20130009326 | MANUFACTURING METHOD OF CHIP PACKAGE WITH COPLANARITY CONTROLLING FEATURE - A chip package includes a substrate, an integrated circuit proximate a top surface of the substrate, and a cap comprising encapsulant that encapsulates the integrated circuit on at least a portion of the top surface of the substrate. The chip package further includes at least one extension feature positioned on at least a portion of the top surface of the substrate. The at least one extension feature also comprises the encapsulant and extends from the cap to a perimeter of the substrate. | 01-10-2013 |