyl group, which is applicable to the fine pitch-utilization. | 02-25-2010 |
| 20100044390 | BIOCHEMICAL CONTAINER - A biochemical container is provided, which can open a cover member shutting a container member and can release a tightly sealed condition, without a need for displacing the outer edge section of the cover member. In the present invention, an opening in an end of a container member | 02-25-2010 |
| 20100044090 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler. | 02-25-2010 |
| 20100038762 | CIRCUIT BOARD MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit board | 02-18-2010 |
| 20100032192 | INTERLAYER DIELECTRIC FILM WITH CARRIER MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD THEREWITH - An objective of this invention is to provide an interlayer dielectric film with a carrier material used in a multilayer printed circuit board, which exhibits sufficient rigidity for a thin multilayer printed circuit board. | 02-11-2010 |
| 20100012362 | RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD - The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance. | 01-21-2010 |
| 20100009149 | TRANSPARENT COMPOSITE SHEET - A transparent composite sheet that has a small linear expansion coefficient, excellent transparency/heat resistance, minimal optical anisotropy, and a high degree of flatness, and that also has excellent impact resistance and flexibility; and a substrate for a display element. A transparent composite sheet obtained by curing a composite composition comprising a glass filler and a transparent resin composition that includes an alicyclic epoxy resin indicated by Chemical Formula (1) below and/or an alicyclic epoxy resin indicated by Chemical Formula (2) below; at least one type of compound other than the alicyclic epoxy resin having a cationic-polymerizable functional group; and a curing agent; wherein the admixture ratio of the alicyclic epoxy resin and the compound having a cationic-polymerizable functional group is preferably 99:1 to 70:30. | 01-14-2010 |
| 20100004379 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE - The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction. | 01-07-2010 |
| 20090318610 | ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES - There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. | 12-24-2009 |
| 20090306291 | SUGAR CHAIN-CAPTURING SUBSTANCE AND USE THEREOF - The present invention provides a method for preparing a sample characterized by binding a substance A containing a hydrazide group to a sugar chain and/or a sugar derivative via hydrazone formation between the hydrazide group of the substance A and the reducing end of the sugar chain and/or the sugar derivative thereby to enable the separation and purification of the sugar chain and/or the sugar derivative for an analytical sample from a biological sample containing the sugar chain and/or the sugar derivative by a simple operation. | 12-10-2009 |
| 20090273125 | MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR TUBULAR RESIN FILM - A manufacturing apparatus and manufacturing method are provided for manufacturing stably from a thermoplastic resin a resin film product having a small and uniform thickness and smooth surfaces, which has been impossible with a conventional tube extruding method or and blown film extrusion method. It comprises a heating extruder ( | 11-05-2009 |
| 20090272726 | Method for Manufacturing Display Apparatus and Manufacturing Apparatus of the Display Apparatus - [PROBLEM] A thin film laminated substrate is cut by a laser beam under certain conditions, so that a cut surface which is sufficient for a display apparatus can be obtained without damaging the thin film laminated substrate, and the cutting is enabled by a low-output inexpensive apparatus, so that a reduction in cost can be expected. | 11-05-2009 |
| 20090215943 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components. | 08-27-2009 |
| 20090170026 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED LAYER, PROTECTING LAYER, INSULATING LAYER AND SEMICONDUCTOR DEVICE AND DISPLAY THEREWITH - A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), | 07-02-2009 |
| 20090084597 | CIRCUIT BOARD AND CONNECTION SUBSTRATE - There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion. | 04-02-2009 |
| 20090068584 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED LAYER, PROTECTING LAYER, INSULATING LAYER AND SEMICONDUCTOR DEVICE AND DISPLAY THEREWITH - A positive-type photosensitive resin composition comprises (A) an alkali-soluble resin having at least a polybenzoxazole precursor structure, (B) a sensitizer, and (C) a cyclic compound having an alcoholic hydroxyl group. A protecting layer and an insulating layer include a cured layer which is a cured product of the positive-type photosensitive resin composition. A semiconductor device and a display device include the cured layer. According to the present invention, a highly reliable positive-type photosensitive resin composition can be obtained even when cured at a low temperature. | 03-12-2009 |
| 20090017308 | INTERMEDIATE LAYER MATERIAL AND COMPOSITE LAMINATE - There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (α1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C. | 01-15-2009 |
| 20080277805 | Semiconductor Device - Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like. | 11-13-2008 |
| 20080246008 | SEMICONDUCTOR-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175° C. and a measurement frequency of about 100 Hz, minimum ion viscosity appears at about 5 seconds or later and within about 40 seconds from a measurement starting point. The minimum ion viscosity is at least about 4.0 and at most about 7.0. A maximum slope of the ion viscosity appears at about 10 seconds or later and within about 60 seconds from the measurement starting point. The maximum slope is at least about 2.0 and at most about 6.0. | 10-09-2008 |
| 20080206548 | Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device - A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor. | 08-28-2008 |
