| STMicroelectronics R&D Limited Patent applications |
| Patent application number | Title | Published |
|---|
| 20110158853 | PIXEL-TYPE BIOLOGICAL ANALYSIS DEVICE, BIOSENSOR, AND FABRICATION PROCESSES THEREOF - The disclosure relates to a pixel-type biological analysis device comprising a photosensitive layer, a capture mixture for the capture of targeted proteins, the capture mixture being placed on an external surface of the photosensitive layer and comprising a protein probe grafted to a hydrogel, collection means for collecting photoelectrons in the photosensitive layer, and reading and treatment means of an electrical quantity supplied by the collection means, for the supply of a characteristic value of a luminous intensity detected by the photosensitive layer. | 06-30-2011 |
| 20110140208 | FABRICATION PROCESS OF A BIOSENSOR ON A SEMICONDUCTOR SUBSTRATE - The disclosure relates to a fabrication process of a biosensor on a semiconductor wafer, comprising steps of: making a central photosensitive zone comprising at least one pixel-type biological analysis device comprising a photosensitive layer, and a first peripheral zone surrounding the central photosensitive zone, comprising electronic circuits. The first peripheral zone is covered by a hydrophilic coating, and the central photosensitive zone is covered with a hydrophobic coating. A barrier of a bio-compatible resin is formed on the second peripheral zone. | 06-16-2011 |
| 20090267172 | METHOD OF MANUFACTURING AN IMAGE SENSING MICROMODULE - A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity. | 10-29-2009 |
