SUMITOMO BAKELITE CO., LTD. Patent applications |
Patent application number | Title | Published |
20160137772 | HYDROPHOBIC INORGANIC PARTICLES, RESIN COMPOSITION FOR HEAT DISSIPATION MEMBER, AND ELECTRONIC COMPONENT DEVICE - Disclosed are hydrophobic inorganic particles obtained by surface-modifying inorganic particles with an organic compound, in which with respect to the hydrophobic inorganic particles subjected to a washing step, a weight reduction rate is calculated under measurement conditions described below, and the number of molecules of the organic compound per 1 nm | 05-19-2016 |
20160129675 | COVER TAPE FOR PACKAGING ELECTRONIC PART - The object of the present invention is to provide a cover tape for packaging an electronic part which enables the reduction of the production time, and decreases the defective fraction due to the temperature variation of the sealing trowel, the present invention provides a cover tape for packaging an electronic part which includes a base layer and a sealant layer, and is closely adhered to a carrier tape, wherein the sealant layer is made of a resin composition; a main component in the resin composition has a melting point of 100° C. or less; a peeling strength A under fixed measurement conditions after heat-sealing to a polycarbonate sheet through the sealant layer at 220° C. for 0.015 seconds and a peeling strength C under the fixed measurement conditions after heat-sealing to a polycarbonate sheet through the sealant layer at 180° C. for 0.015 seconds satisfy conditional expressions 1 and 2 below; and after peeling, a part of the sealant layer remains on a surface of the carrier tape to which the sealant layer is closely adhered; Conditional expression 1: 20 (g)≦A≦70 (g) and Conditional expression 2: 0.43≦C/A≦1.0. | 05-12-2016 |
20160122550 | HYDROPHOBIC INORGANIC PARTICLES, RESIN COMPOSITION FOR HEAT DISSIPATION MEMBER, ELECTRONIC COMPONENT DEVICE AND HYDROPHOBIC INORGANIC PARTICLE MANUFACTURING METHOD - Disclosed are hydrophobic inorganic particles obtained by surface-modifying inorganic particles with an organic compound, in which, when 200 parts by mass of ethanol is added to 1 part by mass of the hydrophobic inorganic particles, ultrasonic washing is performed for 10 minutes, solid-liquid separation is performed, and 0.1 g of the dried hydrophobic inorganic particles are dispersed in 40 g of a liquid mixture obtained by mixing hexane and water in a volume ratio of 1:1, 50% by mass or greater of the hydrophobic inorganic particles are transformed to a phase in which hexane is included. | 05-05-2016 |
20160122503 | RESIN COMPOSITION FOR THERMALLY CONDUCTIVE SHEET, BASE MATERIAL-ATTACHED RESIN LAYER, THERMALLY CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE - A resin composition for a thermally conductive sheet includes a thermosetting resin and a filler dispersed in the thermosetting resin. The filler includes secondary agglomerated particles satisfying the following conditions: a void is formed in the central portion; a communicating pore which begins from the void and communicates with the outer surface of the secondary agglomerated particle is formed; and the ratio of the average pore diameter of the communicating pores to the average void diameter of the voids is equal to or more than 0.05 and equal to or less than 1.0. | 05-05-2016 |
20160113705 | HIGH-FREQUENCY TREATMENT TOOL - The high-frequency treatment tool includes a flexible tube inserted into a body cavity; an operating wire inserted through the flexible tube to be movable back and forth; a treatment part arranged on a distal end of the operating wire and treats biological tissue by applying a high-frequency current; a main body that fixes a base end of the flexible tube; a slider-fixing part that fixes a base end of the operating wire guided from the base end of the flexible tube and slides the operating wire in an axis direction with respect to the main body; and a slider-gripping part provided to encircle at least a portion of an outer peripheral surface of the slider-fixing part and slides the slider-fixing part by the operation of a user. The slider-fixing part is unrotatably coupled to the main body and the slider-gripping part is rotatably coupled to the slider-fixing part. | 04-28-2016 |
20160102109 | HYDROPHOBIC INORGANIC PARTICLES, RESIN COMPOSITION FOR HEAT DISSIPATION MEMBER, AND ELECTRONIC COMPONENT DEVICE - Disclosed are hydrophobic inorganic particles obtained by surface-modifying inorganic particles with an organic compound, in which the organic compounds are one or more kinds selected from compounds included in Groups (i) to (v): (1) amine and carboxylic acid which are monobasic acid having 8 or more carbon atoms (in the case of carboxylic acid, carbons in the carboxyl group are excluded) and having a straight chain or a branched chain; (ii) amine and carboxylic acid which are dibasic acid having 6 or more carbon atoms (in the case of carboxylic acid, carbons in the carboxyl group are excluded) and having a straight chain or a branched chain; (iii) amine and carboxylic acid which are monobasic acid having a straight chain or a branched chain including a carbon-carbon double bond; (iv) amine and carboxylic acid which are monobasic acid or dibasic acid having an aromatic ring; and (v) alcohol or phenol compound having 6 or more carbon atoms. | 04-14-2016 |
20160060424 | METHOD OF MANUFACTURING RESIN MOLDED ARTICLE, METHOD OF MANUFACTURING RESIN COMPOSITION, RESIN MOLDED ARTICLE, RESIN COMPOSITION, RESIN POWDER HAVING LOW DUST GENERATION PROPERTY, AND METHOD OF REDUCING DUST GENERATION OF RESIN - A method of manufacturing a resin molded article includes a step of preparing a resin powder having low dust generation property by adding a liquid paraffin to a thermosetting resin, and a step of obtaining a resin molded article by heating and kneading the resin powder having low dust generation property, in which the step of preparing the resin powder having low dust generation property includes a step in which the thermosetting resin is melted and the liquid paraffin is added to the melted thermosetting resin to be stirred and mixed. | 03-03-2016 |
20160053116 | POLYMER SOLUTION, POLYMER FILM, STACKED COMPOSITE, DISPLAY ELEMENT, OPTICAL ELEMENT, ILLUMINATION ELEMENT, AND PRODUCTION METHOD THEREFOR - In one aspect, a polymer film having improved mechanical properties is provided. In one aspect, a polymer solution containing a solvent and a polymer that contains either a structural unit having a benzoxazole precursor structure or a structural unit having a benzoxazole structure is provided. | 02-25-2016 |
20160051796 | CATHETER, CATHETER MANIPULATION PART, AND CATHETER MANUFACTURING METHOD - A catheter of the invention includes an elongated flexible tubular main body; a plurality of manipulation wires inserted through the tubular main body and having tips connected to a distal part of the tubular main body; a manipulation-part main body provided at a base end of the tubular main body; and a bending manipulation part. The bending manipulation part has an engagement part engaging with base ends of the manipulation wires, and individually applies pulling force to the plurality of manipulation wires through pulling operations so as to bend the distal part of the tubular main body. The bending manipulation part is provided so as to be movable with respect to the manipulation-part main body. The path lengths of the plurality of manipulation wires from the tips thereof to the engagement part are simultaneously increased or decreased when the bending manipulation part and the manipulation-part main body move relative to each other. | 02-25-2016 |
20160047978 | OPTICAL WAVEGUIDE AND ELECTRONIC DEVICE - A optical waveguide comprising a core layer having a core portion; a first clad layer formed on one surface of the core layer; a second clad layer formed on another surface of the core layer; and a hollow section penetrating through the second clad layer and the core layer, and extending to a middle portion of the first clad layer, wherein a part of an inner wall surface at the hollow section is configured as an inclined plane which is inclined relative to and intersects with a plane including an interfacial plane between the core layer and the first clad layer, and a minimum radius of curvature at a connection between the inclined plane and other parts of the inner wall surface continuously extending from the inclined plane is 1 to 500 μm as measured at the plane including the interfacial plane. | 02-18-2016 |
20160046108 | MELAMINE RESIN METAL DECORATIVE PANEL AND METHOD OF MANUFACTURING MELAMINE RESIN METAL DECORATIVE PANEL - A melamine resin metal decorative panel ( | 02-18-2016 |
20160025163 | BRAKE PAD AND CALIPER DEVICE - A brake pad | 01-28-2016 |
20160005677 | THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE - A thermally conductive sheet includes a thermosetting resin and an inorganic filler material. When a pore diameter distribution is measured through mercury intrusion technique for the inorganic filler material, a pore diameter distribution curve of the inorganic filler material has a first maximum value in the range where the pore diameter R is greater than or equal to 0.1 μm and less than or equal to 5.0 μm, and a second maximum value in the range where the pore diameter R is greater than or equal to 10 μm and less than or equal to 30 μm, and the difference between a second pore diameter at the second maximum value and a first pore diameter at the first maximum value is greater than or equal to 9.9 μm and less than or equal to 25 μm. | 01-07-2016 |
20160002520 | THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE - A thermally conductive sheet includes a thermosetting resin (A) and an inorganic filler material (B) which is dispersed in the thermosetting resin (A). In the thermally conductive sheet, when a pore diameter distribution is measured through mercury intrusion technique for the inorganic filler material (B) that is included in an incineration residue after a cured product of the thermally conductive sheet is heated at 700° C. for four hours and is incinerated, a pore diameter distribution curve, that is measured through the mercury intrusion technique and is plotted with a pore diameter R as a horizontal axis and a logarithmic derivative of a pore volume (dV/d log R) as a vertical axis, has a peak (P) in the range where the pore diameter R is greater than or equal to 1.0 μm and is less than or equal to 10.0 μm, and the peak (P) is configured of two or more overlapping peaks. | 01-07-2016 |
20160002445 | THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE - A thermally conductive sheet includes a thermosetting resin and an inorganic filler material dispersed in the thermosetting resin. Measuring a pore diameter distribution through mercury intrusion technique for the inorganic filler material included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700° C. for four hours, a porosity of the inorganic filler material represented as 100×b/a is greater than or equal to 40% and less than or equal to 65% given that a is the volume of particles of the inorganic filler material included in the incineration residue, and b is the volume of voids in the particles of the inorganic filler material included in the incineration residue. An average pore diameter of the inorganic filler material included in the incineration residue is greater than or equal to 0.20 μm and less than or equal to 1.35 μm. | 01-07-2016 |
20160002439 | APPARATUS, COMPOSITION FOR ADHESIVE, AND ADHESIVE SHEET - An apparatus ( | 01-07-2016 |
20160001040 | MEDICAL INSTRUMENT, CATHETER, AND METHOD FOR PRODUCING MEDICAL INSTRUMENT - A tubular body includes an elongated inner layer that demarcates a main lumen; a wire reinforcing layer that is formed by winding a reinforcing wire around the inner layer; a resinous elongated sub-tube that is arranged so as to extend along a longitudinal direction of the main lumen outside the wire reinforcing layer and demarcates a sub-lumen having a smaller diameter than the main lumen; a resinous outer layer that sheaths the wire reinforcing layer and the sub-tube; and a retaining wire. An operating wire is movably inserted through the sub-lumen, and has a tip connected to a distal portion of the tubular body. An operating part is operated to pull the operating wire to bend the distal portion of the tubular body. The retaining wire is sheathed by the outer layer, and winds together the sub-tube and the wire reinforcing layer. In a medical instrument (catheter), the retaining wire is in contact with a peripheral surface of the sub-tube on both an external diameter side and an outer surface of the wire reinforcing layer. | 01-07-2016 |
20150374358 | REPEATING-TYPE ORGAN-FASTENING TOOL - There is provided a repeated type organ fixing instrument having a plurality of suturing tools. The organ fixing instrument includes a rod-shaped engaging portion, a suture fixed to the engaging portion, a puncture needle for housing a plurality of the engaging portions. A plurality of the engaging portions are extruded one by one from the puncture needle by the operation of a operation unit main body. The suture fixed to at least one of the plurality of engaging portions is inserted within the inside of the puncture needle and wherein the other suture is derived from the inside to the outside of the puncture needle. | 12-31-2015 |
20150371923 | HEAT CONDUCTIVE SHEET AND STRUCTURE - Provided is a heat conductive sheet obtained by including a heat conductive filler in a cured organic resin, in which the heat conductive filler is made of multiple particles obtained by coating surfaces of plastic particles with a heat conductive material, and a coefficient of variation (CV) value of particle diameters of the particles, which is computed using Equation (1) described below, is equal to or less than 10%. | 12-24-2015 |
20150369312 | BRAKE PAD AND CALIPER DEVICE - A brake pad | 12-24-2015 |
20150366054 | METAL FOIL-CLAD SUBSTRATE, CIRCUIT BOARD AND ELECTRONIC-COMPONENT MOUNTING SUBSTRATE - A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting an electronic component is provided. The metal foil-clad substrate includes a metal foil having a one surface, a resin layer formed on the one surface of the metal foil; an insulating part formed on a surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or solidified material of a second resin composition containing a resin material. | 12-17-2015 |
20150366047 | METAL FOIL-CLAD SUBSTRATE, CIRCUIT BOARD AND HEATING-ELEMENT MOUNTING SUBSTRATE - A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting a heat element is provided. The metal foil-clad substrate includes: a metal foil having one surface; a resin layer formed on the one surface of the metal foil; a heat radiation metal plate formed on a surface of the resin layer opposite to the metal foil; an insulating part formed on the surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or a solidified material of a second resin composition containing a resin material. | 12-17-2015 |
20150351225 | METAL-BASED MOUNTING BOARD AND METHOD OF MANUFACTURING METAL-BASED MOUNTING BOARD - A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate through which a through-hole is provided along a thickness direction thereof, an insulating film provided on the metal substrate and a metal film provided on the insulating film, wherein the through-hole opens on a surface of the metal film on the opposite side of the metal substrate via the insulating film and the metal film; an electronic component connected to the metal film, the electronic component including an electronic component main body and a conductive leg portion electrically connected to the electronic component main body and inserted into the through-hole; and an insulating portion provided at least between the leg portion locating inside the through-hole and the metal substrate, and having a function of preventing them from making contact with each other. | 12-03-2015 |
20150351224 | METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD - A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region. | 12-03-2015 |
20150351223 | METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD - The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board. Within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region. A region other than the first region is defined as a second region. At least one groove is provided within the first region so as to surround the electronic component in a planar view of the metal-based mounting board. | 12-03-2015 |
20150342052 | CIRCUIT SUBSTRATE, ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND METHOD FOR PRODUCING CIRCUIT SUBSTRATE - A circuit substrate | 11-26-2015 |
20150333316 | NEGATIVE-ELECTRODE MATERIAL, NEGATIVE-ELECTRODE ACTIVE MATERIAL, NEGATIVE ELECTRODE, AND ALKALI METAL ION BATTERY - A negative-electrode material of the present invention is a carbonaceous negative-electrode material used for an alkali metal ion battery and an average layer spacing d | 11-19-2015 |
20150316845 | PHOTOSENSITIVE RESIN MATERIAL AND RESIN FILM - A photosensitive resin material of the invention is a photosensitive resin material used to form a permanent film including one or more selected from a novolac-type phenol resin, a phenol aralkyl resin, and a hydroxystyrene resin as an alkali-soluble resin (A) and a photosensitive diazoquinone compound as a photosensitizing agent (B), in which a content of iron with respect to all non-volatile components, which is measured through flameless atomic absorption spectroscopy, is equal to or more than 0.005 ppm and equal to or less than 80 ppm, and non-ionic iron is included as the iron. | 11-05-2015 |
20150314108 | MEDICAL DEVICE - There is provided a medical device which has favorable operation wire, operability and has a sufficiently reinforced structure around the operation wire. The medical device includes a medical device body; a sub-lumen which is disposed inside the medical device body so as to extend along a longitudinal direction of the medical device body; an operation wire which is inserted into the sub-lumen and extends along the longitudinal direction of the medical device body; and a first tubular reinforcing layer and a second tubular reinforcing layer. The second reinforcing layer is disposed apart from the first reinforcing layer so as to surround the periphery of the first reinforcing layer, and the space between the first reinforcing layer and the second reinforcing layer is filled with a part of a resin constituting the medical device body. The sub-lumen is disposed inside the part of the resin constituting the medical device body. | 11-05-2015 |
20150301290 | OPTICAL WIRING PART AND ELECTRONIC DEVICE - The object of the present invention is to provide an optical wiring part which can connect the optical waveguide and another optical element with high optical coupling efficiency while inhibiting the decrease of the transmission loss, and an electronic device with high reliability including the optical wiring part, the present invention provides an optical wiring part including a tape-shaped optical waveguide and a ferrule having a penetration hole which is formed from a base end to a tip end of the ferrule, and a part of the optical waveguide in a longitudinal direction is inserted into the penetration hole, wherein at least one main surface of two main surfaces of the optical waveguide is fixed to an inner wall of the penetration hole, and there is a clearance between the inner wall of the penetration hole and two side surfaces of the optical waveguide. | 10-22-2015 |
20150283793 | METAL RESIN COMPOSITE BODY AND MANUFACTURING METHOD OF METAL RESIN COMPOSITE BODY - In a metal resin composite body ( | 10-08-2015 |
20150283356 | METHOD FOR MANUFACTURING MEDICAL INSTRUMENT, AND MEDICAL INSTRUMENT - A method for manufacturing a catheter includes a process of supplying a resin material in a melted state to the periphery of a core wire ( | 10-08-2015 |
20150274929 | SILICONE RUBBER-BASED CURABLE COMPOSITION - A silicone rubber-based curable composition includes vinyl siloxane, hydrogen siloxane and silica particles, where the content of the silica particles is 26.0 wt % or more and less than 40.0 wt %, and when cured, it can form a silicone rubber exhibiting a physical property of a JIS K6253 (2006) type A durometer hardness of 40.0 mN or more. Further a method for manufacturing a silicone rubber-based curable composition includes a step of obtaining a kneaded product by kneading vinyl siloxane, hydrogen siloxane, silica particles, a silane coupling agent and a catalyst, where the content of the silica particles in the kneaded product is in the range of 40 to 84 parts by weight relative to 100 parts by weight as the total amount of the vinyl siloxane and the hydrogen siloxane. | 10-01-2015 |
20150273795 | METAL RESIN COMPOSITE BODY AND MANUFACTURING METHOD OF METAL RESIN COMPOSITE BODY - In a metal resin composite body ( | 10-01-2015 |
20150253316 | MEMBRANE SUPPORT FOR DETECTING SUGAR CHAIN-RECOGNIZING MOLECULE - Provided are substance and method enabling quick and easy detection of a sugar chain-recognizing molecule with high sensitivity in any place. Specifically, provided are: a membrane support for immunochromatography, the membrane support comprising a detection line on which a protein having the sugar chain binding thereto is immobilized; a device comprising the membrane support; and a method using these for detecting by immunochromatography a molecule capable of recognizing the sugar chain. | 09-10-2015 |
20150252132 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE - There is provided a polymer including a structural unit represented by the following Formula (1a), a structural unit represented by the following Formula (1b) and a structural unit represented by the following Formula (1c) | 09-10-2015 |
20150247289 | LAMINATE AND COMPOSITE - According to the present invention, there is provided a laminate ( | 09-03-2015 |
20150239197 | ARTICLE AND LAMINATE - According to the present invention, there is provided an article including: a main body portion ( | 08-27-2015 |
20150238179 | MEDICAL TREATMENT TOOL - A medical treatment tool ( | 08-27-2015 |
20150232697 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, ILLUMINATION ELEMENT OR SENSOR ELEMENT - In an aspect, the present disclosure relates to a polyamide solution including aromatic polyamide and a solvent. A dimension change gap between a cast film of the polyamide solution and the cast film after being subjected to a heat treatment is not more than a predetermined value. In another aspect, the present disclosure relates to a method for manufacturing a display element, an optical element, an illumination element or a sensor element, including a step of forming a polyamide film by using the polyamide solution. | 08-20-2015 |
20150221947 | NEGATIVE-ELECTRODE MATERIAL, NEGATIVE-ELECTRODE ACTIVE MATERIAL, NEGATIVE ELECTRODE, AND ALKALI METAL ION BATTERY - A carbonaceous negative-electrode material for an alkali metal ion battery is provided in which an average layer spacing d | 08-06-2015 |
20150219641 | ANALYSIS CARRIER AND MANUFACTURING METHOD AND USE METHOD THEREFOR - An analysis carrier for trapping a biologically active substance includes a carrier body having a carrier surface on which one or more polymers are immobilized. The polymer includes a first repeating unit and a second repeating unit, the first repeating unit has a side chain including a functional group of a betaine structure, and the second repeating unit has a side chain whose terminal group is an active ester group. | 08-06-2015 |
20150217542 | MEDICINE PACKAGING SHEET AND MEDICINE PACKAGE - One object of the present invention is to provide a medicine packaging sheet, and a medicine package, which do not need to enclose an oxygen absorbent in the package in addition to add the oxygen absorbent in the package material, and which have excellent oxygen absorbing properties and oxygen barrier properties. The present invention provides a medicine packaging sheet including a barrier layer and an oxygen absorbing layer, wherein the oxygen absorbing layer is composed of a resin composition including a base resin, an oxygen absorbing resin, and a reaction accelerator. | 08-06-2015 |
20150203744 | RESIN COMPOSITION, COATED PARTICLES, INJECTION MATERIAL AND METHOD FOR INJECTING INJECTION MATERIAL INTO FRACTURE - A resin composition is used for forming a surface layer coating at least a part of an outer surface of a particle. The particle is adapted to be packed into a fracture formed in a subterranean formation, and contains a thermosetting resin and a hydrophilic polymer. It is preferred that the resin composition further contains a surfactant. According to the present invention, it is possible to provide an effect of preventing pieces of core particles from being scattered due to the action of a thermo-setting resin and an effect of improving compatibility with respect to water (that is, fluid repellent with respect to hydrocarbon) due to the action of a hydrophilic polymer in a synergistic manner. This increases conductivity of packed spaces of a subterranean formation (that is, fractures of the subterranean formation) in which coated particles are packed. | 07-23-2015 |
20150202409 | MEDICAL INSTRUMENT, AND MEDICAL-INSTRUMENT PRODUCTION METHOD - The present invention relates to a medical instrument capable of enhancing the slidability of an operating wire in a lumen. The medical instrument (for example, a catheter ( | 07-23-2015 |
20150194376 | SEMICONDUCTOR DEVICE - According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device ( | 07-09-2015 |
20150184119 | MICROWELL PLATE - A microwell plate includes a plate body having a surface on which wells are formed. Each of the wells has an open end, a bottom end and an interior space extended from the open end to the bottom end. Each of the wells has, in the interior space, an opening-side portion, a bottom-side portion and a transition portion which is continuously connected to the opening-side portion and to the bottom-side portion, the opening-side portion has a polygonal cross section in parallel to the surface of the plate body, and the bottom-side portion has cross sections in parallel to the surface which have areas that gradually decrease toward the bottom end. | 07-02-2015 |
20150174004 | TABLET PACKAGING BODY - A tablet packaging body ( | 06-25-2015 |
20150158979 | LIQUID RESOL-TYPE PHENOLIC RESIN - A liquid resol-type phenolic resin obtained by reacting a phenol (A), and a secondary and/or tertiary alkylamine compound (B) in the presence of a basic catalyst. The nitrogen content relative to the total weight of the liquid resol-type phenolic resin is preferably from 3 to 30% by weight. Further, the secondary and/or tertiary alkylamine compound (B) is preferably hexamethylenetetramine Moreover, the molar ratio between the phenol (A) and the secondary and/or tertiary alkylamine compound (B) preferably satisfies (B)/(A)=0.13 to 0.35. | 06-11-2015 |
20150152258 | RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME - The present invention provides a resin composition for encapsulating electronic elements that contains a phenol resin curing agent, an epoxy resin, and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C.; a resin composition for encapsulating electronic components that contains an epoxy resin and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C.; and a resin composition for encapsulating electronic components that contains a phenol resin curing agent, an epoxy resin, and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C., in which a glass transition temperature (Tg) of a cured material of the encapsulating resin composition is equal to or higher than 200° C., and when the cured material is heated for 1,000 hours at 200° C. in the atmosphere, a weight reduction rate of the cured material becomes equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition. | 06-04-2015 |
20150151087 | SHEATH FOR GASTROSTOMA, SHEATHED DILATOR, SHEATH FOR GASTROSTOMA WITH INSERTION AID, GASTROSTOMY CATHETER KIT, AND METHOD OF SPLITTING SHEATH FOR GASTROSTOMA - The present invention provides a sheath for gastrostoma ( | 06-04-2015 |
20150140652 | VESSEL FOR CULTURING HUMAN ES CELLS - Provided are a culture vessel with which an embryonic body can be formed efficiently from human embryonic stem cells, and a method for culturing human embryonic stem cells using the vessel. There is provided a vessel for culturing human embryonic stem cells, the culture vessel having two or more wells ( | 05-21-2015 |
20150099131 | SOLUTION OF AROMATIC POLYAMIDE FOR MANUFACTURING DISPLAY ELEMENT, OPTICAL ELEMENT, ILLUMINATION ELEMENT OR SENSOR ELEMENT - The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200° C. to 450° C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less. | 04-09-2015 |
20150087501 | BASE MATERIAL-CARRIED CATALYST AND METHOD OF MANUFACTURING BASE MATERIAL-CARRIED CATALYST - A base material-carried catalyst including a base material, a cured body of a thermosetting resin formed on the surface of the base material, fine particles having catalytic activity carried on the surface of the cured body, in which the thermosetting resin has a phenolic hydroxyl group. | 03-26-2015 |
20150079506 | AMINE TREATED MALEIC ANHYDRIDE POLYMERS, COMPOSITIONS AND APPLICATIONS THEREOF - Disclosed herein are various amine treated maleic anhydride containing polymers and compositions thereof, which are useful for forming self-imageable films. In some embodiments, such polymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such maleic anhydride-type repeating units are either ring-opened or have been transformed into maleimide repeat units. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices. | 03-19-2015 |
20150065756 | LIQUID RESOL-TYPE PHENOLIC RESIN AND WET PAPER FRICTION MATERIAL - A straight-chain unsaturated hydrocarbon group having equal to or more than 10 carbon atoms is bonded to at least one or more of meta positions of all of phenol structure units. | 03-05-2015 |
20150064738 | CULTURE VESSEL FOR FORMING AGGREGATED CELL MASS - The present invention provides a culture vessel for forming an aggregated cell mass which has at least two wells, wherein the wells are made from a light-shielding member and an inner surface of the wells is subjected to treatment to impart cellular non-adhesiveness. | 03-05-2015 |
20150060889 | SEMICONDUCTOR DEVICE, DIE ATTACH MATERIAL, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a semiconductor device ( | 03-05-2015 |
20150054146 | SEMICONDUCTOR DEVICE - A semiconductor device of the present invention includes a semiconductor element having an electrode pad; a substrate over which the semiconductor element is mounted and which has an electrical bonding part; and a bonding wire electrically connecting the electrode pad to the electrical bonding part, wherein a main metal component of the electrode pad is the same as or different from a main metal component of the bonding wire, and when the main metal component of the electrode pad is different from the main metal component of the bonding wire, a rate of interdiffusion of the main metal component of the bonding wire and the main metal component of the electrode pad at a junction of the bonding wire and the electrode pad under a post-curing temperature of an encapsulating resin is lower than that of interdiffusion of gold (Au) and aluminum (Al) at a junction of aluminum (Al) and gold (Au) under the post-curing temperature. | 02-26-2015 |
20150051541 | MEDICAL INSTRUMENT AND METHOD OF MANUFACTURING MEDICAL INSTRUMENT - Provided is a medical instrument which can reliably protect a sub-lumen and a method of manufacturing the medical instrument. In such a medical instrument, a catheter includes a resin tubular main body (sheath), in which a main lumen and a sub-lumen which is disposed on an outer peripheral side of the main lumen and extends along a longitudinal direction of the main lumen, are formed; a reinforcement layer which is disposed between the main lumen and the sub-lumen and surrounds the main lumen; and a wire which is disposed further on an outer peripheral surface side of the tubular main body than the sub-lumen and is disposed so as to surround the outer periphery of the main lumen. The wire is embedded in the tubular main body and supports the outer peripheral surface of the tubular main body. | 02-19-2015 |
20150050868 | HOLDER FOR POLISHED WORK, AND LAMINATE PLATE USED FOR SAME - The invention provides a holder for a polished work in which the warpage suppression or plate thickness accuracy of the holder for a polished work is improved, the generation of scratches in a polished work is suppressed so as to improve the abrasion resistance, and furthermore, economic advantages are provided. The holder for a polished work of the invention includes a first resin layer produced by impregnating a first resin composition into a first fiber base material, and heating and pressurizing the first fiber base material as an outermost layer, the first fiber base material is a glass fiber base material, and a structure derived from a resin having a novolac skeleton is included in a proportion of 50 mass % or more in the first resin layer excluding the first fiber base material. | 02-19-2015 |
20150031574 | METHOD FOR CLASSIFICATION OF TEST BODY FLUID SAMPLE - A method for classifying test body fluid samples into either of two groups selected from four groups consisting of chronic hepatitis C, chronic hepatitis B, non-alcoholic steatohepatitis (NASH) and normal liver, is provided. In one or plural embodiment(s), it relates to a method for classifying test body fluid samples into either of two groups selected from four groups consisting of chronic hepatitis C, chronic hepatitis B, non-alcoholic steatohepatitis (NASH) and normal liver. The method includes a measurement of an expression level of the one or plural non-coding RNA(s) in the test body fluid sample. | 01-29-2015 |
20150020952 | MELAMINE RESIN DECORATIVE SHEET AND METHOD OF REFURBISHING FINISHED SURFACE - A melamine resin decorative sheet of the present invention includes a laminate structure of a surface layer and a core layer, in which the surface layer is configured of a surface layer material composed of a surface layer base material which carries a resin containing a melamine resin on a first surface side that serves as a design surface and which carries a solid content of a thermoplastic emulsion resin on a second surface side that contacts with the core layer, and in which the core layer is configured of a heat dissipative material layer. | 01-22-2015 |
20150017539 | CARBON MATERIAL FOR LITHIUM ION SECONDARY BATTERY, NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY - A carbon material for lithium ion secondary batteries of the invention contains amorphous carbon and graphite. | 01-15-2015 |
20150016794 | OPTICAL WAVEGUIDE, OPTICAL WIRING COMPONENT, OPTICAL WAVEGUIDE MODULE AND ELECTRONIC DEVICE - A core layer ( | 01-15-2015 |
20150014867 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - Provided is a resin composition for encapsulation including: a curing resin; and an inorganic filler, in which the resin composition encapsulates a semiconductor element provided over a substrate and fills a gap between the substrate and the semiconductor element, and when a particle diameter at a cumulative frequency of 5% in order from the largest particle diameter in a volume particle diameter distribution of particles contained in the inorganic filler is represented by R | 01-15-2015 |
20150010460 | METHOD OF PRODUCING CARBON MATERIAL FOR LITHIUM ION SECONDARY BATTERY NEGATIVE ELECTRODE, MIXTURE FOR LITHIUM ION SECONDARY BATTERY NEGATIVE ELECTRODE, LITHIUM ION SECONDARY BATTERY NEGATIVE ELECTRODE, AND LITHIUM ION SECONDARY BATTERY - The present invention provides a method of producing a carbon material for lithium ion secondary battery negative electrode, the carbon material containing a plurality of carbon particles, the method comprising the steps of: preparing a resin dispersion material containing a dispersion medium and a plurality of resin particles which are substantially insoluble in the dispersion medium; ejecting a plurality of liquid droplets of the resin dispersion material using a liquid droplet ejecting method, the liquid droplets each containing the dispersion medium and at least one of the resin particles; and heat-treating the plurality of liquid droplets so that the resin particle contained in each liquid droplet is carbonized while removing the dispersion medium to thereby obtain at least one of the carbon particles from each liquid droplet. | 01-08-2015 |
20140371374 | MOLDING MATERIAL - Provided is a molding material which is well-balanced and superior in strength, toughness, and elastic modulus and has high molding characteristics. | 12-18-2014 |
20140356636 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - This disclosure, in one or plurality of embodiments, relates to a solution of polyamide from which a cast film with low CTE and Rth can be achieved. This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; inorganic filler; and a solvent. This disclosure, viewed from one aspect, relates to a laminated composite material, comprising a base, and a polyamide resin layer: wherein the polyamide resin layer is laminated to one surface of the base; and wherein the polyamide resin layer is obtained or obtainable by applying a polyamide solution comprising an aromatic polyamide, an inorganic filler and a solvent onto the base. | 12-04-2014 |
20140349233 | WATER SOLUBLE NORBORNENE-TYPE POLYMERS AND PHOTOIMAGEABLE COMPOSITIONS THEREOF - Embodiments in accordance with the present invention encompass water soluble polycyclic vinyl addition polymers having a norbornene type repeat unit derived from a norbornene type of monomer that encompasses a saccharide functional moiety. Embodiments in accordance with the present invention also encompass low and high molecular weight polymers with low catalyst loading. | 11-27-2014 |
20140341242 | RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d | 11-20-2014 |
20140322647 | PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF - The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation. | 10-30-2014 |
20140315009 | RESIN COMPOSITION AND METHOD FOR PRODUCING SAME - Provided is a resin composition which is characterized by including nanofibers in a hydrophilic resin or a polyolefin resin, wherein the nanofibers are cellulose nanofibers and the average fiber diameter thereof is 4 to 1000 nm. The X-ray diffraction pattern of the resin composition has an intensity distribution which indicates that a resin crystal is oriented. | 10-23-2014 |
20140305597 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide; and a solvent; wherein elastic modulus at 30.0° C. of a cast film formed by applying the solution onto a glass plate is 5.0 GPa or less, and coefficient of thermal expansion (CTE) of the cast film is more than 30 ppm/K, and wherein the aromatic copolyamide comprises at least two repeat units, and at least one of the repeat units has one or more free carboxyl groups. | 10-16-2014 |
20140299264 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - This disclosure, in one aspect, relates to a solution of polyamide including an aromatic polyamide and an amphiphilic solvent. This disclosure, in another aspect, relates to a solution of polyamide including an aromatic polyamide, an amphiphilic solvent, and an aprotic solvent. This disclosure, in another aspect, relates to a solution of aromatic polyamide for producing a display element, an optical element or an illumination element. | 10-09-2014 |
20140296374 | RESIN COMPOSITION FOR WET FRICTION MATERIAL, PHENOLIC RESIN FOR WET FRICTION MATERIAL AND WET FRICTION MATERIAL - A phenolic resin for a wet friction material of the present invention is a phenolic resin used in a wet friction material and a bisphenol-modified phenolic resin modified with bisphenols. In addition, a wet friction material of the present invention is formed using the phenolic resin for a wet friction material. | 10-02-2014 |
20140242434 | NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERIES AND LITHIUM ION SECONDARY BATTERY - Provided are negative electrode for lithium ion secondary batteries, which is capable of realizing a lithium ion secondary battery having characteristics such as stable output and stable capacity, and a lithium ion secondary battery having characteristics such as stable output and stable capacity. The negative electrode for lithium ion secondary batteries includes a laminated body of a negative electrode material layer that is mainly constituted by a carbonaceous material, and a negative electrode current collector. When the negative electrode material layer is in a dry state, a limit radius of curvature of a negative electrode is 15 mm or less. Content of the hard carbon in the carbonaceous material is preferably 5% by weight to 45% by weight. | 08-28-2014 |
20140234532 | LAMINATED COMPOSITE MATERIAL FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - This disclosure, viewed from one aspect, relates to a laminated composite material, including a glass plate and an organic resin layer. The organic resin layer is laminated on one surface of the glass plate, the organic resin is a polyamide resin, the rate of mass change of the polyamide resin from 300° C. to 400° C. measured by thermo gravimetry (TG) is 3.0% or less, and the glass transition temperature of the polyamide resin is 300° C. or more. | 08-21-2014 |
20140230240 | METHOD OF PRODUCING LITHIUM ION SECONDARY BATTERY - A method of producing a lithium ion secondary battery includes: a first winding process of winding a positive electrode plate ( | 08-21-2014 |
20140221572 | PACKING SHEET - The present invention provides a packing sheet and PTP packing body, which do not include halogen materials such as chlorine and fluorine and have high water vapor barrier property. The packing sheet of the present invention includes at least a high-density polyethylene resin (A), petroleum resin (B), and amorphous polyolefin resin (C). Also, it is preferable that the weight blending ratio ((A+B)/C) of the total weight of the high-density polyethylene (A) and the petroleum resin (B) to the weight of the amorphous polyolefin (C) be 50/50 or more and 90/10 or less. | 08-07-2014 |
20140213434 | RESIN-SUPPORTED CATALYST AND METHOD FOR PREPARING RESIN-SUPPORTED CATALYST - Provided is a resin-supported catalyst including a cured body of a thermosetting resin and fine particles having catalytic activity supported onto the surface of the cured body, in which the thermosetting resin has a phenolic hydroxyl group. | 07-31-2014 |
20140205948 | SELF-IMAGEABLE LAYER FORMING POLYMER AND COMPOSITIONS THEREOF - Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices. | 07-24-2014 |
20140205816 | DICING-TAPE-INTEGRATED ADHESIVE SHEET, SEMICONDUCTOR DEVICE, MULTILAYERED CIRCUIT BOARD AND ELECTRONIC COMPONENT - According to the present invention, a dicing-tape-integrated adhesive sheet is provided in which connection between terminals of opposing members and encapsulating of voids between the members can be simultaneously performed and thus excellent workability is achieved. The dicing-tape-integrated adhesive sheet of the present invention has a laminated structure including an adhesive film which has a first terminal of a support body and a second terminal of an adherend that are electrically connected using solder and by which the support body and the adherend are adhered to each other and a dicing tape. When it is assumed that an adhesion temperature when the adhesive film is adhered to a surface on which the first terminal of the support body is formed is T[° C.], a pressure applied to the adhesive film is P[MPa], and a melt viscosity of the adhesive film at the adhesion temperature is η[Pa·s], a relationship of 1.2×10 | 07-24-2014 |
20140183758 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, AND SEQUENTIAL STACKED BODY - A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device ( | 07-03-2014 |
20140183715 | SEMICONDUCTOR DEVICE - According to the present invention, a semiconductor device having superior electrical conductivity is provided. The semiconductor device of the present invention is provided with a base material, a semiconductor element, and an adhesive layer that adheres the base material and the semiconductor element while interposed there between. In the adhesive layer of the semiconductor device, a metal particle and an insulating particle are dispersed, and the metal particle has flaked shape or ellipsoidal/spherical shape. As the content percentage by volume of the metal particle in the adhesive layer is a and the content percentage by volume of the insulating particles in the adhesive layer is b, the content percentage (a+b) by volume of fillers in the adhesive layer is 0.20 or more and 0.50 or less and the content percentage a/(a+b) by volume of the metal particles in the fillers is 0.03 or more and 0.70 or less. | 07-03-2014 |
20140178701 | ROOM TEMPERATURE DEBONDING COMPOSITION, METHOD AND STACK - Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching. | 06-26-2014 |
20140175683 | AROMATIC POLYAMIDE FILMS FOR SOLVENT RESISTANT FLEXIBLE SUBSTRATES - This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide, silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer. | 06-26-2014 |
20140166929 | METHOD FOR MANUFACTURING CARBON MATERIAL FOR LITHIUM ION SECONDARY BATTERIES, CARBON MATERIAL FOR LITHIUM ION SECONDARY BATTERIES, NEGATIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM ION SECONDARY BATTERIES, COMPOSITION, CARBON COMPOSITE FOR NEGATIVE ELECTRODE MATERIALS OF LITHIUM ION SECONDARY BATTERIES, NEGATIVE ELECTRODE COMPOUND FOR LITHIUM ION SECONDARY BATTERIES, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERIES, AND LITHIUM ION SECONDARY BATTERY - There is provided a method for manufacturing the lithium ion secondary batteries includes a mixing step of mixing a phenol resin and a resin composition containing silica particles so as to obtain a mixture, a spraying step of spraying the mixture obtained in the mixing step so as to form liquid droplets, a first thermal treatment step of carrying out a first thermal treatment on the liquid droplets obtained in the spraying step so as to generate a carbon precursor, and a second thermal treatment step of carrying out a second thermal treatment, which is carried out at a higher temperature than the first thermal treatment, on the carbon precursor obtained in the first thermal treatment step so as to generate a carbon material containing carbon and silicon oxide represented by SiOx (006-19-2014 | |
20140159264 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - This disclosure, viewed from one aspect, this disclosure relates to a solution of polyamide comprising: an aromatic polyamide, a silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer. | 06-12-2014 |
20140113448 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME - A method for producing a through electrode includes providing a semiconductor wafer having an integrated circuit provided on a surface of the semiconductor wafer and a hole provided in the semiconductor wafer along a thickness direction of the semiconductor wafer. At least a portion of a back surface of an electrode of the integrated circuit is exposed through the hole. A positive photosensitive resin composition is sprayed to form a coating film so that the coating film covers an inner surface of the hole. The positive photosensitive resin composition has a viscosity of 0.5 to 200 cP and includes an alkali-soluble resin, a compound which generates an acid when exposed to light, and a solvent. At least a portion of the coating film is exposed and developed to form a coating film pattern. | 04-24-2014 |
20140107281 | MOLDING MATERIAL - The present invention has an objective to provide a molding material which has the improved specific strength and specific elastic modulus and which has excellent molding properties. | 04-17-2014 |
20140084499 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. | 03-27-2014 |
20140083624 | SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT - The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. | 03-27-2014 |
20140073732 | PHENOLIC RESIN MOLDING COMPOUND - A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight. | 03-13-2014 |
20140065486 | NEGATIVE-ELECTRODE MATERIAL, NEGATIVE ELECTRODE ACTIVE MATERIAL, NEGATIVE ELECTRODE, AND ALKALI METAL ION BATTERY - A negative-electrode material is a carbonaceous negative-electrode material used in an alkali metal ion battery and an average layer spacing d | 03-06-2014 |
20140045987 | CURABLE SILICONE RUBBER COMPOSITION AND MEASUREMENT METHOD FOR CURABLE SILICONE RUBBER COMPOSITIONS - The correlation between the aggregation structure of inorganic fillers such as silica microparticles in silicone rubbers and tensile strength and tear strength still has not been elucidated. The purpose of the invention is to provide a curable silicone rubber composition with which a silicone rubber of superior tensile strength and tear strength can be obtained. The invention provides a curable silicone rubber composition that is characterized in that the aggregate size of the inorganic filler prior to extending as determined by synchrotron X-ray diffraction measurement is 20-25 nm and the maximum value for the orientation coefficient of the curable silicone rubber composition when drawn as determined by synchrotron X-ray diffraction measurement is 0.25-0.35. | 02-13-2014 |
20140035115 | SEMICONDUCTOR DEVICE - A semiconductor device includes any one of a lead frame having a die pad portion and a circuit board, one or more semiconductor elements, a copper wire, an encapsulating member. The one or more semiconductor elements are mounted on any one of the die pad portion of the lead frame and the circuit board. The copper wire electrically connects electrical joints provided on any one of the lead frame and the circuit board to an electrode pad provided on the semiconductor element. The encapsulating member encapsulates the semiconductor element and the copper wire. The electrode pad provided on the semiconductor element is formed from palladium. The copper wire has a copper purity of 99.99% by mass or more and an elemental sulfur content of 5 ppm by mass or less. | 02-06-2014 |
20140018464 | SILICONE RUBBER-BASED CURABLE COMPOSITION, METHOD FOR PRODUCING SILICONE RUBBER, SILICONE RUBBER, MOLDED ARTICLE, AND TUBE FOR MEDICAL USE - The present invention provides a silicone rubber-based curable composition with which a silicone rubber having excellent tensile strength and tear strength is obtained, a method for producing a silicone rubber using the silicone rubber-based curable composition, a silicone rubber, a molded article using the silicone rubber, and a tube for medical use formed from the molded article. The silicone rubber-based curable composition of the present invention is characterized in that it includes a vinyl group-containing organopolysiloxane (A), an organohydrogen polysiloxane (B), silica particles (C), a silane coupling agent (D), and platinum or a platinum compound (E). | 01-16-2014 |
20140011026 | ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER AND THE LIKE - An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like, which is capable of inhibiting electrical charging in a stable manner. The adhesive tape (dicing tape) ( | 01-09-2014 |
20130337608 | SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to the present invention, a structure of a semiconductor device in which adhesive deposits are reduced and yield is excellent; and a process for manufacturing the same can be provided. A process for manufacturing a semiconductor device according to the present invention includes: a step of arranging plural semiconductor elements ( | 12-19-2013 |
20130331821 | SILICONE RUBBER-BASED HARDENING RESIN COMPOSITION, MOLDED ARTICLE, AND MEDICAL TUBE - The present invention provides a silicone rubber-based hardening composition which can produce a silicone rubber having excellent tensile strength and tear strength, a molded article which is made using the silicone rubber-based hardening composition, and a medical tube which is obtained by using the molded article, and the silicone rubber-based hardening composition according to the present invention contains linear organopolysiloxane having a vinyl group (A); linear organohydrogen polysiloxane (B); and silica filler (C) of which the surface is treated with a silane coupling agent having a trimethylsilyl group. | 12-12-2013 |
20130324641 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT - Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer. | 12-05-2013 |
20130323640 | Preparation of Norbornane-based PAC Ballasts - Embodiments in accordance with the present invention provide for norbornane-type ballast materials, norbornane-type photoactive compounds derived from such ballast materials and alkali-soluble positive-tone polymer compositions that encompass such norbornane-type photoactive compounds and one of a PBO or PNB resin. | 12-05-2013 |
20130316932 | GLYCOPEPTIDE ARRAY - The present invention provides: a glycopeptide array which is useful for the detection of the binding between a substance to be detected and a glycopeptide; and an array which can inhibit the non-specific adsorption or binding of a substance to be detected without the need of coating any adsorption-inhibiting agent and which has the glycopeptide immobilized thereon. In the present invention, it was found that a glycopeptide that has a molecule having a carbonyl group bound to a peptide moiety thereof can be immobilized on a substrate that is coated with a polymer compound containing a unit having a primary amino group with high efficiency through the carbonyl group. Particularly, it was found by the present inventors that a glycopeptide can be immobilized on a substrate with high efficiency and the non-specific adsorption or binding of a substance to be detected can be inhibited effectively when a substrate that is coated with a polymer compound containing a unit having a primary amino group, a unit for retaining hydrophilicity and a unit having a hydrophobic group is used as the substrate for the glycopeptide. | 11-28-2013 |
20130310612 | LIQUID RESOL-TYPE PHENOLIC RESIN - A liquid resol-type phenolic resin obtained by reacting a phenol (A), and a secondary and/or tertiary alkylamine compound (B) in the presence of a basic catalyst. The nitrogen content relative to the total weight of the liquid resol-type phenolic resin is preferably from 3 to 30% by weight. Further, the secondary and/or tertiary alkylamine compound (B) is preferably hexamethylenetetramine. Moreover, the molar ratio between the phenol (A) and the secondary and/or tertiary alkylamine compound (B) preferably satisfies (B)/(A)=0.13 to 0.35. | 11-21-2013 |
20130310552 | SUGAR CHAIN FLUORESCENT LABELING METHOD - An object of the present invention is to provide a simple method for fluorescent labeling of sugar chains, and a sugar chain capturing carrier used therein. According to the present invention, a sugar chain fluorescent labeling method is provided in which sugar chains are captured, recovered and purified by primary amino groups in a sugar chain capturing carrier having the primary amino groups that is used to capture sugar chains, and the captured sugar chains are released from the carrier and then labeled with a fluorescent substance including aromatic amine at a concentration of 0.5 mol/L or more. | 11-21-2013 |
20130289166 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - The invention provides a resin composition that is excellent in terms of coating workability and can supply reliability, including the soldering reflow resistance, to a semiconductor device when being used as a die attach material or an adhesive for a heat dissipation member. The resin composition of the invention contains a polymer or copolymer of a conjugated diene compound having at least one functional group, a thermosetting resin and a (meth)acryl polymer or copolymer having a reactive functional group that can react with other reactive groups. | 10-31-2013 |
20130281600 | PHENOL RESIN BASED MOLDING MATERIAL - A phenolic resin molding compound, which is thermally stable in a heating cylinder, is provided. By using the phenolic resin molding compound, moldings with an excellent dimensional precision can be obtained. The phenolic resin molding compound comprises: (A) a novolac phenolic resin with an o/p ratio (ortho/para ratio) of 0.7 to 0.9; (B) a novolac phenolic resin with an o/p ratio of 1.1 to 1.3; (C) talc; and (D) a polyethylene or polyethylene/polypropylene copolymer. The amount of (D) the polyethylene or polyethylene/polypropylene copolymer relative to a total weight of the phenolic resin molding compound is 0.5 to 1.5 weight %. It is preferable that the total amount of (A) and (B) is 20 to 40 weight %, and the amount of (C) is 5 to 15 weight %. | 10-24-2013 |
20130277867 | EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE - The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 μm or less, and the ratio of particles having a particle diameter in excess of 20 μm is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound. An electronic component device in which an electronic component is sealed by a cured product of the aforementioned epoxy resin composition for sealing is provided. | 10-24-2013 |
20130273352 | SURFACE LAYER MATERIAL AND MELAMINE DECORATIVE LAMINATE - The present invention provides a surface layer material for a melamine decorative laminate having an aluminum layer, allowing 3R or less bending while maintaining the surface hardness of the melamine decorative laminate, and a melamine decorative laminate comprising the surface layer material. Disclosed is a surface layer material for a decorative laminate comprising a surface layer and an aluminum layer, the material comprising a surface layer substrate having a first surface being a design surface and a second surface being a surface on an opposite side of the design surface, wherein a melamine resin composition comprising a melamine resin is carried on the first surface, and a urethane-acrylic resin composition comprising a urethane-acrylic resin is carried on the second surface. | 10-17-2013 |
20130256863 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE - A highly reliable semiconductor device with the improved humidity resistance reliability is disclosed. A disclosed epoxy resin composition for semiconductor encapsulation encapsulates, in the manufacture of the semiconductor device, a semiconductor element that is mounted on a lead frame having a die pad unit or a circuit substrate and a wire that connects an electrical junction disposed on the lead frame or circuit substrate and an electrode pad disposed on the semiconductor element. The epoxy resin composition includes an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin (A) has a main peak area of 90% or more with respect to the total area of all peaks as measured by the gel permeation chromatography area method. | 10-03-2013 |
20130253580 | ADHESIVE APPLICATOR FOR BIOLOGICAL TISSUE - An adhesive applicator for biological tissue ( | 09-26-2013 |
20130244027 | COVER TAPE FOR ELECTRONIC COMPONENT PACKAGING - According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less. | 09-19-2013 |
20130242520 | INSULATING SUBSTRATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE - The present invention provides: an insulating substrate or metal-clad laminate able to sufficiently reduce or prevent negative warping of a semiconductor device; a printed wiring board that uses the insulating substrate or metal-clad laminate; and a semiconductor device. The insulating substrate is composed of a cured product of a laminate including one or more fibrous base material layers and two or more resin layers, in which the outermost layers on both sides is the resin layers. At least one of the fibrous base material layers is shifted towards the first side or a second side on the opposite side thereof with respect to the reference position, namely the dividing position at which a total thickness of the insulating substrate is equally divided by the number of the fibrous base material layers and each divided region having the thickness is further equally divided by two. The fibrous base material layers are not shifted in different directions. It is possible to produce a printed wiring board by using, as a core substrate, a metal-clad laminate containing the insulating substrate. Also, it is possible to produce a semiconductor device by mounting a semiconductor element onto the printed wiring board. | 09-19-2013 |
20130230712 | DECORATIVE MELAMINE BOARD - The present invention provides a decorative melamine board that maintains the surface hardness associated with melamine resin while having superior non-combustibility, being able to accommodate reductions in thickness and having superior bending workability at normal temperatures. The decorative melamine board has a structure obtained by laminating a surface layer and a core layer. The surface layer includes a surface layer material composed of a surface layer base material that carries a resin containing a melamine resin on a first surface side serving as a design surface, and carries a solid content of a thermoplastic resin emulsion on a second surface side that contacts the core layer. The core layer includes a core layer material composed of glass cloth or a prepreg having glass cloth as a base material thereof. | 09-05-2013 |
20130209028 | ELECTRICAL OPTICAL CIRCUIT-BOARD, CIRCUIT-BOARD APPARATUS, AND PHOTOELECTRIC COMPOSITE DEVICE - An electrical optical circuit-board ( | 08-15-2013 |
20130196881 | SUGAR CHAIN ARRAY - A sugar chain array containing a sugar chain immobilized thereon for detecting binding between an analyte and a sugar chain, and a sugar chain array having the sugar chain immobilized thereon that is capable of inhibiting non-specific adsorption and binding of an analyte without having to coat the array with an adsorption inhibitor. A specific sugar chain is immobilized on the array, and is useful for detecting binding between the sugar chain and an analyte, such as a pathogen of an infectious disease or an excretion thereof. In addition, in the array, when a base material is coated with a polymeric compound having a unit having a primary amino group, a unit for maintaining hydrophilicity, and a unit having a hydrophobic group, the sugar chain is immobilized efficiently and non-specific adsorption and binding of the analyte can be effectively inhibited. | 08-01-2013 |
20130192754 | Room Temperature Debonding Composition, Method and Stack - Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching. | 08-01-2013 |
20130183014 | OPTICAL WAVEGUIDE STRUCTURE AND ELECTRONIC DEVICE - An optical waveguide structure containing a plurality of core portions for transmitting light (L), in which adjacent core portions are arranged with substantially parallel central axes, and the optical paths of the light (L) that is transmitted through the adjacent core portions are in opposite directions, wherein each core portion has a tapered section in which the area of the cross-section in a direction substantially perpendicular to the central axis decreases gradually in the direction of the optical path of the light (L). A highly reliable electronic device containing the optical waveguide structure is also provided. | 07-18-2013 |
20130182997 | OPTICAL WAVEGUIDE MODULE, METHOD FOR PRODUCING OPTICAL WAVEGUIDE MODULE, AND ELECTRONIC APPARATUS - An object of the present invention is to provide an optical waveguide module which has a small optical coupling loss between the light element and the optical waveguide and can perform high-quality optical communication, a method for producing the optical waveguide module with high efficiency, and an electronic apparatus which includes the optical waveguide module and can perform high-quality optical communication, and the present invention provides an optical waveguide module including: an optical waveguide including a core portion, a clad portion that is provided to cover a side surface of the core portion, and an optical path-converting unit that is provided partway along the core portion or on an extended line of the core portion and that converts an optical path of the core portion to the outside of the clad portion; an optical element that is provided over the clad portion; a circuit board that is provided between the optical waveguide and the optical element and has a through-hole formed along an optical path connecting between the optical path-converting unit and the optical element; and a sealing portion that is transparent and is formed in a gap between the optical element and the circuit board; wherein a part of the sealing portion is inserted into the through-hole, and an inserted portion of the sealing portion functions as a lens for converging signal light passing though the optical path. | 07-18-2013 |
20130181199 | Thermo-oxidatively Stable, Side Chain Polyether Functionalized Polynorbornenes for Microelectronic and Optoelectronic Devices and Assemblies Thereof - The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized where such the PNBs of such compositions and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization. | 07-18-2013 |
20130177277 | OPTICAL WAVEGUIDE, METHOD FOR PRODUCING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE MODULE, METHOD FOR PRODUCING OPTICAL WAVEGUIDE MODULE, AND ELECTRONIC APPARATUS - An object is to provide an optical waveguide that has low optical coupling loss when optically coupled with an optical element and that is capable of performing high-quality optical communication, a method for efficiently producing the optical waveguide, an optical waveguide module that is provided with the optical waveguide and is capable of performing high-quality optical communication, a method for efficiently producing the optical waveguide module, and an electronic apparatus. Provided is an optical waveguide including: a core portion; a clad portion that is provided to cover a side surface of the core portion; an optical path-converting unit that is provided partway along the core portion or on an extended line of the core portion and that converts an optical path of the core portion to the outside of the clad portion; and a lens that is provided on a surface of the clad portion at least at a portion optically connected to the core portion via the optical path-converting unit, and that is formed by causing the surface to locally protrude or to be locally depressed. | 07-11-2013 |
20130171449 | DICING FILM - According to the invention, a dicing film, which generates a small amount of scrapes and beard-like burrs during dicing and furthermore has desirable strength and external appearance, is provided. The dicing film according to the invention has an adhesive layer on at least one surface of a base film, wherein the base film contains a copolymer (A) of at least two kinds of alkyl(meth)acrylates and styrene; and a styrene-based elastomer (B). The copolymer (A) of at least two kinds of alkyl(meth)acrylates and styrene is a styrene-alkyl methacrylate-alkyl acrylate copolymer. | 07-04-2013 |
20130170803 | OPTICAL WAVEGUIDE AND ELECTRONIC DEVICE - An optical waveguide including a first cladding layer; a core layer, including first and second core sections with cladding sections on sides thereof in the in-layer direction; and a second cladding layer. A refractive index distribution in the in-layer direction in the core layer, from the first core section to an adjacent cladding section, has a continuous change and a region with a first peak, a first dip, and a second peak in this order; the first peak at a position of the first core section, the second peak with a maximum value of refractive index smaller than of the first peak, at a position of the cladding section, and a portion, from the first cladding layer to the first core section, corresponded to a refractive index distribution in the layer-stacking direction, discontinuously changing at the boundary between the first cladding layer and first core section. | 07-04-2013 |
20130162063 | FIXING RESIN COMPOSITION FOR USE IN ROTOR - The fixing resin composition for use in a rotor includes a thermosetting resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C), wherein the content of the inorganic filler (C) is equal to or more than 50% by mass, based on 100% by mass of the total content of the fixing resin composition. | 06-27-2013 |
20130158188 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED USING RESIN COMPOSITION - A resin composition of the present invention includes a maleimide derivative (A) represented by a general formula (1) and a bis-maleimide compound (B) represented by a general formula (2). In the general formula (1), R1 represents a straight chain or branched alkylene group having 1 or more carbon atoms, R2 represents a straight chain or branched alkyl group having 5 or more carbon atoms, and the sum of carbon atoms of R1 and R2 is 10 or less. In the general formula (2), X1 represents —O—, —COO—, or -—OCOO—R3, represents a straight chain or branched alkylene group having 1 to 5 carbon atoms, R4 represents a straight chain or branched alkylene group having 3 to 6 carbon atoms, and m is an integer of 1 or more and 50 or less. | 06-20-2013 |
20130157303 | SULFATED POLYSACCHARIDE CAPABLE OF BINDING TO GROWTH FACTOR AND USE THEREOF - A biological substance which can enhance the proliferation and differentiation of cells; a method for evaluating the proliferation and differentiation of cells, which targets the biological substance; a composition for detecting the proliferation and differentiation of cells, which contains a molecule capable of binding to the biological substance; and a composition for enhancing the proliferation and differentiation of cells, which contains the biological substance. A part of a sulfated polysaccharide secreted from cells binds to a growth factor during the course of the proliferation and differentiation of the cells, that the amount of the sulfated polysaccharide capable of the above-mentioned binding and secreted from the cells correlates strongly with the progression of the proliferation and differentiation of the cells, and that the proliferation and differentiation of cells can be evaluated and the proliferation and differentiation of cells can be enhanced utilizing the sulfated polysaccharide. | 06-20-2013 |
20130143983 | LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - According to the invention, a liquid resin composition which has favorable wet spreadability after mounting of a chip and exhibits excellent solder cracking resistance even in a high-temperature solder reflow process at about 260° C., i.e., even when being used in lead-free solder, and a semiconductor package using the liquid resin composition are provided. In the liquid resin composition of the invention, an acrylic copolymer having a radical polymerizable functional group contains alkyl(meth)acrylate as a constituent monomer having a linear or branched alkyl group having 6 to 9 carbon atoms in an amount of 10 wt % to 40 wt % of the entire constituent monomers. | 06-06-2013 |
20130134610 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 05-30-2013 |
20130134608 | FUNCTIONAL PARTICLE, FUNCTIONAL PARTICLE GROUP, FILLER, RESIN COMPOSITION FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE - A functional particle ( | 05-30-2013 |
20130123538 | LIQUID PHENOL RESIN AND METHOD OF PREPARING THE SAME - According to the present invention, a liquid phenol resin that has excellent characteristics of a phenol resin, such as thermal resistance and hardenability, and can produce a molded product having excellent flexibility, and a method of preparing the resin are provided. | 05-16-2013 |
20130123470 | METHOD FOR PREPARING SUGAR CHAINS FROM ANTIBODIES - A method allowing easy and quick preparation of sugar chains of antibodies is provided. Sugar chains are cut off from the antibodies in a state where the antibodies are kept being bonded to an absorbing materials, such as the Protein A or the Protein G. Then, the cut off sugar chains are captured to sugar-chain-capturing solid-phase carriers having a functional group that forms a stable bonding with the sugar chains by reacting specifically with the aldehyde groups of the sugar chains. Then, the captured sugar chains are re-released. Sugar chain samples suitable for mass spectrometry, chromatography, or electrophoresis can be prepared easily and quickly by the present method. | 05-16-2013 |
20130122580 | CULTURE VESSEL FOR FORMING AGGREGATED CELL MASS - The present invention provides a culture vessel for forming an aggregated cell mass which has at least two wells, wherein the wells are made from a light-shielding member and an inner surface of the wells is subjected to treatment to impart cellular non-adhesiveness. | 05-16-2013 |
20130119564 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 05-16-2013 |
20130118925 | LAMINATED FILM AND PACKAGE - An object of the present invention is to provide a laminated film excellent in oxygen absorbing ability. A laminated film | 05-16-2013 |
20130113122 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 05-09-2013 |
20130109798 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME | 05-02-2013 |
20130108967 | METHOD FOR FORMING CURED FILM | 05-02-2013 |
20130108963 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING PHOTOSENSITIVE COMPOSITION | 05-02-2013 |
20130071938 | METHOD FOR ANALYZING SUGAR CHAIN BY MASS SPECTROMETRY - It has been found out that it is possible to increase the ionization efficiency of a sample sugar chain by methylating hydroxyl groups of the sugar chain before MALDI-TOF MS measurement. This enables quantitative and structural analyses on the sample sugar chain with high accuracy. | 03-21-2013 |
20130069277 | RESIN COMPOSITION SHEET AND METHOD FOR MOLDING THEREOF - The object of the present invention is to provide a resin composition sheet that when used in the manufacture of product packaging such as carrier tapes, and the like, molding temperatures can be lowered from 260-280° C. to 200-250° C., even when heated to relatively high temperatures using a contact heating device with a mold-releasing film interposed therebetween, wherein poor appearance due to the replication of mold-releasing film features is unlikely to occur. The resin composition sheet relating to one aspect of the present invention comprises polycarbonate resin, amorphous polyester resin, and silicate compound filler. Furthermore, this resin composition sheet is suitable for use in the manufacture of product packaging such as carrier tapes, and the like. Furthermore, when an object that is vulnerable to static electricity is to be accommodated within product packaging, it is preferable to add a conductive filler to prevent the static charge in the accommodated product. | 03-21-2013 |
20130066036 | METHOD OF MANUFACTURE OF NOVOLAC-TYPE PHENOL RESIN - A method of manufacture of novolac-type phenol resin, wherein phenols and aldehydes are allowed to react with each other, a water-soluble organic phosphonic acid is used as a reaction catalyst, and a tertiary phosphine compound is used as a reaction promoter. It is preferable that the aforementioned organic phosphonic acid have the structure shown in the following general formula (1): | 03-14-2013 |
20130065002 | MULTILAYER FILM AND PACKAGING MATERIAL - An object of the present invention is to provide a multilayer film and a package body of which the thickness can be reduced than that of a conventional multilayer film, by having a good impact resistance, flex resistance, and anti-pinhole property. A multilayer film | 03-14-2013 |
20130062748 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULANT AND SEMICONDUCTOR DEVICE USING THE SAME - According to the present invention, an epoxy resin composition for semiconductor encapsulant including (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a compound in which a copolymer of a 1-alkene having 5 to 80 carbon atoms and maleic anhydride is esterified with an alcohol having 5 to 25 carbon atoms in the presence of a compound represented by General Formula (1), wherein R | 03-14-2013 |
20130059983 | METHOD OF MANUFACTURING ESTERIFIED SUBSTANCE - According to the invention, a method of manufacturing an esterified substance including a process in which a copolymer is obtained by copolymerizing a 1-alkene having 5 to 80 carbon atoms and maleic anhydride, and a process in which an esterification reaction of the copolymer and an alcohol having 5 to 25 carbon atoms is caused in a presence of trifluoromethanesulfonic acid in order to obtain a reaction mixture containing an esterified substance including at least one repetition unit selected from formulae (c) to (f) is provided, and, in the formulae (c) to (f), R represents an aliphatic hydrocarbon group having 3 to 78 carbon atoms, R | 03-07-2013 |
20130059974 | PHENOLIC RESIN MOLDING COMPOUND - Provided is a phenolic resin molding compound including (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight. | 03-07-2013 |
20130058062 | METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE - A method for manufacturing a base material having a gold-plated metal fine pattern is disclosed, comprising the steps of preparing a base material having a supporting surface made of a resin; forming a primer resin layer having surface roughness of 0.5 μm or less on the supporting surface, and forming a metal fine pattern thereon by an SAP process to obtain a base material having a metal fine pattern; and applying a gold-plating treatment to at least one part of a surface of the metal fine pattern; wherein the base material having a metal fine pattern is subjected to a palladium removal treatment in an optional stage before carrying out the gold-plating treatment. | 03-07-2013 |
20130037310 | EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE - Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds. | 02-14-2013 |
20130022913 | METHOD FOR PRODUCING POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND FILTER - A method for producing a positive-type photosensitive resin composition which includes a process of filtering the positive-type photosensitive resin composition containing a surfactant by using a filter, wherein a contact angle on one surface of the filter is equal to or more than 30 degrees and equal to or less than 80 degrees when measured using formamide. | 01-24-2013 |
20130021572 | LIQUID CRYSTAL DISPLAY DEVICE ELEMENT, METHOD FOR MANUFACTURING SAME, AND LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display element ( | 01-24-2013 |
20130018163 | SOLID RESOL-TYPE PHENOLIC RESIN AND METHOD OF MANUFACTURING THE SAMEAANM Suzuki; YujiAACI TokyoAACO JPAAGP Suzuki; Yuji Tokyo JPAANM Kitagawa; KazuyaAACI TokyoAACO JPAAGP Kitagawa; Kazuya Tokyo JP - Disclosed is a solid resol-type phenolic resin having: methylol groups and dimethylene ether bonds, as functional groups bound to phenolic nuclei; a content of methylol group, per 1 mol of the phenolic nuclei, of 0.8 mol or more and 1.3 mol or less; a content of dimethylene ether bond, per 1 mol of the phenolic nuclei, of 0.1 mol or less; a weight-average molecular weight of a tetrahydrofuran-soluble fraction, measured by gel permeation chromatography (GPC), of 800 or larger and 4,000 or smaller; and a content of mononuclear phenolic compound of 10% by weight or less. | 01-17-2013 |
20130017488 | Self-Imageable Layer Forming Polymer and Compositions Thereof - Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices. | 01-17-2013 |
20130015582 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFACTURING CIRCUIT BOARD AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICEAANM Kondo; MasayoshiAACI TokyoAACO JPAAGP Kondo; Masayoshi Tokyo JPAANM Makino; NatsukiAACI TokyoAACO JPAAGP Makino; Natsuki Tokyo JPAANM Fujiwara; DaisukeAACI TokyoAACO JPAAGP Fujiwara; Daisuke Tokyo JPAANM Ito; YukaAACI TokyoAACO JPAAGP Ito; Yuka Tokyo JP - A circuit board ( | 01-17-2013 |
20130009172 | METHOD OF MANUFACTURE OF LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING ELEMENT MANUFACTURED THEREBY - An object of the invention is to provide a method of manufacturing a light-emitting element, in which residue from a fixing resin layer is less likely to be left on a semiconductor layer and a supporting base in the case of manufacturing the light-emitting element by a laser lift-off technique. Furthermore, another object of the invention is to provide a highly reliable light-emitting element that is manufactured by the method of the present invention. The above-described objects are accomplished by applying a thermally decomposable resin composition as a fixing resin layer that fixes the semiconductor layer to a supporting base, and by thermally decomposing the fixing resin layer at the time of peeling off the semiconductor layer from the supporting base. | 01-10-2013 |
20120319306 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME - Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound having an ester group; and a semiconductor device including a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation. | 12-20-2012 |
20120280425 | MOLD FOR MEASURING FLOW CHARACTERISTICS, METHOD FOR MEASURING FLOW CHARACTERISTICS, RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - According to the invention, a mold for measuring flow characteristics which is used to measure the flow characteristics of a resin composition, which is a measurement subject, by injecting the resin composition into a flow path provided in the mold, in which the minimum distance from the cross-sectional center of gravity to the outline in the cross-sectional shape of the flow path is equal to or more than 0.02 mm and equal to or less than 0.4 mm, and a method for measuring flow characteristics in which a resin composition, which is a measurement subject, is injected into the flow path of the mold for measuring flow characteristics, and made to flow in a single direction, and the flow distance from the start point to the end point of the flow of the resin composition is obtained as the flow length are provided. | 11-08-2012 |
20120228782 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE - Disclosed is a method for manufacturing an electronic device, the method including: placing an electronic component on a substrate | 09-13-2012 |
20120220902 | INNER DIAMETER MEASUREMENT INSTRUMENT AND PRIMING METHOD THEREFOR - An inner diameter measurement instrument ( | 08-30-2012 |
20120208089 | CARBON MATERIAL FOR LITHIUM ION SECONDARY CELL, NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY CELL AND LITHIUM ION SECONDARY CELL - Disclosed is a carbon material for lithium ion secondary cell having a positron lifetime of 370 picoseconds or longer, and 480 picoseconds or shorter, when measured by positron annihilation spectroscopy under conditions (A) to (E) below:
| 08-16-2012 |
20120199988 | METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE - Disclosed is a method of manufacturing an electronic device, that includes obtaining a stack of the first electronic component and the second electronic component, while placing a resin layer which contains a flux-active compound and a thermosetting resin, between the first terminals and the second terminals; bonding the first terminals and the second terminals with solder, by heating the stack at a temperature not lower than the melting point of solder layers on the first terminals, while pressurizing the stack using a fluid; and curing the resin layer. The duration from the point of time immediately after the start of heating of the stack, up to the point of time when the temperature of the stack reaches the melting point of the solder layers, is set to 5 seconds or longer, and 15 minutes or shorter. | 08-09-2012 |
20120183781 | CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL - The present invention provides a conductive connecting material having a multi-layered structure comprising a resin composition and a metal foil selected from a solder foil or a tin foil, wherein the minimum ion viscosity value of the resin composition is 4-9 when measured in accordance with ASTM standard E2039 by applying a frequency of 10000 Hz at the melting point of the metal foil. The present invention further provides a method for connecting terminals and a method for producing a connection terminal using the conductive connecting material. By using the conductive connecting material of the present invention, good electric connection between connection tell finals as well as highly-reliable insulation between adjacent terminals can be achieved. | 07-19-2012 |
20120156502 | ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive film in which the adhesive film contains a thermosetting resin (A), a curing agent (B), a compound having flux activity (C) and a film forming resin (D), the minimum melt viscosity of the adhesive film is 0.01 to 10,000 Pa·s, and the adhesive film satisfies the following formula (1) when the exothermic peak temperature of the adhesive film is defined as (a) and the 5% weight loss temperature by thermogravimetry of the adhesive film is defined as (b), | 06-21-2012 |
20120149815 | Transparent Layer Forming Polymer - Embodiments in accordance with the present invention provide polymers for forming layers/films useful in the manufacture of a variety of types of optoelectronic displays. Such embodiments also provide compositions of such polymers for forming such layers/films where the formed layers/films have high transparency over the visible light spectrum. | 06-14-2012 |
20120141695 | MULTILAYERED RESIN PRODUCT AND IMAGE DISPLAY PANEL - A multilayered resin product includes a resin substrate and a hard coat layer, wherein each side or one side of the resin substrate is coated with the hard coat layer, the hard coat layer includes a cured product of (A) a UV-curable compound and (B) a fatty acid, a fatty acid ester, or a derivative thereof, and the ratio “(Bs)/(As)” of the content (Bs) of the fatty acid, fatty acid ester, or derivative thereof to the content (As) of the cured product of the UV-curable compound in a surface area of the hard coat layer up to a depth of 100 nm is 0.07 to 3.3. The multilayered resin product may be used as a surface-protective multilayered resin product that advantageously prevents adhesion of stains due to adhesion of a sebum film without showing a decrease in the hard coat properties (e.g., scratch resistance and abrasion resistance) and the optical properties (e.g., transmittance and haze). | 06-07-2012 |
20120129101 | Self-Imageable Film Forming Polymer, Compositions Thereof and Devices and Structures Made Therefrom - Polymers and compositions for forming self-imageable films encompassing such polymers that encompass norbornene-type repeating unit having at least one phenolic functionality and maleic anhydride-type repeating unit, which can be formulated to be either positive tone imaging or negative tone imaging. The films formed thereby are useful as self-imageable layers in the manufacture of microelectronic, such as semiconductor, and optoelectronic devices. | 05-24-2012 |
20120118939 | PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE - The process for manufacturing the semiconductor device and the apparatus, which achieve stable production of semiconductor devices with improved connection reliability, is presented. First terminals of circuit boards | 05-17-2012 |
20120118789 | COVER TAPE FOR PACKAGING ELECTRONIC PART AND ELECTRONIC PART PACKAGE - The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape ( | 05-17-2012 |
20120101501 | ENDOSCOPIC HIGH-FREQUENCY HEMOSTATIC FORCEPS - A hemostatic forceps ( | 04-26-2012 |
20120100484 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME - A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: | 04-26-2012 |
20120071724 | ENDOSCOPE HOOD AND ENDOSCOPE WITH THE SAME MOUNTED THEREON - An endoscope hood ( | 03-22-2012 |
20120070902 | METHOD FOR ANALYSIS OF SUGAR CHAINS BY MASS SPECTROMETRY - Provided is a highly accurate means for analyzing a sugar chain contained in a biological sample by MALDI-TOF MS or such a mass spectrometry method. In the present invention, it was found to be possible to improve the ionization efficiency of a sugar chain by methylating the hydroxyl groups of the sample sugar chain before conducting the MALDI-TOF MS analysis, and by so doing to carry out quantitative analysis and structural analysis of the sample sugar chain with high accuracy. | 03-22-2012 |
20120046661 | HIGH-FREQUENCY TREATMENT INSTRUMENT - A high-frequency treatment instrument ( | 02-23-2012 |
20110318938 | TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this.
| 12-29-2011 |
20110311790 | CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USING THE CONDUCTIVE CONNECTING MATERIAL, AND METHOD FOR PRODUCING A CONNECTING TERMINAL - The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising: a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified. | 12-22-2011 |
20110295217 | CATHETER AND METHOD OF MANUFACTURING CATHETER - A main lumen ( | 12-01-2011 |
20110286713 | PHOTOSENSITIVE RESIN COMPOSITION, OPTICAL WAVEGUIDE FILM, FILM FOR FORMING OPTICAL WAVEGUIDE, OPTICAL INTERCONNECT, OPTO-ELECTRIC HYBRID CIRCUIT BOARD, ELECTRONIC DEVICE, AND A METHOD OF MANUFACTURING AN OPTICAL WAVEGUIDE FILM - A photosensitive resin composition which includes (A) a cyclic olefin; (B) at least either one of a monomer having a cyclic ether group and an oligomer having a cyclic ether group, having a refractive index different from that of the component (A); and (C) a photoacid generator, is provided. | 11-24-2011 |
20110270229 | CATHETER - A catheter ( | 11-03-2011 |
20110263095 | TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same. | 10-27-2011 |
20110253222 | MICROFLUIDIC DEVICE - The present invention is to provide a microfluidic device capable of allowing a fluid to stably flow in a microchannel without using an external source such as a pump or a suction device, and the microfluidic device, provided with a microchannel to which a sample liquid is transported, includes: an inlet reservoir which reserves a sample liquid to be introduced into said microchannel; an inlet which is provided on a sample-introduced side of the microchannel, and communicates with the inlet reservoir; an outlet provided on a sample-discharged side of the microchannel; and an open channel which is provided as communicating with the outlet, and part of at least one surface of which is opened to the outside atmosphere, wherein the inlet is provided at a higher position in a gravity direction than the outlet. | 10-20-2011 |
20110244400 | Norbornene-Type Polymers, Compositions Thereof and Lithographic Process Using Such Compositions - Embodiments in accordance with the present invention provide for non-self imageable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming top-coat layers for overlying photoresist layers in immersion lithographic process and the process thereof. | 10-06-2011 |
20110221075 | METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE - Provided is a method of manufacturing an electronic device comprising a first electronic component having a first terminal and a second electronic component having a second terminal, wherein said first electric component is electrically connected to said second electronic component by connecting said first terminal to said second terminal with solder, | 09-15-2011 |
20110200937 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME - The present invention provides a positive photosensitive resin composition for spray coating, which comprises an alkali-soluble resin, a compound which generates an acid when exposed to light and a solvent, and which has a viscosity of 0.5 to 200 cP. By using the positive photosensitive resin composition, it is possible to form a coating film having a uniform thickness on the inner surface of a hole having a high aspect ratio. By using a coating film pattern, which is obtained by exposing and developing a predetermined region of the obtained coating film, as an insulating film or mask for forming an insulating film pattern, it is possible to suppress generation of leakage current in a hole and to form a through electrode with a high yield. | 08-18-2011 |
20110184077 | METHOD FOR DECOMPOSING POLYMER MATERIAL, METHOD FOR PRODUCING RECYCLED RESIN, AND METHOD FOR RECOVERING INORGANIC FILLER - The present invention is a method for decomposing a polymer material by chemically decomposing a polymer material containing a first monomer and a second monomer in a mixture of the polymer material with the first monomer or a derivative of the first monomer to produce a chemical raw material. A relationship between a proportion of number of molecules of the second monomer to number of molecules of the first monomer in a reaction system for decomposing the polymer material and the molecular weight of the chemical raw material produced in the reaction system is acquired in advance (S | 07-28-2011 |
20110172351 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE - An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%. | 07-14-2011 |
20110162711 | WAVELENGTH-CONVERTING COMPOSITION AND PHOTOVOLTAIC DEVICE COMPRISING LAYER COMPOSED OF WAVELENGTH-CONVERTING COMPOSITION - There is provided a wavelength-converting composition and a photovoltaic device in which a wavelength-converting substance can be uniformly dispersed without causing an increase in manufacturing costs. The wavelength-converting composition contains a curing resin and a wavelength-converting substance for converting the wavelength of absorbed light. | 07-07-2011 |
20110158596 | OPTICAL WAVEGUIDE, OPTICAL WIRING LINE, OPTICAL/ELECTRICAL COMBINATION SUBSTRATE AND ELECTRONIC DEVICE - An optical waveguide is provided. The optical waveguide includes a plurality of core portions and a plurality of clad portions in which each core portion being provided between a pair of clad portions. Each of the plurality of clad portions comprises: a low refractive-index area being in contact with the core portion, wherein a refractive index of the low refractive-index area is lower than that of the plurality of core portions; and a plurality of high refractive-index areas separated from the core portion through the low refractive-index area, wherein a refractive index of the plurality of high refractive-index areas is higher than the refractive index of the low refractive-index area. The plurality of high refractive-index areas are provided in the clad portion in an aligned manner or in a scattered manner. The plurality of high refractive-index areas are constituted of the same kind of material as a constituent material of the plurality of core portions. The plurality of high refractive-index areas make light scattered. Such light does not enter the plurality of core portions and involuntarily enters the plurality of clad portions. By doing so, it is possible to prevent the light from reaching light receiving elements, so that it is possible to improve quality of optical communications. | 06-30-2011 |
20110149532 | LAMINATE, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - Disclosed is a laminate including an insulating resin layer and a metallic foil formed in contact with the insulating resin layer. The laminate is characterized in that the interface stress between the insulating resin layer and the metallic foil represented by the following formula (1) is not more than 7×10 | 06-23-2011 |
20110136952 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM - A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). | 06-09-2011 |
20110124775 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME - Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The semiconductor encapsulating resin composition includes a phenol resin (A) containing a polymer (A0) having structural units represented by the following general formulae (1) and (2), and composed of one or more components having an aromatic group having at least one alkyl group with 1 to 3 carbon atoms at least at one end; an epoxy resin (B); and an inorganic filler (C), | 05-26-2011 |
20110120630 | MANUFACTURING PROCESS FOR A PREPREG WITH A CARRIER, PREPREG WITH A CARRIER, MANUFACTURING PROCESS FOR A THIN DOUBLE-SIDED PLATE, THIN DOUBLE-SIDED PLATE AND MANUFACTURING PROCESS FOR A MULTILAYER-PRINTED CIRCUIT BOARD - A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin. | 05-26-2011 |
20110101484 | LIGHT-RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a device including at least one light-receiving unit | 05-05-2011 |
20110089549 | SEMICONDUCTOR DEVICE - A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are combined with the copper wire having predetermined properties. | 04-21-2011 |
20110089033 | METHOD OF PREPARING SUGAR CHAIN SAMPLE, SUGAR CHAIN SAMPLE, AND METHOD OF ANALYZING SUGAR CHAIN - A method of preparing a sugar chain sample, for reducing unreacted labeling reagent in a sample solution containing a labeled sugar chain, includes (process 1) a process of bringing the sample solution containing the labeled sugar chain into contact with monolithic silica, so as to allow the monolithic silica to adsorb a sugar chain component; (process 2) a process of washing the monolithic silica with a washing liquid; and (process 3) a process of bringing the monolithic silica into contact with an eluant, so as to elute the adsorbed sugar chain. | 04-21-2011 |
20110085771 | ELECTRONIC APPARATUS, CELLULAR PHONE, FLEXIBLE CABLE AND METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE FORMING BODY - According to the electronic apparatus and cellular phone of the present invention, in an optical waveguide forming body of a flexible cable, an air layer is provided in a deforming section which experiences bending deformation as a result of the movement of a second body relative to a first body (either a pivoting or sliding movement), and the position of this air layer becomes located on the outer circumferential side of a core when the deforming section undergoes bending deformation. As a result of this, it is possible to ensure sufficient flexibility and to also achieve a sufficient improvement in the folding endurance of the core portion for this optical waveguide forming body to be utilized in practical applications. Moreover, it is possible to suppress light loss and achieve high-speed, large-capacity transmissions even when the optical waveguide forming body of a flexible cable experiences bending deformation due to the relative movement of the second body relative to the first body. | 04-14-2011 |
20110068483 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device of the present invention includes a coating process in which a pasty thermosetting resin composition having a flux activity is coated on at least either one of a substrate and a semiconductor chip; a bonding process in which the substrate and the semiconductor chip are electrically bonded while placing the pasty thermosetting resin composition in between; a curing process in which the pasty thermosetting resin composition is cured under heating; and a cooling process, succeeding to the curing process, in which cooling is performed at a cooling rate between 10[° C./hour] or above and 50[° C./hour] or below. | 03-24-2011 |
20110039157 | ANODIC CARBON MATERIAL FOR LITHIUM SECONDARY BATTERY, METHOD FOR MANUFACTURING THE SAME, LITHIUM SECONDARY BATTERY ANODE, AND LITHIUM SECONDARY BATTERY - The invention aims to improve the charge/discharge cycle characteristics of an anodic carbon material for a lithium secondary battery. An anodic carbon material for a lithium secondary battery according to the present invention comprises: particles containing carbon, or a metal or metalloid, or an alloy, oxide, nitride, or carbide thereof, the particle capable of absorbing and releasing lithium ions; a resinous carbon material enclosing the particles; and a network structure formed from carbon nanofibers and/or carbon nanotubes that bond to the surfaces of the particles and that enclose the particles. | 02-17-2011 |
20110037174 | METHOD OF MANUFACTURING SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR COMPONENT - A method of manufacturing a semiconductor component of the present invention has: obtaining a semiconductor wafer having stud electrodes formed on a functional surface thereof, and a circuit board having solder bumps on one surface and having electrode pads on the other surface thereof; bonding the semiconductor wafer and the circuit board, while providing a resin layer having a flux activity between the semiconductor wafer and the circuit board, and so as to bring the stud electrodes into contact with the solder bumps, while penetrating the resin layer having a flux activity, to thereby obtain a bonded structure; applying a solder material onto the electrode pads of the bonded structure; and dicing the bonded structure to obtain a plurality of semiconductor components. | 02-17-2011 |
20110031000 | RESIN COMPOSITION, CARRIER MATERIAL WITH RESIN, MULTI-LAYERED PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE - There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c). | 02-10-2011 |
20110024172 | MULTILAYER CIRCUIT BOARD, INSULATING SHEET, AND SEMICONDUCTOR PACKAGE USING MULTILAYER CIRCUIT BOARD - Semiconductor chip mounting yield and semiconductor package reliability deteriorate due to warpage of a multilayer circuit board. A multilayer circuit board ( | 02-03-2011 |
20110024162 | FLEXIBLE WIRING UNIT AND ELECTRONIC APPARATUS - A flexible wiring unit ( | 02-03-2011 |