| Steven Yen Patent applications |
| Patent application number | Title | Published |
|---|
| 20100038055 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports. | 02-18-2010 |
| 20100038054 | Heat dispensing unit for memory chip - A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip. | 02-18-2010 |
