| STMicroelectronics (Tours) SAS Patent applications |
| Patent application number | Title | Published |
|---|
| 20120122410 | MULTIBAND COUPLING ARCHITECTURE - A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit. | 05-17-2012 |
| 20120087052 | Method and Structure for Detecting an Overcurrent in a Triac - A method comprising: a) during at least part of a conduction phase of the triac, measuring the gate potential of the triac; and b) comparing a value based on said measurement with a reference threshold and deducing the presence or the absence of an overcurrent based on said comparison. | 04-12-2012 |
| 20120086305 | ACOUSTIC GALVANIC ISOLATION DEVICE - An electroacoustic transducer including a first electrode formed on a substrate capable of transmitting ultrasounds, a membrane formed above the first electrode and separated therefrom by a cavity, a second electrode formed on the membrane, a first insulating layer on the second electrode, and a third electrode formed on the first insulating layer. | 04-12-2012 |
| 20120068223 | BIDIRECTIONAL PROTECTION COMPONENT - A bidirectional protection component formed in a semiconductor substrate of a first conductivity type including a first implanted area of the first conductivity type, an epitaxial layer of the second conductivity type on the substrate and the first implanted area, a second area of the first conductivity type on the external side of the epitaxial layer, in front of the first area, and implanted with the same dose as the first area, a first metallization covering the entire lower surface of the substrate, and a second metallization covering the second area. | 03-22-2012 |
| 20120062333 | PACKAGED COUPLER - A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other. | 03-15-2012 |
| 20120061803 | ASYMMETRICAL BIDIRECTIONAL PROTECTION COMPONENT - An asymmetrical bidirectional protection component formed in a semiconductor substrate of a first conductivity type, including: a first implanted area of the first conductivity type; a first epitaxial layer of the second conductivity type on the substrate and the first implanted area; a second epitaxial layer of the second conductivity type on the first epitaxial layer, the second layer having a doping level different from that of the first layer; a second area of the first conductivity type on the outer surface of the epitaxial layer, opposite to the first to area; a first metallization covering the entire lower surface of the substrate; and a second metallization covering the second area. | 03-15-2012 |
| 20120061719 | SHOCKLEY DIODE HAVING A LOW TURN-ON VOLTAGE - A Shockley diode including: a vertical stack of first to fourth layers of alternated conductivity types between first and second electrodes; a recess formed in the fourth layer and extending vertically to penetrate into the second layer; a first region of same conductivity type as the second layer but of greater doping level, extending at the bottom of the recess in the second layer; and a second region of same conductivity type as the third layer but of greater doping level, extending along the lateral walls of the recess and connecting the first region to the fourth layer. | 03-15-2012 |
| 20120019211 | PROTECTION OF A THIN-LAYER BATTERY - A method for protecting a thin-layer battery connected to an intermittent load including the steps of periodically operating the battery at its maximum discharge current, and disconnecting the battery as soon as the voltage across it reaches a threshold value greater than its critical voltage for the maximum discharge current. | 01-26-2012 |
| 20120009763 | SEMICONDUCTOR CHIP MANUFACTURING METHOD - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: a) arranging the wafer on a surface of an elastic film stretched on a first support frame having dimensions much greater than the wafer dimensions, so that, in top view, a ring-shaped film portion separates this outer contour from the inner contour of the frame; b) performing manufacturing operations by using equipment capable of receiving the first frame; c) arranging, on the ring-shaped film portion, a second frame of outer dimensions smaller than the inner dimensions of the first frame; d) cutting the film between the outer contour of the second frame and the inner contour of the first frame and removing the first frame; and e) performing manufacturing operations by using equipment capable of receiving the second frame. | 01-12-2012 |
| 20110305975 | CATALYTIC PARTICULATE SOLUTION FOR A MICRO FUEL CELL AND RELATED METHOD - A catalytic particulate solution is provided for a micro fuel cell. The solution includes a suspension of catalytic nanoparticles in a solvent and a polymerizable oligomer. Also presented is a method for depositing such a catalytic particulate solution that includes a step of depositing the particulate solution onto a substrate, during which the oligomer polymerization is primed, for example, using UV lighting. | 12-15-2011 |
| 20110304014 | PASSIVE INTEGRATED CIRCUIT - A passive integrated circuit formed on a substrate, including contact areas of a conductive material specifically capable of receiving bonding pads, wherein the conductive material further creates connections between regions of a lower metallization level. | 12-15-2011 |
| 20110300647 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame. | 12-08-2011 |
| 20110299204 | ANTI-LIGHTNING PROTECTION FOR TELEPHONE CONNECTION - A structure for protecting a circuit connected to first and second rails of a telephone connection against overvoltages, including: first and second diodes in anti-series between the first and second rails; a first capacitor in parallel with a first resistor between a first node common to the first and second diodes and a low voltage reference node; and a protection element capable of removing fast overvoltages between any of the rails and the low reference voltage node when these overvoltages exceed a first threshold associated with the voltage of the first node. | 12-08-2011 |
| 20110279934 | OVERVOLTAGE PROTECTION STRUCTURE FOR A DIFFERENTIAL LINK - A structure for protecting an integrated circuit connected to first and second rails of a differential link against overvoltages, including: a first bidirectional conducting device, between the first rail and a common node; a second bidirectional conducting device, between the second rail and the common node; and a capacitor between the common node and a low reference potential rail. | 11-17-2011 |
| 20110210372 | HIGH-VOLTAGE VERTICAL POWER COMPONENT - A high-voltage vertical power component including a lightly-doped semiconductor substrate of a first conductivity type and, on the side of an upper surface, an upper semiconductor layer of the second conductivity type which does not extend all the way to the component periphery, wherein the component periphery includes, on the lower surface side, a ring-shaped diffused region of the second conductivity type extending across from one third to half of the component thickness; and on the upper surface side, an insulated ring-shaped groove crossing the substrate to penetrate into an upper portion of ring-shaped region. | 09-01-2011 |
| 20110199100 | EVALUATION OF A CHARGE IMPEDANCE AT THE OUTPUT OF A DIRECTIONAL COUPLER - A method and circuit for evaluating a charge impedance at the output of a directional coupling having a first line adapted to convey a wanted signal between a first terminal and a second terminal adapted to be connected to an antenna, and having a second line coupled to the first one including a third terminal on the side of the first terminal and a fourth terminal on the side of the second terminal, wherein the signal present on the fourth terminal is submitted to a homodyne detector having its local oscillator signal sampled from the third terminal. | 08-18-2011 |
| 20110190037 | DEVICE COMPRISING A HYDROGEN-AIR OR METHANOL-AIR TYPE FUEL CELL - A device comprising a chamber in which a hydrogen-air or methanol-air type fuel cell is arranged, the chamber including an upper wall in which an opening is formed, a lower wall on which the cell is arranged so that the surface of exposure to air of the cell faces the upper wall, and a fan arranged in the opening. | 08-04-2011 |
| 20110140521 | MULTIPLE-LEVEL SWITCHED-MODE POWER SUPPLY - A circuit for providing at least two power supply voltages from a D.C. voltage provided by a first switched-mode converter between a first and a second terminals, wherein: a second reversible buck-type switched-mode converter is powered with said D.C. voltage; a capacitive dividing bridge connects said first and second terminals, the midpoint of the capacitive dividing bridge corresponding to the output of the second converter and defining a third terminal of provision of an intermediary potential; and said two power supply voltages are respectively sampled between the first and third and between the third and second terminals. | 06-16-2011 |
| 20110124157 | METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER - A method for encapsulating electronic components, including the steps of: forming, in a first surface of a semiconductor wafer, electronic components; forming, on the first surface, an interconnection stack including conductive tracks and vias separated by an insulating material; forming first and second bonding pads on the interconnection stack; thinning down the wafer, except at least on its contour; filling the thinned-down region with a first resin layer; arranging at least one first chip on the first bonding pads and forming solder bumps on the second bonding pads; depositing a second resin layer covering the first chips and partially covering the solder bumps; bonding an adhesive strip on the first resin layer; and scribing the structure into individual chips. | 05-26-2011 |
| 20110121429 | LOW-VOLTAGE BIDIRECTIONAL PROTECTION DIODE - A vertical bidirectional protection diode including, on a heavily-doped substrate of a first conductivity type, first, second, and third regions of the first, second, and first conductivity types, these regions all having a doping level greater than from 2 to 5×10 | 05-26-2011 |
| 20110117271 | METHOD FOR FORMING A SEED LAYER FOR THE DEPOSITION OF A METAL ON A SUBSTRATE - A method for forming, on a substrate, a seed layer enabling the subsequent deposition of a metal layer, including the step of immersing the substrate in a bath containing a material from the ethoxysilane or siloxane family and a copper or nickel amidinate. | 05-19-2011 |
| 20110111281 | METHOD FOR FORMING A THIN-FILM LITHIUM-ION BATTERY - A method for forming an integrated lithium-ion type battery, including the successive steps of: forming, on a substrate, a stack of a cathode layer made of a material capable of receiving lithium ions, an electrolyte layer, and an anode layer of the battery; forming a short-circuit between the anode and cathode layers; performing a thermal evaporation of lithium; and opening the short-circuit between the anode and cathode layers. | 05-12-2011 |
| 20110109368 | Sensor Connection Circuit - A circuit for converting the state of a sensor into a signal interpretable by an electronic circuit, including: a comparator of the voltage level of an input terminal with respect to a reference level, the sensor being intended to be connected between a terminal of application of a first power supply voltage and the input terminal; a current-limiting element between said input terminal and the ground; and a switching element in series with the current source and intended to be controlled by a pulse train. | 05-12-2011 |
| 20110076568 | METHOD FOR FORMING A VERTICAL THIN-FILM LITHIUM-ION BATTERY - A method for forming a lithium-ion type battery, including the successive steps of: forming, in a substrate, a trench; successively and conformally depositing a stack including a cathode collector layer, a cathode layer, an electrolyte layer, and an anode layer, this stack having a thickness smaller than the depth of the trench; forming, over the structure, an anode collector layer filling the space remaining in the trench; and planarizing the structure to expose the upper surface of the cathode collector layer. | 03-31-2011 |
| 20110076567 | METHOD FOR FORMING A THIN-FILM LITHIUM-ION BATTERY - A method for forming a lithium-ion type battery including the steps of forming, over an at least locally conductive substrate, an insulating layer having a through opening; successively and conformally depositing a stack comprising a cathode collector layer, a cathode layer, an electrolyte layer, and an anode layer, this stack having a thickness smaller than the thickness of the insulating layer; forming, over the structure, an anode collector layer filling the space remaining in the opening; and planarizing the structure to expose the upper surface of the insulating layer. | 03-31-2011 |
| 20110052979 | METHOD OF DIRECT ENCAPSULATION OF A THIN-FILM LITHIUM-ION TYPE BATTERY ON THE SUBSTRATE - A method for encapsulating a thin-film lithium-ion type battery, including the steps of: forming, on a substrate, an active stack having as a lower layer a cathode collector layer extending over a surface area larger than the surface area of the other layers; forming, over the structure, a passivation layer including through openings at locations intended to receive anode collector and cathode collector contacts; forming first and second separate portions of an under-bump metallization, the first portions being located on the walls and the bottom of the openings, the second portions covering the passivation layer; and forming an encapsulation layer over the entire structure. | 03-03-2011 |
| 20110018518 | BOOST/BUCK CONVERTER AND METHOD FOR CONTROLLING IT - A power supply circuit capable of providing two regulated voltages based on a D.C. input voltage, including a boost converter and a buck-boost converter, the circuit including a single inductive element common to the boost and buck-boost converters. | 01-27-2011 |
| 20110006423 | SURFACE-MOUNTED SILICON CHIP - A silicon chip surface mounted via balls attached to its front surface, wherein the front and rear surfaces of the chip are covered with a thermosetting epoxy resin having the following characteristics: the resin contains a proportion ranging from 45 to 60% by weight of a load formed of carbon fiber particles with a maximum size of 20 μm and with its largest portion having a diameter ranging between 2 and 8 μm, on the front surface side, the loaded resin covers from 45 to 60% of the ball height, on the rear surface side, the loaded resin has a thickness ranging between 80 and 150 μm. | 01-13-2011 |
| 20110001575 | MULTIBAND COUPLING CIRCUIT - A distributed multiband coupling circuit including: a number n of first and of second terminals equal to the number of frequency bands; a third terminal and a fourth terminal; a number n of distributed couplers equal to the number of frequency bands, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports intended to convey a signal to be transmitted in the concerned frequency band, and a second conductive line coupled to the first one between third and fourth ports; a first set of resistive splitters in cascade between the third ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the third terminal of the coupling circuit; and a second set of resistive splitters in cascade between the fourth ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the fourth terminal of the coupling circuit. | 01-06-2011 |
| 20100317411 | FUEL CELL PROTECTION DEVICE - A hydrogen-air fuel cell having a mobile element capable of, in closed position, covering the cell cathode in substantially tight fashion. | 12-16-2010 |
| 20100315006 | CIRCUIT FOR CONTROLLING A LIGHTING UNIT WITH LIGHT-EMITTING DIODES - A circuit capable of receiving, in series with at least one light-emitting diode, a rectified A.C. voltage, comprising: a first gate turn-off thyristor connected to first and second terminals of the circuit; and a control circuit for turning off the first thyristor when the voltage between the first and second terminals exceeds a threshold. | 12-16-2010 |
| 20100277256 | COMMON-MODE FILTER WITH COUPLED INDUCTANCES - A common-mode filter including, in series between a first input terminal and a first output terminal, a first and a second positively coupled inductive elements; in series between a second input terminal and a second output terminal, a third and a fourth positively coupled inductive elements; and in series between each midpoint of said series connections of inductive elements and the ground, a capacitive element and a fifth inductive element. | 11-04-2010 |
| 20100277254 | COMMON-MODE FILTER - A common-mode filter including two input terminals and two output terminals and, in series between each input or output terminal and the ground, a capacitive element and a first inductive element. | 11-04-2010 |
| 20100237843 | SWITCHED-MODE POWER SUPPLY - A switched-mode converter including a first magnetic circuit including a first inductive element, coupled to at least one second inductive element and electrically in series with this second element and with a first diode between a first one of two input terminals and a first one of two output terminals; a first switch in series with a third inductive element between a second terminal of the first inductive element and a second input terminal, a common node between the first switch and the third inductive element being connected to one of the output terminals by a second diode; and a circuit capable of canceling the voltage across this first switch before its turning-on. | 09-23-2010 |
| 20100187650 | INSULATED WELL WITH A LOW STRAY CAPACITANCE FOR ELECTRONIC COMPONENTS - A structure including at least one electronic component formed in a semiconductor stack comprising a heavily-doped buried silicon layer of a first conductivity type extending on a lightly-doped silicon substrate of a second conductivity type and a vertical insulating trench surrounding the component. The trench penetrates, into the silicon substrate, under the silicon layer, down to a depth greater than the thickness of the space charge region in the silicon substrate. | 07-29-2010 |
| 20100183954 | WATER MANAGEMENT IN A FUEL CELL - A hydrogen-oxygen fuel cell including, on the anode side, a hydrogen storage buffer chamber. The buffer chamber includes a wall having at least a semi-permeable portion, impermeable to gases (hydrogen-oxygen-air) and permeable to water. | 07-22-2010 |
| 20100183932 | HUMIDITY REGULATION FUEL CELL - A hydrogen-oxygen fuel cell including a main cell and an auxiliary cell sharing a common electrolyte and having at least one separate electrode, circuitry for measuring the humidity ratio of the electrolyte, and control and switching circuitry for operating the main and auxiliary cells in parallel on a same load or separately on two different loads. | 07-22-2010 |
| 20100178595 | FUEL CELL ELECTRODE - A hydrogen-oxygen fuel cell including an electrolyte sandwiched between two catalyst layers or sheets, each catalyst layer or sheet being in contact with a porous electrode, in which one or several catalyst layers or sheets and one or several electrode layers or sheets interpenetrate. | 07-15-2010 |
| 20100167667 | SETTING OF A BALUN - A balun including on the common-mode side, an inductive element in series with a first capacitive element between a first common-mode access terminal and the ground; and on the differential-mode side, two inductive windings in series having first respective ends defining differential access terminals and having second common ends connected to ground, second capacitive elements being respectively connected in parallel on the differential-mode windings. | 07-01-2010 |
| 20100130265 | DEVICE AND METHOD FOR CONTROLLING THE HUMIDIFICATION OF A FUEL CELL - An oxygen/hydrogen fuel cell including a package having, on the side of the cell intended to be exposed to air, an enclosure provided with a mobile cap; an element made of a material which deforms according to the humidity ratio in the package; circuitry for controlling the opening and the closing of the mobile cap; and a switch which opens and closes according to the deformation of said material, said switch being associated with control means. | 05-27-2010 |
| 20100055507 | HIGH-DENSITY 3-DIMENSIONAL STRUCTURE - A 3-D structure formed in a recess of a substrate delimited by walls, including a large number of rectangle parallelepipedic blades extending from the bottom of the recess to the substrate surface while being oriented perpendicularly to one another and formed in a pattern covering the whole surface of the recess, some blades being non-secant to one of the walls, each non-secant blade being connected to one of the walls by at least another perpendicular blade. | 03-04-2010 |
| 20100044831 | MULTI-LAYER FILM CAPACITOR WITH TAPERED FILM SIDEWALLS - A multi-layer capacitor of staggered construction is formed of one or more layers having tapered sidewall(s). The edge(s) of the capacitor film(s) can be etched to have a gentle slope, which can improve adhesion of the overlying layers and provide more uniform film thickness. The multi-layer capacitor can be used in various applications such as filtering and decoupling. | 02-25-2010 |
| 20100022203 | CIRCUIT INTEGRATING A TUNABLE ANTENNA WITH A STANDING WAVE RATE CORRECTION - An integrated electronic radio-frequency transceiver circuit, including: at least one terminal intended to receive a signal to be transmitted or to transmit a received signal; at least one planar antenna, with a settable resonance frequency; at least one bidirectional coupler having a primary line interposed between the terminal and the antenna and having the respective terminals of a secondary line providing data representative of the transmitted power and of the power reflected on the primary line side; at least one detector of the transmitted power and of the reflected power; and a circuit for selecting the resonance frequency of the antenna according to the ratio between the transmitted power and the reflected power. | 01-28-2010 |
| 20100019983 | DETECTION OF THE VALUE OF AN IMPEDANCE OF A RADIOFREQUENCY SYSTEM - A method and a device for determining the amplitude and the phase of an impedance connected on a transmission line, including a bidirectional coupler having a first line interposed on the transmission line and having a second line providing at its respective ends two measurement signals, and a balun having its respective differential-mode inputs receiving data representative of the measurement signals. | 01-28-2010 |
| 20100001810 | INTEGRATED DIRECTIONAL COUPLER - A coupler including: a first conductive line intended to convey a signal to be transmitted between first and second terminals; a second conductive line, coupled to the first one and having one end intended to provide, on a third terminal, data relative to a signal reflected on the second terminal; and an inductive and/or capacitive impedance matching circuit, interposed between the other end of the second line and a fourth terminal of the coupler. | 01-07-2010 |
| 20090186255 | CASE FOR MINIATURE FUEL CELLS - A case for fuel cells including an upper plate formed of a stack of a first insulating board, portions of a first conductive layer, a second insulating board, and a second conductive layer, this stack including windows, fuel cells being placed under the first insulating board at the level of the windows to obstruct them, the stack further comprising first openings filled with a heat-transmitting material forming a contact between the periphery of the fuel cells and the second conductive layer. | 07-23-2009 |
| 20090128255 | INTEGRATED BIDIRECTIONAL COUPLER - A distributed-line directional coupler including: a first conductive line between first and second ports intended to convey a signal to be transmitted; and a second conductive line, coupled to the first one, between third and fourth ports, the second line being interrupted approximately at its middle, the two intermediary ends being connected to attenuators. | 05-21-2009 |
