| STMICROELECTRONICS ASIA PACIFIC PTE LTD Patent applications |
| Patent application number | Title | Published |
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| 20120133836 | FRAME LEVEL QUANTIZATION ESTIMATION - A frame level noise estimate for an image can be determined. An image processor includes a high pass filter unit configured to perform high-pass spatial filtering of image data for first and second frames to produce high-pass spatially filtered information for the first frame and the second frame. A cumulative histogram generator is configured to analyze the high-pass spatially filtered information for the first frame and the second frame to produce a first cumulative histogram for the first frame and a second cumulative histogram for the second frame. A comparator is configured to determine a difference value between the first and second cumulative histograms. A mapping unit is configured to determine an estimated noise value based on the difference value. | 05-31-2012 |
| 20120133391 | CIRCUIT AND METHOD FOR ADDING DITHER TO VERTICAL DROOP COMPENSATION USING LINEAR FEEDBACK SHIFT REGISTERS - Vertical dithering is performed for vertical droop compensation in image processing using Linear Feedback Shift Registers (LFSRs). Line memories are not used. A compensation circuit includes a signature reload input signal coupled to the input of five LFSRs. Each LFSR includes a signature store. The output of each LFSR provides a sequence output signal that is gated with a corresponding enable signal in a first logic circuit. The output of all of the first logic circuits are combined in a second logic circuit to provide a control signal output. | 05-31-2012 |
| 20120133284 | SYSTEM FOR REPROGRAMMING POWER PARAMETERS FOR LIGHT EMITTING DIODES - According to an embodiment of the present disclosure, a plurality of light-emitting diode (LED) modules in series are monitored. When an LED module is detected as failing or operating inadequately, a bypass switch removes the particular LED module from the series and the voltage provided to the series is modified. When the LED modules are detected as having too high of a temperature, the current provided to the LED modules is limited. | 05-31-2012 |
| 20120120001 | CHARGE AMPLIFIER FOR MULTI-TOUCH CAPACITIVE TOUCH-SCREEN - A circuit for measuring the cross-capacitance of a touch-screen sensor includes a charge amplifier having an input for coupling to the touch-screen sensor and an output for providing a voltage pulse, and a measurement delay chain having an input coupled to the output, and an output for providing a digitized output signal of the voltage pulse width, which is proportional to the value of the cross-capacitance. | 05-17-2012 |
| 20120114080 | DETERMINING RESPONSES OF RAPIDLY VARYING MIMO-OFDM COMMUNICATION CHANNELS USING OBSERVATION SCALARS - In an embodiment, a channel estimator includes first, second, and third stages. The first stage is configurable to generate a first observation scalar for a first communication path of a first communication channel, and the second stage is configurable to generate a second observation scalar for a first communication path of a second communication channel. And the third stage is configurable to generate channel-estimation coefficients in response to the first and second observation scalars. For example, such a channel estimator may use a recursive algorithm, such as a Vector State Scalar Observation (VSSO) Kalman algorithm, to estimate the responses of channels over which propagate simultaneous orthogonal-frequency-division-multiplexed (OFDM) signals (e.g., MIMO-OFDM signals) that suffer from inter-carrier interference (ICI) due to Doppler spread. Such a channel estimator may estimate the channel responses more accurately, more efficiently, with a less-complex algorithm, and with less-complex software or circuitry, than conventional channel estimators. | 05-10-2012 |
| 20120114069 | PILOT PATTERN FOR OBSERVATION SCALAR MIMO-OFDM - In an embodiment, a transmitter includes first and second transmission paths. The first transmission path is configurable to generate first pilot clusters each including a respective first pilot subsymbol in a first cluster position, and the second transmission path is configurable to generate second pilot clusters each including a respective second pilot subsymbol in a second cluster position such that a vector formed by the first pilot subsymbols is orthogonal to a vector formed by the second pilot subsymbols. For example, where such a transmitter transmits simultaneous orthogonal-frequency-division-multiplexed (OFDM) signals (e.g., MIMO-OFDM signals) over respective channels that may impart inter-carrier interference (ICI) to the signals due to Doppler spread, the pattern of the pilot symbols that compose the pilot clusters may allow a receiver of these signals to use a recursive algorithm, such as a Vector State Scalar Observation (VSSO) Kalman algorithm, to estimate the responses of these channels. | 05-10-2012 |
| 20120114053 | DETERMINING A RESPONSE OF A RAPIDLY VARYING OFDM COMMUNICATION CHANNEL USING AN OBSERVATION SCALAR - In an embodiment, a channel estimator includes first and second stages. The first stage is configurable to generate an observation scalar for a communication path of a communication channel, and the second stage is configurable to generate channel-estimation coefficients in response to the first observation scalar. For example, such a channel estimator may use a recursive algorithm, such as a VSSO Kalman algorithm, to estimate the response of a channel over which propagates an OFDM signal that suffers from ICI due to Doppler spread. Such a channel estimator may estimate the channel response more accurately, more efficiently, with a less-complex algorithm, and with less-complex software or circuitry, than conventional channel estimators. Furthermore, such a channel estimator may be able to dynamically account for changes in the number of communication paths that compose the channel, changes in the delays of these paths, and changes in the signal-energy levels of these paths. | 05-10-2012 |
| 20120112817 | METHOD AND APPARATUS FOR CAPACITANCE SENSING - A capacitance-to-digital converter for an extended range of capacitances includes a reference capacitor and one or more offset capacitors. Electrical charge accumulated in the offset capacitors is used to at least partially cancel the charge accumulated in a sensed capacitance to facilitate matching with a charge accumulated in the reference capacitor. The residual charge is passed to an integrator, the output from which is quantized and used to control switching of the capacitors. Immunity to tonal external noises and improved conversion speed are achieved by controlling the capacitor switching with a spread spectrum clock. The capacitance-to-digital converter may be used, for example, for sensing of the capacitances of capacitive elements in touch and proximity displays or other user interfaces. | 05-10-2012 |
| 20120112803 | PROCESS, TEMPERATURE, PART AND SETTING INDEPENDENT RESET PULSE ENCODING AND DECODING SCHEME - A method of generating a reset signal for an integrated circuit without a dedicated reset pin includes calibrating a first clock pulse from a clock signal, measuring a second clock pulse from the clock signal, measuring a third clock pulse from the clock signal, and generating an internal reset signal if the first clock pulse width is longer than a predetermined minimum clock pulse width, if the second clock pulse is within an expected first value range, and if the third clock pulse is within an expected second value range. | 05-10-2012 |
| 20120105713 | LOW PROFILE CHIP SCALE MODULE AND METHOD OF PRODUCING THE SAME - A low profile chip scale module and method of making of the same. The low profile chip scale module includes embedded SMD and integrated EM shielding. An adhesive layer is arranged on a substrate, e.g., chip carrier. Dies and SMDs are arranged on the adhesive layer. An etched frame and molding is attached to the substrate. Inputs/outputs (I/O) are formed and the substrate is coated with a dielectric material. Metal lines and connections among bond pads are formed and another layer of dielectric material is applied as a protective layer. The substrate is cut into various predetermined sizes and a lens is attached to form the chip scale module. | 05-03-2012 |
| 20120098973 | AUTOMATIC FREQUENCY SELECTION FOR PEAKING - An automatic frequency selection circuit includes a base filter for receiving a video input, a peaking filter for receiving the video input, a first energy computation unit coupled to an output of the base filter, a second energy computation unit coupled to an output of the peaking filter, an automatic frequency control unit to compare relative measured energies of the first and second energy computation units and to output a temporarily stable selected frequency for a targeted attenuation, and a frame delay feedback unit for receiving the temporarily stable selected frequency coupled to the peaking filter. | 04-26-2012 |
| 20120092358 | Noise-robust edge enhancement system and method for improved image sharpness - A system for edge enhancement includes an input unit to receive an input signal Yin, a vertical enhancement unit to perform a vertical enhancement of an edge of the input signal Yin to generate an output YEV, and a horizontal enhancement unit to perform a horizontal enhancement of the edge of the input signal Yin to generate an output YEH. The system also includes a local gradient analysis unit to generate a local gradient direction GradDir and a local gradient magnitude GradMag based at least partly upon the input signal Yin, and a mixer to generate an output Yout by mixing the output YEV with the output YEH using the local gradient direction GradDir. The system further includes an output unit to output the output Yout. | 04-19-2012 |
| 20120092201 | System and method for compact cyclic digital to analog converter - A system for implementing a cyclic digital to analog converter (c-DAC) is capable of supporting a large size liquid crystal display. The system includes an upper DAC stage configured to output a first voltage between a lower voltage supply (HVDD) and an upper voltage supply (AVDD). The system also includes a lower DAC stage configured to output a second voltage between the lower voltage supply (HVDD) and a ground. The upper DAC stage includes a single PMOS switch and the lower DAC stage includes a single NMOS switch. | 04-19-2012 |
| 20120085748 | CLOSED LOOP TEMPERATURE CONTROLLED CIRCUIT TO IMPROVE DEVICE STABILITY - An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range. | 04-12-2012 |
| 20120074592 | WAFER-LEVEL PACKAGING METHOD USING COMPOSITE MATERIAL AS A BASE - An electronic package that includes a composite material base. In one embodiment the electronic package is an expanded wafer-level package. The composite material base is composed of woven strands and polymer material. In one embodiment the composite material base is composed of woven fiberglass strands and an epoxy material. In various embodiments the package includes an electronic circuitry layer on one or another face of the composite material base. In other embodiments conductive vias connect the circuitry layers, including a redistribution layer. In yet another embodiment an electronic package is mounted on the composite material base and electrically couples to the circuit of the expanded wafer-level package. The package having the composite material base is mechanically stronger and can be made thinner than a package that relies on an encapsulant material for structure, and resists cracking. | 03-29-2012 |
| 20120070145 | METHOD AND SYSTEM FOR SHIELDING SEMICONDUCTOR DEVICES FROM LIGHT - The present disclosure is directed to a camera module that includes at least a semiconducting die, an image-sensing circuit, a lens, a lens aperture, and a coating that adheres to an exterior surface of the camera module. The coating is opaque to light and prevents light from accessing the camera other than through the lens aperture. The opaque coating is applied as a fluid and is cured. In one embodiment, a mask material is selectively applied to exterior surfaces of the semiconducting die, electrical interconnect layers, glass layers, the lens body, or the lens aperture. After applying the opaque coating, the selectively applied mask material is removed. Methods of selectively applying a mask material include applying a conformable and peelably releasable dope-like material, placing an array of joined, selectively shaped rigid masks over an array of assemblies, and applying a conformable mask material that is heat-expandable. | 03-22-2012 |
| 20120058255 | CARBON NANOTUBE-CONDUCTIVE POLYMER COMPOSITES, METHODS OF MAKING AND ARTICLES MADE THEREFROM - Electrically conductive polymer materials, such as mixtures of poly(3,4-ethylenedioxythiophene) (PEDOT) and poly(styrenesulfonate) (PSS) are combined with functionalized carbon nanotubes to form composites that exhibit increased electrical conductivity. Functionalized or non-functionalized carbon nanotubes combined with the same electrically conductive polymer materials are combined with non-conductive polymers to increase the electrical conductivity of the non-conductive polymer. The functionalized carbon nanotubes are functionalized with carboxyl and/or hydroxyl groups. The resulting materials are useful in methods of forming electrically conductive films and electrically conductive features. | 03-08-2012 |
| 20120056821 | METHOD TO PARAMETERIZE AND RECOGNIZE CIRCULAR GESTURES ON TOUCH SENSITIVE SURFACES - A method to parameterize and recognize circular gestures on touch sensitive surfaces includes dividing the touch sensitive surface into four quadrants, detecting a transition from a first quadrant into a second quadrant, time-stamping and tracking each detected quadrant transition, and computing the time between quadrant transitions so that the circular speed and direction of the circular gestures on the touch sensitive surface can be detected. The detected direction can be either a clockwise or a counter-clockwise direction. | 03-08-2012 |
| 20120045008 | PILOT PATTERN FOR MIMO OFDM - In an embodiment, a transmitter includes a transmission path that is configurable to generate first pilot clusters each including a respective first pilot subsymbol in a first cluster position and a respective second pilot subsymbol in a second cluster position such that a vector formed by the first pilot subsymbols is orthogonal to a vector formed by the second pilot subsymbols. For example, where such a transmitter transmits simultaneous orthogonal-frequency-division-multiplexed (OFDM) signals (e.g., MIMO-OFDM signals) over respective channels that may impart inter-carrier interference (ICI) to the signals due to Doppler spread, the pattern of the pilot symbols that compose the pilot clusters may allow a receiver of these signals to estimate the responses of these channels more accurately than conventional receivers. | 02-23-2012 |
| 20120035936 | INFORMATION REUSE IN LOW POWER SCALABLE HYBRID AUDIO ENCODERS - A system and method of reusing information in low power scalable hybrid audio encoders. The system and method provides a transform coder and parameterization of high frequency spectrum (SBR). | 02-09-2012 |
| 20120028397 | ULTRA-THIN QUAD FLAT NO-LEAD (QFN) PACKAGE - An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically connected to the plurality of lead terminals and a molding compound encapsulates the leadframe and die together so as to form the ultra-thin QFN package. Accordingly, the substantially aligned contact areas are exposed on both the top and bottom surfaces of the package. The present disclosure also provides an ultra-thin Optical Quad Flat No-Lead (OQFN) semiconductor chip package, a stacked semiconductor module comprising at least two QFN semiconductor chip packages, and a method for manufacturing an ultra-thin Quad Flat No-Lead (QFN) semiconductor packages. | 02-02-2012 |
| 20120001643 | SENSING PHASE SEQUENCE TO SUPPRESS SINGLE TONE NOISE - A noise suppression method for a capacitance-to-voltage converter varies a sequence of sensing signal edges during a plurality capacitance measurements to produce a number of noise responses. The sensing signal edges are varied in a repetitive rising and falling edge pattern for each sequence. Three or more such sequences can be used, and the sequence with the highest noise is eliminated and the others are averaged. The noise suppression method can be implemented during calibration and then used for a number of normal acquisitions. The noise suppression method can be applied to capacitance-to-voltage converters having monitoring and integration phases. | 01-05-2012 |
| 20110316812 | IMAGE SENSOR CONTROL OVER A VARIABLE FUNCTION OR OPERATION - A device has a variable function or operation. An image sensor system is provided for the device. The image sensor system is responsive to light rays indicative of whether an object is present on an imaging window. For example, the image sensor system may be of the frustrated total internal reflection type, the light rays detected by the image sensor system comprising reflected light from the window at locations where the object is not present. The image sensor system outputs image information indicative of the detection of the light rays. A processing circuit processes the image information to detect the presence of the object on the imaging window. A control signal is generated by the processing circuit in response to that detected presence, the control signal causing the variable function or operation of the device to vary in response to the detected presence and/or movement of the object. | 12-29-2011 |
| 20110261550 | USE OF CONDUCTIVE PAINT AS A METHOD OF ELECTROMAGNETIC INTERFERENCE SHIELDING ON SEMICONDUCTOR DEVICES - A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one embodiment, the conductive paint is sprayed onto exterior surfaces of an electronic module or device from a spray gun. The sprayed conductive paint is cured to remove the fluidic carrier, leaving a metal film coated to the outside of the module or device. In one embodiment used with electronic packages in array form, grooves are cut into an encapsulation material of a module so that the shield protection includes sidewalls of the package. In another embodiment used with camera modules, masking is used to selectively shield portions of the module. In a further embodiment, the shield is electrically connected to a ground conductor of a circuit of the electronic module. | 10-27-2011 |
| 20110242052 | MULTIPLE TOUCH LOCATION IN A THREE DIMENSIONAL TOUCH SCREEN SENSOR - A touch screen capable of correctly identifying multiple touches employs multiple active line arrays oriented to provide multi-dimensional data. Three arrays of capacitance based active lines are each distinctly oriented to form a plurality of intersections. A first and second array are generally oriented perpendicularly while a third array is oriented to bisect the resulting matrix such that the active lines of the third array also intersect the existing vertices. As a result of a touch each active line array identifies the location of the touch from three distinct directions. Ambiguity from dual touch scenarios existing in dual array systems is removed by providing an additional reference. | 10-06-2011 |
| 20110241843 | BATTERY-LESS OPERATED BI-STABLE DISPLAY BY WIRELESS POWER TRANSMISSION - Updating content of e-paper ESL device(s) otherwise in a powered-down state is disclosed. One or more e-paper ESL devices need only be turned on when it is desired or needed to change and update content displayed. Transmission of a wireless energy burst having a magnetic resonating power coupling characteristic powers up the e-paper ESL device from a powered-down to powered-up state. The content of the e-paper ESL device can then be changed in accordance with data and instructions transmitted with the wireless energy burst. | 10-06-2011 |
| 20110234528 | SAMPLE AND HOLD CAPACITANCE TO DIGITAL CONVERTER - A circuit for converting charge measured from a touch screen into a digital signal can include a sample and hold circuit. The sample and hold circuit can sample and integrate a charge from a capacitive sense matrix, and hold a voltage signal representing the measured charge. A sigma delta converter can convert the voltage into a digital value. | 09-29-2011 |
| 20110221580 | MINIMIZATION OF POWER CONSUMPTION OF REMOTE CONTROLLED APPLIANCES - Power consumption of an appliance under remote control is minimized. The appliance receives a wireless energy burst having a wireless magnetic resonating power coupling characteristic transmitted by a remote control device. The appliance is powered up from a powered-down state to a standby mode if the appliance is in the powered-down state when the wireless energy burst is received and the energy burst is of sufficient energy to activate a switched mode power supply of the appliance. | 09-15-2011 |
| 20110216906 | ENABLING 3D SOUND REPRODUCTION USING A 2D SPEAKER ARRANGEMENT - The perception of 3D sound positioning can be achieved using a 2D arrangement of speakers positioned around the listener. The disclosed techniques can enable listeners to perceive sounds as coming from above and/or below them, without the need for positioning speakers above and/or below the listener. In some embodiments, elevation information can be included in the X and Y horizontal components of the 2D ambisonics encoding. The X and Y components can be decoded using 2D ambisonics decoding. Suitable filtering may be performed on the decoded sound information to enhance the listener's perception of the elevation information encoded in the X and Y components. | 09-08-2011 |
| 20110210808 | SWITCH WITH INCREASED MAGNETIC SENSITIVITY - Switches that are actuated through exposure to a magnetic field are described. Such switches include conductive portions that are electrically separate from one another when in an open switch configuration. A mobile element of a switch includes one or more anchoring members that are in electrical contact with one of the conductive portions. The mobile element also has a beam that is attached to the one or more anchoring members. The beam can be attached to the one or more anchoring members by flexures. In some cases, the beam includes a plurality of strips. The beam has an end portion that is configured to move toward the other conductive portion when exposed to an external force, such as a magnetic field. When the mobile element electrically contacts the other conductive portion of the substrate, an electrical pathway is established between the conductive portions, giving rise to a closed switch configuration. Various configurations of anchoring members may significantly decrease initial upward beam deformation upon manufacture of the mobile element, resulting in an increased sensitivity upon exposure to a magnetic field. Methods for manufacturing switches that exhibit increased sensitivity to magnetic fields are also disclosed. Switches described can be formed using semiconductor manufacturing techniques. Methods described also include forming a beam that is attached to one or more anchoring members where an end portion of the beam moves in a substantially downward direction upon exposure to a magnetic field of sufficient intensity. | 09-01-2011 |
| 20110198559 | CNT DEVICES, LOW-TEMPERATURE FABRICATION OF CTN AND CNT PHOTO-RESISTS - A method is provided for growth of carbon nanotube (CNT) synthesis at a low temperature. The method includes preparing a catalyst by placing the catalyst between two metal layers of high chemical potential on a substrate, depositing such placed catalyst on a surface of a wafer, and reactivating the catalyst in a high vacuum at a room temperature in a catalyst preparation chamber to prevent a deactivation of the catalyst. The method also includes growing carbon nanotubes on the substrate in the high vacuum in a CNT growth chamber after preparing the catalyst. | 08-18-2011 |
| 20110181787 | IMAGE DETAILS PRESERVATION AND ENHANCEMENT - The appearance of image details can be preserved and/or enhanced by applying contrast adaptive gain to the high spatial frequency component of the luminance information. The image details in bright and/or dark regions can be further boosted by applying a local mean adaptive gain. The contrast transfer mapping curve for luminance contrast enhancement can be re-scaled to account for the applied gain. The re-scaling may be performed from frame to frame of displayed video. The re-scaling may be temporally controlled for subsequent frames to make the re-scaling change gradually to prevent flickering. | 07-28-2011 |
| 20110176696 | METHOD AND SYSTEM FOR ENHANCING BASS EFFECT IN AUDIO SIGNALS - The quality of music output from audio systems is improved by simulating the effect of low frequency signals in the human ear. This thus allows listeners to perceive the lower frequency signals, even though the speakers may be incapable of providing such low frequency outputs. Method and systems provided for processing enhancing bass effect in audio signals. Said method and systems result in the bass enhancement being computationally less intensive. The bass effect enhancement techniques described are based on the response of sine and cosine transfer functions and on the directional independence of low frequency components. The human ear is unable to resolve directions from low frequency components. The bass effect enhancement technique alternatively is based on response of an exponential transfer function. | 07-21-2011 |
| 20110170940 | Drop Away Toothpaste Tube/Brush - A dispensing toothbrush includes a removable insert tooth paste tube for self application. This One for All design allows easy storage of tooth paste within the brush itself. It is simpler and different than other dispensing designs in that the tooth paste is not traveling through the length of a hollow tube to the bristles. The user simply unscrews the tube by twisting the cap off the bottom allowing self application. The user squeezes the flexing tube applying the toothpaste to the bristles. Storage of the toothpaste in the brush for subsequent self application is the major difference from other U.S. Patents. Again as in the other design, safety is a major concern with any dispensing toothbrush and this design allows for cleaning the brush the same as with any non-dispensing toothbrush. | 07-14-2011 |
| 20110157853 | FAN-OUT WAFER LEVEL PACKAGE WITH POLYMERIC LAYER FOR HIGH RELIABILITY - A polymeric layer encompassing the solder elements of a ball grid array in an electronics package. The polymeric layer reinforces the solder bond at the solder ball-component interface by encasing the elements of the ball grid array in a rigid polymer layer that is adhered to the package structure. Stress applied to the package through the ball grid array is transmitted to the package structure through the polymeric layer, bypassing the solder joint and improving mechanical and electrical circuit reliability. In one embodiment of a method for making the polymeric layer, solder elements bonded to external pads on a structure of the package are submerged in a fluidic form of the polymeric layer. The fluidic form is solidified and then a portion of the resulting polymeric layer is removed to make the solder elements accessible for mounting the package to a printed circuit board or other external circuit. | 06-30-2011 |
| 20110157452 | FAN-OUT WAFER LEVEL PACKAGE FOR AN OPTICAL SENSOR AND METHOD OF MANUFACTURE THEREOF - An optical sensor package has a transparent substrate with a redistribution layer formed on a face thereof, which includes a window and a plurality of electrically conductive traces. A semiconductor substrate, including an optical sensor and a plurality of contact terminals on a face thereof, is positioned on the transparent substrate in a face-to-face arrangement, with the optical sensor directly opposite the window, and with each of the contact terminals electrically coupled to a respective one of the electrically conductive terminals. The transparent substrate has larger overall dimensions than the semiconductor substrate, so that one or more edges of the transparent substrate extend beyond the corresponding edges of the semiconductor substrate. A plurality of solder balls are positioned on the face of the transparent substrate, each in electrical contact with a respective one of the electrically conductive terminals. The solder balls and the semiconductor substrate are at least partially encapsulated in an encapsulating layer formed on the face of the transparent substrate, which has been planarized to expose upper portions of the solder balls, as contact pads of the optical sensor package. | 06-30-2011 |
| 20110157436 | METHOD AND APPARATUS FOR RINGING AND HALO CONTROL - A system is disclosed for reducing artifacts in images and video, such as ringing or halo artifacts. The system may include an edge detector and a gain controller. The edge detector may create an edge image used by the gain controller to create a gain image, and the gain image may be used to reduce artifacts in an image. The gain controller may, for a current pixel in the edge image, compute the maximum value of the edge image over a window containing the current pixel. The gain controller may also perform averaging to determine a maximum edge value and a current edge value, and may also use a ratio of the current edge value and the maximum edge value to determine a gain to be applied to a pixel of an image. | 06-30-2011 |
| 20110156803 | METHOD FOR GENERATING MULTIPLE INCREMENTAL OUTPUT VOLTAGES USING A SINGLE CHARGE PUMP CHAIN - A method and apparatus for generating multiple voltage level outputs from a single series of charge pump stages. The apparatus includes a plurality of voltage output circuits electrically connected in series. A selected number of the voltage output circuits include voltage output nodes that are available to be connected to loads. A control component in each voltage output circuit regulates operation of the charge pump stages within that circuit to provide a voltage level at the voltage output node regulated independently of other voltage output circuits in the series. The method and apparatus has the advantage of reducing the number of charge pump stages required to achieve a plurality of different voltage output levels. In another embodiment, the method and apparatus recycles charge within the apparatus by transferring charge between voltage output circuits through a load. | 06-30-2011 |
| 20110156794 | GATE CONTROL CIRCUIT FOR HIGH BANDWIDTH SWITCH DESIGN - An analog switch configuration includes a gate control circuit coupled between an input of a switch and a gate of the switch. The gate control circuit passes voltage changes on the input of the switch to the gate of the switch to decrease the influence the inherent gate to input capacitance has on the bandwidth of the switch. By reducing the change in voltage across the inherent capacitance, the current through the capacitance in decreased as well as its influence on the bandwidth of the configuration. | 06-30-2011 |
| 20110156712 | DEVICE AND METHOD FOR TESTING MAGNETIC SWITCHES AT WAFER-LEVEL STAGE OF MANUFACTURE - A testing mechanism for testing magnetically operated microelectromechanical system (MEMS) switches at a wafer level stage of manufacture includes an electromagnetic fixture configured to be received in a standard probe ring. The electromagnetic fixture is rotatable, relative to the probe ring, to permit adjustment of orientation of a generated magnetic field relative to the MEMS devices of a subject wafer. The testing mechanism also includes a probe card with probes positioned to contact test pads on the subject wafer. During operation, the probe card is positioned over the wafer to be tested, with the test probes in electrical contact with respective contact pads of the wafer, and the electromagnetic fixture is positioned above the probe card. An electrical potential is applied across the switches on the subject wafer, and the electromagnetic fixture is energized at selected levels of power and duration. Current flow across each switch is measured to determine one or more of: open circuit contact resistance, closed circuit contact resistance, response time, response to switching magnetic field, frequency response, current capacity, critical dimensions, critical angles of magnetic field orientation, etc. Wafer level testing enables rejection of non-compliant switches before the cutting and packaging levels of manufacture. | 06-30-2011 |
| 20110156250 | FLIP-CHIP FAN-OUT WAFER LEVEL PACKAGE FOR PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE - A flip-chip fan-out wafer level package for package-on-package applications includes a semiconductor die with solder bumps on an upper surface in a flip chip configuration. The die is inverted, with an upper surface facing an upper side of a redistribution layer, with the solder bumps in electrical contact with respective chip contact pads of the redistribution layer. The redistribution layer includes conductive traces that place each of the solder bumps in electrical contact with one or both of one of a plurality of upper redistribution contact pads and one of a plurality of lower redistribution contact pads. Each of the plurality of upper redistribution contact pads has an upper solder ball in electrical contact therewith. The die and the upper solder balls are at least partially encapsulated in a layer of mold compound positioned on the upper surface of the redistribution layer, and whose lateral dimensions are defined by the lateral dimensions of the redistribution layer. The layer of mold compound has a back-ground surface at which a portion of each of the upper solder balls is exposed, for electrical contact with an upper package. Each of the lower redistribution contact pads has a lower solder ball a coupled thereto. | 06-30-2011 |
| 20110156240 | RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE - A fan-out wafer level package includes a semiconductor die with contact pads positioned on a top surface. A fan-in redistribution layer positioned over the die includes contact pads in electrical communication with the first contact pads of the die. A buffer layer positioned over the fan-in layer includes a plurality of vias, in electrical contact with the contact pads of the fan-in layer. A fan-in redistribution layer is positioned over the buffer layer and includes contact pads on a surface opposite the buffer layer, in electrical communication with the vias. The semiconductor die, fan-in layer, and buffer layer are encapsulated in a molding com-pound layer. Solder contacts, for electrically connecting the semiconductor device to a electronic circuit board, are positioned on contact pads of the fan-out layer. The buffer layer has a substantial thickness, to reduce and distribute shear stresses resulting from thermal mismatch of coefficients of thermal expansion of the semiconductor die and a circuit board. | 06-30-2011 |
| 20110156239 | METHOD FOR MANUFACTURING A FAN-OUT EMBEDDED PANEL LEVEL PACKAGE - A method for manufacturing a fan-out embedded panel-level package. Film having an adhesive on each side is applied to the non-active face of a plurality of semiconductor die while the die are still in wafer form. The die are singulated from the wafer and placed on a carrier, using the adhesive on the unused side of the film to attach the die to the carrier. Encapsulant material is dispensed onto the carrier adjacent to the die, providing an exposed surface on the encapsulant material approximately even with the active faces of the die. Elements of the redistribution layer such as conductors and fan-out pads are applied to this surface. A solder ball array is placed on the fan-out pads and then the die are re-singulated by cutting through the encapsulation material and the carrier, yielding individual electronic packages. | 06-30-2011 |
| 20110156236 | THERMALLY ENHANCED EXPANDED WAFER LEVEL PACKAGE BALL GRID ARRAY STRUCTURE AND METHOD OF MAKING THE SAME - A thermally enhanced expanded wafer level ball grid array package. The expanded wafer level ball grid array package includes an integrated thermally conductive heat dissipater. In one embodiment the heat dissipater is positioned in close proximity to a non-active face of a die and is separated from the non-active face by a thermal interface material. In another embodiment the heat dissipater includes legs that displace the heat dissipater a short distance from the non-active die face, with the intervening space occupied by encapsulation material. In yet another embodiment, the thermal interface material exists between the non-active die face and the heat dissipater, but extends beyond the edge of the semiconductor die to also cover a portion of the encapsulation material. Methods for making the various embodiments of the expanded wafer level ball grid array package are also shown. | 06-30-2011 |
| 20110156234 | SELF REPAIRING IC PACKAGE DESIGN - An integrated circuit package comprises a molding compound covering a semiconductor die. A healing substance is on the surface of the semiconductor die at an interface of the molding compound and the semiconductor die. The healing compound comprises a catalyst and a plurality of microcapsules containing a sealing compound. If the molding compound becomes delaminated from the semiconductor die the microcapsules rupture and spill the sealing compound. When the sealing compound is spilled and contacts the catalyst the sealing compound and catalyst polymerize and fasten the molding compound to the semiconductor die. | 06-30-2011 |
| 20110156230 | MULTI-STACKED SEMICONDUCTOR DICE SCALE PACKAGE STRUCTURE AND METHOD OF MANUFACTURING SAME - A multi-stack semiconductor dice assembly has enhanced board-level reliability and integrated electrical functionalities over a common package foot-print. The multi-stack semiconductor dice assembly includes a bottom die having a stepped upper surface. The stepped upper surface includes a base region and a stepped region, which is raised relative to the base region. The base region includes a plurality of attachment structures that are sized and shaped to receive electrically conductive balls. An upper die is stacked above the bottom die. The upper die includes a plurality of attachment structures that are sized and shaped to receive electrically conductive balls and are arranged to align with the attachment structures of the bottom die. Electrically conductive balls are attached to the attachment structures of the bottom die and the attachment structures of the upper die. | 06-30-2011 |
| 20110156175 | METHOD OF FORMING A DIE HAVING AN IC REGION ADJACENT A MEMS REGION - A method that includes forming a first layer having a first dopant concentration, the first layer having an integrated circuit region and a micro-electromechanical region and doping the micro-electromechanical region of the first layer to have a second dopant concentration is presented. The method includes forming a second layer having a third dopant concentration overlying the first layer, doping the second layer that overlies the micro-electromechanical region to have a fourth dopant concentration, forming a micro-electromechanical structure in the micro-electromechanical region using the first and second layers, and forming active components in the integrated circuit region using the second layer. | 06-30-2011 |
| 20110156033 | METHOD AND SYSTEM FOR TRACING DIE AT UNIT LEVEL - A method and system for tracing die at unit level, comprising: assigning a first identification to a support member including a plurality of die support units; generating a second identification corresponding to a die support unit, the second identification including the first identification and a coordinate of the die support unit within the support member; correlating the second identification to a third identification of a die; attaching the die to the die support unit to generate a packaged die; and assigning the second identification to the packaged die. | 06-30-2011 |
| 20110150242 | ADAPTIVE LOUDNESS LEVELLING FOR DIGITAL AUDIO SIGNALS - A time-domain method of adaptively levelling the loudness of a digital audio signal is proposed. It selects a proper frequency weighting curve to relate the volume level to the human auditory system. The audio signal is segmented into frames of a suitable duration for content analysis. Each frame is classified to one of several predefined states and events of perceptual interest is detected. Four quantities are updated each frame according to the classified state and detected event to keep track of the signal. One quantity measures the long-term loudness and is the main criterion for state classification of a frame. The second quantity is the short-term loudness that is mainly used for deriving the target gain. The third quantity measures the low-level loudness when the signal is deemed to not contain important content, giving a reasonable estimate of noise floor. A fourth quantity measures the peak loudness level that is used to simulate the temporal masking effect. The target gain to maintain the audio signal to the desired loudness level is calculated by a volume leveller, regulated by a gain controller that simulates the temporal masking effect to get rid of unnecessary gain fluctuations, ensuring a pleasant sound. | 06-23-2011 |
| 20110147191 | METHODS OF USING A CONDUCTIVE COMPOSITE MATERIAL - Composite materials having conductive properties are described for use in testing circuits and in manufacturing electrical switches. The composite materials described, when in an unstressed state, generally behave as insulators. However, when sufficient mechanical pressure is applied to portions of the composite materials, the portions to which the mechanical pressure is applied become increasingly conductive. Methods for testing a PCB using composite material switches are also disclosed. A sheet that includes a composite material may be used to test electrical functionality of various regions on a PCB by way of local pressure application. The sheet may be easily applied to and removed from the PCB. Additionally, in forming an electrical switch, a voltage applied to one or more actuating elements may be used to provide mechanical pressure to a composite material that is disposed between two conductive members. Application of a sufficient voltage allows for portions of the composite material to transition from an insulator to a conductor for providing an electrical pathway. | 06-23-2011 |
| 20110129024 | ACCOUNTING FOR INTER-CARRIER INTERFERENCE IN DETERMINING A RESPONSE OF AN OFDM COMMUNICATION CHANNEL - In an embodiment, a channel estimator includes first and second stages. The first stage is operable to generate a respective one-dimensional array of first channel-estimation coefficients for each communication path of a communication channel, and the second stage is operable to generate a multi-dimensional array of second channel-estimation coefficients in response to the first channel-estimation coefficients. For example, such a channel estimator may estimate the response of a channel over which propagates an orthogonal-frequency-division-multiplexed (OFDM) signal that suffers from inter-carrier interference (ICI) due to Doppler spread. Such a channel estimator may estimate the channel response more efficiently, and with a simpler algorithm, than conventional channel estimators. Furthermore, such a channel estimator may be able to dynamically account for changes in the number of communication paths that compose the channel, for changes in the delays of these paths, or the portions of the transmitted symbol energy carried by these paths. | 06-02-2011 |
| 20110099021 | CONTENT FEATURE-PRESERVING AND COMPLEXITY-SCALABLE SYSTEM AND METHOD TO MODIFY TIME SCALING OF DIGITAL AUDIO SIGNALS - A time-domain system and method of modifying the time scale of digital audio signals includes a pre-processor. The pre-processor forms a synthesized signal for processing with minimum computation and that has optional features to give preference to certain audio channels and/or frequency bands, a mechanism of adaptively characterizing the temporal features of the synthesized signal by its normalized power and zero-crossing count, and a mechanism of identifying a segment of the synthesized signal where the time scale can be modified without introducing artifacts or losing content. | 04-28-2011 |
| 20110089920 | ARCHITECTURE OF CONTROLLING A DUAL POLARITY, SINGLE INDUCTOR BOOST REGULATOR USES AS A DUAL POLARITY SUPPLIES IN A HARDDISK DRIVE DUAL STAGE ACTUATOR (DSA) DEVICE - A dual supply circuit uses a dual feedback control, single inductor, dual polarity boost architecture with a low side power FET for end of current recirculation sensing. A dual feedback system tracks the output voltage variations and a low side power FET end of current recirculation sensing utilizes the internal current limit sensing system. Logic defining the state of operations allows the regulator to operate in both single and dual mode to cater to wide application ranges. The positive boost regulator can be operated in a buck mode making the output voltage constant with high input supply. | 04-21-2011 |
| 20110057715 | HIGH BANDWIDTH SWITCH DESIGN - An analog switch includes a transistor having a current path between an input and an output, a gate coupled to a control terminal, and a bulk terminal, and a switched bulk control circuit coupled to the control terminal, the bulk terminal, and ground to reduce an equivalent capacitance seen from a source terminal or drain terminal of the transistor towards the bulk terminal of the transistor. The bulk control circuit includes an all-NMOS bulk control circuit if an NMOS transistor switch is used. | 03-10-2011 |
| 20110032021 | T SWITCH WITH HIGH OFF STATE ISOLATION - An analog T switch is disclosed which has high isolation in the off state. The analog T switch can include series-connected NMOS transistors having separate gate control. The gates of the NMOS transistors can be isolated from one another to improve off state isolation of the analog T switch. The analog switch can include series-connected PMOS transistors having separate gate control. The gates of the PMOS transistors can be isolated from one another to improve off state isolation of the analog T switch. The analog T switch can include a substrate voltage control circuit that controls the voltage of the substrate regions in which the PMOS transistors are formed. The substrate voltage control circuit can isolate the substrate regions of the PMOS transistors from one another in the off state to improve off state isolation of the analog T switch. | 02-10-2011 |
| 20110006411 | Simplified multichip packaging and package design - A multichip integrated circuit apparatus includes first and second integrated circuit die mounted on opposite sides of a leadframe die paddle, with at least one of the integrated circuit die extending further toward the leads than does the die paddle. With this arrangement, the active circuit areas of both integrated circuit die can face in the same direction, and can be wire bonded to the same surfaces of the leads. This avoids wire bonding complications that are often encountered in multichip integrated circuit package designs. | 01-13-2011 |
| 20100327421 | IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE - A protective structure is provided on a substrate to which a semiconductor die is attached. The protective structure surrounds the die and reduces the thermo-mechanical stresses to which the die is subject. The die is protected against cracking, warping, and delamination. | 12-30-2010 |
| 20100315372 | TOUCH COORDINATE CALCULATION FOR A TOUCH-SENSITIVE INTERFACE - A touch sensitive interface includes a plurality of touch pads that can each register an impedance change indicating a contact. For each contact a plurality of touch pads is identified and within that plurality of associated touch pads one or more seed points is located. Each seed point possesses an input value greater than the input value at each neighboring touch pad. From each seed point within the plurality of touch pads associated with a contact, a region of touch pads is identified. A centroid of each formed region can then be determined to ascertain a touch coordinate. | 12-16-2010 |
| 20100309139 | TOUCH TRACKING ON A TOUCH SENSITIVE INTERFACE - A method tracks a plurality of touch points across successive frames of a touch sensitive input device to determine a trajectory. Each touch point on a frame of a touch sensitive input device is correlated with another distinct touch point on a subsequent frame of the same touch sensitive input device. The correlation is based on examining in the subsequent frame an area surrounding each touch point on the previous frame. Touch points identified within this search area are prioritized based on a projected trajectory through the prior touch point based on historical data. | 12-09-2010 |
| 20100297813 | Semiconductor package with position member - The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package. | 11-25-2010 |
| 20100208899 | METHOD AND SYSTEM FOR ENHANCING BASS EFFECT IN AUDIO SIGNALS - The quality of music output from audio systems is improved by simulating the effect of low frequency signals in the human ear. This thus allows listeners to perceive the lower frequency signals, even though the speakers may be incapable of providing such low frequency outputs. A method is provided for processing enhancing bass effect in audio signals. The method also results in the bass enhancement being computationally less intensive. The bass effect enhancement techniques are based on the response of sine and cosine transfer functions and on the directional independence of low frequency components. The human ear is unable to resolve directions from low frequency components. The bass effect enhancement technique alternatively is based on the response of an exponential transfer function. | 08-19-2010 |
| 20100187651 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME - Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit. | 07-29-2010 |
| 20100171575 | MICROELECTROMECHANICAL SYSTEM - The invention relates to microelectromechanical systems (MEMS), and more particularly, to MEMS switches using magnetic actuation. The MEMS switch may be actuated with no internal power consumption. The switch is formed in an integrated solid state MEMS technology. The MEMS switch is micron and/or nanoscale, very reliable and accurate. The MEMS switch can be designed into various architectures, e.g., a cantilever architecture and torsion architecture. The torsion architecture is more efficient than a cantilever architecture. | 07-08-2010 |
| 20100167471 | REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGING - Fan-out wafer level packaging includes an integrated circuit having a top surface, a bottom surface, a plurality of side surfaces, and a bond pad defined on the top surface. A layer of encapsulant substantially surrounds the side surfaces of the integrated circuit, the layer of encapsulant having a height substantially equal to a height of the integrated circuit. A bump is spaced apart from the integrated circuit, and a redistribution layer electrically couples the bond pad of the integrated circuit to the bump. | 07-01-2010 |
| 20100165209 | System and method for phase motion detection for YC separation - A system, apparatus and method are disclosed for separating a current frame of a composite video signal into a luminance signal and a chroma signal. A relative chroma correlation value is generated using a plurality of lines of the current frame. A weighted sum of inter-line pixel differences of the current frame is generated using the relative chroma correlation value. A frame difference signal is generated by subtracting a previous frame of the composite video signal from the current frame. A detected motion signal is generated that corresponds to motion detected in the current frame. The weighted sum of inter-line pixel differences, the frame difference signal, and the detected motion signal are combined to generate the chroma signal. The chroma signal is subtracted from the current frame to generate the luminance signal. | 07-01-2010 |
| 20100165207 | APPARATUS AND METHOD OF MOTION DETECTION FOR TEMPORAL MOSQUITO NOISE REDUCTION IN VIDEO SEQUENCES - Apparatus and methods of motion detection for mosquito noise reduction in video sequences are provided. In one aspect, a method of motion detection in a sequence of digital images classifies a pixel of a plurality of pixels of a current image frame represented by a digital video input signal as a motion or non-motion pixel. A motion value for the pixel is calculated based on the classification of the pixel. The motion value is mapped to a coefficient of a temporal filter based on a control curve. A digital video output signal is generated based on the coefficient. | 07-01-2010 |
| 20100165204 | System and process for image rescaling using adaptive interpolation kernel with sharpness and overshoot control - Provided are a digital video rescaling system, a method of rescaling video images, and a chip comprising a computer executable medium embedded therein computer executable instructions for rescaling video images. | 07-01-2010 |
| 20100164905 | METHOD OF IMPROVED COMPUTATION OF TOUCH COORDINATES FOR FOUR-WIRE RESISTIVE TOUCH SCREENS - A method for calculating coordinates and touch pressure on a four-wire resistive touch screen includes applying a voltage gradient across a flexible resistive sheet in a touch screen and measuring the voltage where the screen comes in contact with another screen via analog to digital couplings to the other screen. The touch pressure is acquired by applying a higher voltage potential to one resistive sheet and a lower voltage potential to the other sheet so that current flows between the sheets at the point of contact between the sheets. A voltage on each sheet is then measured at the point of contact shared by the sheets. The measured voltages are used to calculate the touch pressure. | 07-01-2010 |
| 20100141636 | EMBEDDING AND TRANSMITTING DATA SIGNALS FOR GENERATING A DISPLAY PANEL - Row propagation delay is the duration it takes for a signal to travel the length of a row in a flat panel display matrix. Row propagation delay compensation modifies when column voltages are applied to each column in a flat panel matrix by substantially matching the delay for its position relative to the length of the row. A ternary signal generated by the timing controller with embedded clock and data information is buffered at the timing controller and transmitted to each column driver as required to substantially match row propagation delay while minimizing system interconnects and column driver circuitry. | 06-10-2010 |
| 20100140810 | CHIP PACKAGE WITH COPLANARITY CONTROLLING FEATURE - A chip package includes a substrate, an integrated circuit proximate a top surface of the substrate, and a cap comprising encapsulant that encapsulates the integrated circuit on at least a portion of the top surface of the substrate. The chip package further includes at least one extension feature positioned on at least a portion of the top surface of the substrate. The at least one extension feature also comprises the encapsulant and extends from the cap to a perimeter of the substrate. | 06-10-2010 |
| 20100140788 | MANUFACTURING FAN-OUT WAFER LEVEL PACKAGING - Fan-out wafer level packaging includes an integrated circuit having a top surface, a bottom surface and a bond pad defined on the top surface, and a substrate having a cavity. An adhesive layer is positioned between a top surface of the cavity and the bottom surface of the integrated circuit, and a bump is positioned proximate a top surface of the fan-out wafer level packaging, the bump spaced apart from the integrated circuit. A redistribution layer is configured to electrically couple the bond pad of the integrated circuit to the bump. | 06-10-2010 |
| 20100129549 | MATERIAL FOR GROWTH OF CARBON NANOTUBES - Systems and methods for creating carbon nanotubes are disclosed that comprise a growing a nanotube on a tri-layer material. This tri-layer material may comprise a catalyst and at least one layer of Ti. This tri-layer material may be exposed to a technique that is used to grow a nanotube on a material such as a deposition technique. | 05-27-2010 |
| 20100127568 | APPARATUS AND METHOD FOR PROVIDING A POWER SWITCH ARRAY WITH ADJUSTABLE CURRENT RATING POWER SWITCHES - An apparatus and method are disclosed for providing a power switch array with adjustable current rating power switches. A plurality of current rating power switches is provided that connects a power supply unit to a plurality of device ports. A power switch array controller is provided that adjusts an adjustable current rating in each of the plurality of adjustable current rating power switches. Each of the plurality of adjustable current rating power switches is adjustable to a selected number of current values. The power switch array controller dynamically adjusts the current ratings in the adjustable current power switches as required by the current requirements of the device ports. | 05-27-2010 |
| 20100098198 | RECOVERY OF DATA FROM A MULTI CARRIER SIGNAL - In an embodiment, a multi-carrier signal (e.g., an OFDM signal) is received over a channel. Indicators of interference and the channel response at a carrier frequency of the signal are determined, and compared. If the indicator of interference has a particular relationship to the indicator of the channel response, then a data value transmitted at the carrier frequency is recovered from a data value received at the carrier frequency according to a particular data-recovery algorithm. Because the particular data-recovery algorithm may be faster than a conventional data-recovery algorithm, recovering one or more data values with the particular algorithm may increase the speed at which data is recovered from a multicarrier signal as compared to using a conventional data-recovery algorithm. | 04-22-2010 |
| 20100091898 | RECOVERY OF DATA FROM A MULTI CARRIER SIGNAL - In an embodiment, a multi-carrier signal (e.g., an OFDM signal) is received over a channel. First indicators of interference and channel response at a carrier frequency of the signal are determined and compared. If the first indicator of the interference has a relationship to the first indicator of the channel response, then a data value transmitted at the carrier frequency is recovered from a data value received at the carrier frequency according to a first algorithm. If, however, the first indicator of the interference does not have a first relationship to the first indicator of the channel response, then second indicators of interference and the channel response at the carrier frequency are determined and compared. If the second indicator of the interference has a second relationship to the second indicator of the channel response, then the data value transmitted at the carrier frequency is recovered from the data value received at the carrier frequency according to a second algorithm. Because first and second data-recovery algorithms may be faster than a conventional data-recovery algorithm, recovering one or more data values with the first or second algorithms may increase the speed at which data is recovered from a multicarrier signal as compared to using a conventional data-recovery algorithm exclusively. | 04-15-2010 |
| 20100086085 | Method and system for estimating the speed of a mobile device in a network - A method for estimating the speed of a mobile device in a network is provided that includes selecting a correlation length from a plurality of possible correlation lengths. A correlation result is generated based on the selected correlation length. A speed estimate is generated for the mobile device based on the correlation result. | 04-08-2010 |
| 20100066701 | MULTIPLE TOUCH LOCATION IN A THREE DIMENSIONAL TOUCH SCREEN SENSOR - A touch screen capable of correctly identifying multiple touches employs multiple active line arrays oriented to provide multi-dimensional data. Three arrays of capacitance based active lines are each distinctly oriented to form a plurality of intersections. A first and second array are generally oriented perpendicularly while a third array is oriented to bisect the resulting matrix such that the active lines of the third array also intersect the existing vertices. As a result of a touch each active line array identifies the location of the touch from three distinct directions. Ambiguity from dual touch scenarios existing in dual array systems is removed by providing an additional reference. | 03-18-2010 |
| 20100053097 | CAPACITIVE TOUCH SENSOR SYSTEM - A method of matrix sensing using delay-based capacitance sensing, including using X-axis lines as active lines for capacitance measurements and using Y-axis lines as a disturbance to identify the location of a touch in a key matrix is disclosed. A sensing signal is applied to the X-axis lines, and a disturbance signal is applied to the Y-axis lines. If a location is touched, cross-capacitance is reduced, which is measured by sweeping data along the X-axis lines. | 03-04-2010 |
| 20100051354 | CAPACITIVE TOUCH SENSOR SYSTEM - A method of matrix sensing using delay-based capacitance sensing, including using X-axis lines as active lines for capacitance measurements and using Y-axis lines as a disturbance to identify the location of a touch in a key matrix is disclosed. A sensing signal is applied to the X-axis lines, and a disturbance signal is applied to the Y-axis lines. If a location is touched, cross-capacitance is reduced, which is measured by sweeping data along the X-axis lines. | 03-04-2010 |
| 20100002331 | ADAPTIVE SYNCHRONOUS RECTIFICATION OF BRUSHLESS DC MOTOR BACK-EMF - A disk drive power system is described. The system is operable such that during power interruption, the system taps electric power by rectifying the back-EMF generated across each winding of a DC motor and supplying power to a voice-coil motor to park a read/write head safely away from an associated magnetic disk surface. | 01-07-2010 |
| 20090299082 | EPOXY FUNCTIONALIZED CARBON NANOTUBES AND METHODS OF FORMING THE SAME - The invention relates to epoxy functionalized carbon nanotubes (CNTs) and methods of forming the same, and more particularly to inclusion of the epoxy functionalized CNTs as fillers in electronic applications, e.g., semiconductor devices and device packaging. More particularly, CNT-based epoxy resin composites are employed as materials for electronic packaging applications and the inclusion of CNTs as fillers chemically linked to epoxy resin macromolecules. The resulting materials showed improved chemical-physical features in terms of mechanical, thermal and electrical properties. | 12-03-2009 |
| 20090276227 | FAST SYNTHESIS SUB-BAND FILTERING METHOD FOR DIGITAL SIGNAL DECODING - In order to reproduce audio signals which have been compressed or encoded for storage or transmission using, for example, MPEG audio encoding, a synthesis sub-band filter is employed which performs an inverse modified discrete cosine transform. The computational cost of the IMDCT implementation is reduced by pre-calculating arrays of sum and difference data. The arrays of sum and difference data are then used in two separate transform calculations, the results of which can be used in the generation of pulse code modulation audio data. | 11-05-2009 |
| 20090262247 | SYSTEM AND PROCESS FOR IMAGE RESCALING WITH EDGE ADAPTIVE PHASE CONTROL IN INTERPOLATION PROCESS - A video image processing system is described that generates the interpolated video images with sharp and jaggedness-free edges. A method of video image processing is also described that interpolates video images to generate the video images with sharp and jaggedness-free edges. The video image processing system receives and makes input image data available for further processing; analyzes the local features of the input image data; filters the input image data before performing interpolation process; modifies the phase value adaptive to the local edge distance; rescales the input image data in horizontal interpolation using the modified phase value; and rescales the horizontally interpolated image data in vertical interpolation using modified phase value. | 10-22-2009 |
| 20090185062 | SYSTEM AND METHOD OF SCANNING AN ARRAY OF SENSORS - Aspects of the invention relate to a method and apparatus for scanning an array of sensors. More particularly, the invention is directed towards scanning an array of sensors to accurately determine actuated sensors on a contact-sensitive surface. In one embodiment, three sets of sensing lines can be incorporated into the sensing area for ghost-free detection of up to two keys. Further in other embodiments, n sets of sensing lines can be incorporated into the sensing area for ghost free detection of up to n−1 keys. | 07-23-2009 |
| 20090123002 | System and method for providing step size control for subband affine projection filters for echo cancellation applications - A system and method for Acoustic Echo Cancellation. The system and method include a subband affine projection filter and a variable step size controller configured to cancel an estimated echo from a near-end signal. The system and method also include a divergence detector adapted to reset the subband affine projection filter in response to determining a divergence is occurring. Additionally, the system and method include a double talk detector adapted to transmit a signal to mask an output signal when double talk is detected. | 05-14-2009 |
| 20090115740 | INTERRUPT REDUCTION METHOD IN TOUCH SCREEN CONTROLLER - Integration of a FIFO memory, FIFO threshold and a timer, along with the other components of a touch screen system allows the number of interrupts to the touch screen controller to be reduced while allowing all point data to be acquired and preserved. In the first touch-detect event, an interrupt is issued to inform the host. The touch screen controller then automatically acquires data as long as touch is detected without host intervention. A FIFO threshold defines the minimum number of data points in FIFO memory before it issues an interrupt to inform the host that data is ready to be fetched. The timer is started once touch is detected. On every single data acquired, the timer is reset. In the event where touch is no longer detected, the timer keeps on counting until the time-up limit is reached. In this event, the touch screen controller will issue an interrupt informing the host the pen is lifted. The host then checks whether there is still data left in FIFO memory to be read. | 05-07-2009 |
| 20090034351 | NON-VOLATILE MEMORY DEVICE AND METHOD OF HANDLING A DATUM READ FROM A MEMORY CELL - A memory device includes a pre-charge transistor for connecting/disconnecting the input line of a global data line driver to a supply voltage line. To reduce the flow of current through the pre-charge transistor even in a stand-by state, the pre-charge transistor is turned on when, at a same time, an enabling signal of a page buffer is asserted, and a low voltage functioning mode is selected and the memory device is not in a stand-by state. Alternatively, the memory device may be in a stand-by state but the datum read from the memory is high. The pre-charge transistor is securely turned off in all other cases. | 02-05-2009 |
| 20080219244 | Speech codec selection for improved voice quality in a packet based network - A method of improving voice quality in a packet based network. The method includes receiving an incoming call from a first endpoint and matching capabilities between the first endpoint and the second endpoint. The method also includes completing the incoming call if the capabilities match and tracking the packet loss associated with the network. The method also includes negotiating the voice quality based on the tracking and the capabilities. Also described is a devices and system for a similar method. | 09-11-2008 |
| 20080204292 | Output Architecture for LCD Panel Column Driver - In one embodiment consistent with the present invention, a digital to analog converter (DAC) circuit operates over an upper range and a lower range. An upper voltage node is designated AVDD; a middle voltage node is designated HVDD; and a lower voltage node designated ground. An upper DAC stage has at least one NMOS transistors that produces an output to an upper range output node when the output is in the upper range. A lower DAC stage has at least one PMOS transistors that produces an output to a lower range output node when the output is in the lower range. A body bias control circuit couples the body of the upper NMOS transistor to a voltage source equal to HVDD−Vbe and connects the body of the lower PMOS transistor to voltage source equal to HVDD+Vbe. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract. | 08-28-2008 |
| 20080203380 | CNT devices, low-temperature fabrication of CTN and CNT photo-resists - A method is provided for growth of carbon nanotube (CNT) synthesis at a low temperature. The method includes preparing a catalyst by placing the catalyst between two metal layers of high chemical potential on a substrate, depositing such placed catalyst on a surface of a wafer, and reactivating the catalyst in a high vacuum at a room temperature in a catalyst preparation chamber to prevent a deactivation of the catalyst. The method also includes growing carbon nanotubes on the substrate in the high vacuum in a CNT growth chamber after preparing the catalyst. | 08-28-2008 |
| 20080199014 | Low power downmix energy equalization in parametric stereo encoders - A method and audio device are presented that preserve mono energy during downmixing of a hybrid coding process of an audio signal. The method includes calculating a stereo scaling factor in a group level that is definable within a stereo band. The method may also include updating the stereo scaling factor using an update rate and synchronizing the update rate of a spatial parameter during a fast changing transient portion of the signal. A number of groups in a first stereo band may be greater than a number of groups in a second stereo band, and the first stereo band may be a lower frequency band than the second band or may be perceptually more important than the second band. | 08-21-2008 |
| 20080198499 | Continuous mode velocity control of voice coil motor - A method of controlling the velocity of a voice coil motor (VCM), including sensing a voltage difference between the VCM and a sense resistor and driving a velocity control loop (VCL) based on the voltage difference. There is also a control loop circuit, including a current output connected to drive a voice coil motor, the voice coil motor producing a back electromagnetic field (BEMF) voltage. The circuit also includes a sense resistor connected to the BEMF output, and a BEMF resistive network comprising a first resistor and a second resistor. The circuit also includes a velocity control loop (VCL) connected to control the voltage output according to a voltage difference between (i) a junction of the sense resistor and the current output and (ii) a junction of the first resistor and the second resistor. | 08-21-2008 |
