| STAR TECHNOLOGIES INC. Patent applications |
| Patent application number | Title | Published |
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| 20120043987 | Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof - A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact. | 02-23-2012 |
| 20110304857 | Probing Apparatus with On-Probe Device-Mapping Function - One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module. | 12-15-2011 |
| 20110279139 | PROBE CARD FOR TESTING HIGH-FREQUENCY SIGNALS - A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip. | 11-17-2011 |
| 20110156244 | HEAT SINK AND INTEGRATED CIRCUIT ASSEMBLY USING THE SAME - An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width smaller than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuits package. | 06-30-2011 |
| 20110063608 | Sensing Module for Light-Emitting Devices and Testing Apparatus Using the Same - A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device. | 03-17-2011 |
| 20110062317 | Testing Apparatus for Light-Emitting Devices - A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture. | 03-17-2011 |
| 20100301890 | PROBING APPARATUS WITH MULTIAXIAL STAGES FOR TESTING SEMICONDUCTOR DEVICES - A probing apparatus for testing semiconductor devices comprises a housing configured to define a testing chamber, a device carrier positioned in the housing and configured to receive the semiconductor device, a platen positioned on the housing, an alignment module positioned on the platen, a planarity-adjusting module positioned on the alignment module, an angular adjusting module positioned on the planarity-adjusting module, and a card holder positioned on the angular adjusting module and configured to receive a probe card having a plurality of probes. | 12-02-2010 |
| 20100231254 | METHOD FOR CONFIGURING COMBINATIONAL SWITCHING MATRIX AND TESTING SYSTEM FOR SEMICONDUCTOR DEVICES USING THE SAME - A method for configuring a combinational switching matrix comprises the steps of setting a first switching module and a second switching module, coupling at least one of the output ports of the first switching module with at least one of the input ports of the second switching module to form the combinational switching matrix, building a connection mapping table based on the coupling relationship between the output port of the first switching module and the input port of the second switching module, and displaying a channel switching interface showing the input terminals, the output terminals, and the on/off states of the virtual switching devices of the combinational switching matrix. | 09-16-2010 |
| 20100182013 | PROBING APPARATUS WITH TEMPERATURE-ADJUSTING MODULES FOR TESTING SEMICONDUCTOR DEVICES - A probing apparatus for testing semiconductor devices comprises an upper guiding plate having a plurality of upper guiding holes, a bottom guiding plate having a plurality of bottom guiding holes, a plurality of vertical probes disposed between the upper guiding holes of the upper guiding plate and the bottom guiding holes of the bottom guiding plate, and a temperature-adjusting module including at least one flow line configured to direct a fluid into a space between the upper guiding plate and the bottom guiding plate. | 07-22-2010 |
| 20100171519 | PROBE AND PROBE CARD FOR INTEGRATED CIRCUIT DEVICES USING THE SAME - A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body. | 07-08-2010 |
| 20100134130 | INTEGRATED CIRCUIT PROBING APPARATUS HAVING A TEMPERATURE-ADJUSTING MECHANISM - A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card. | 06-03-2010 |
| 20100118297 | MICROSCOPE HAVING MULTIPLE IMAGE-OUTPUTTING DEVICES AND PROBING APPARATUS FOR INTEGRATED CIRCUIT DEVICES USING THE SAME - A microscope includes an object splitter configured to split the object image into a first optical path and a second optical path, a first imaging module positioned on the first path and a second imaging module positioned on the second path. The object splitter includes a first beam splitter configured to direct an illumination light to an object, an objective lens configured to collect the reflected light from the object and couple the reflected light on the first beam splitter, and a second beam splitter configured to split the reflected light into the first optical path and the second optical path, wherein the distance between the object and the objective lens is constant. The first imaging module includes a first close up lens configured to render a first object image to a first imaging device with auto-focusing and remote-zooming capabilities, and the second imaging module includes a second close up lens and a negative lens configured to render a second object image to a second imaging device with auto-focusing and remote-zooming capabilities. | 05-13-2010 |
| 20100052720 | APPARATUS FOR TESTING SEMICONDUCTOR DEVICES - A probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen. | 03-04-2010 |
| 20100052717 | LOW TEMPERATURE PROBING APPARATUS - A low temperature probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, a platen positioned on the housing, at least one hydraulic stage positioned on the platen and configured to retain at least one probe, a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein, and a hydraulic controller configured to control the movement of the hydraulic stage. | 03-04-2010 |
| 20100052716 | ENCLOSED PROBE STATION - An enclosed probe station comprises a chuck assembly, a supporting member and an enclosure. The chuck assembly is configured to support a device under test. The supporting member is configured to secure a probe used to contact the device under test. The enclosure forms an interior space in which the chuck assembly and the supporting member are disposed. | 03-04-2010 |
| 20090315578 | PROBE AND PROBE CARD FOR INTEGRATED CIRCUIT DEVICES USING THE SAME - A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body. | 12-24-2009 |
| 20090237102 | HEATING APPARATUS FOR SEMICONDUCTOR DEVICES - A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven. | 09-24-2009 |
| 20090128897 | MICROSCOPE HAVING MULTIPLE IMAGE- OUTPUTTING DEVICES AND PROBING APPARATUS FOR INTEGRATED CIRCUIT DEVICES USING THE SAME - A microscope comprises an object splitter and a plurality of image-outputting devices configured to receive object images. The object splitter includes a first beam splitter configured to direct an illumination light to an object, a positive lens configured to collect a reflected light from the object and focus the reflected light on the first beam splitter, a second beam splitter configured to split the reflected light into a plurality of optical paths and a plurality of negative lenses positioned on the optical paths to render object images. A probing apparatus for an integrated circuit device comprises at least one probe pin configured to contact a pad of the integrated circuit device and a microscope including an object splitter and a plurality of image-outputting devices configured to receive images from the object splitter. | 05-21-2009 |
| 20090015283 | INTEGRATED CIRCUIT PROBING APPARATUS HAVING A TEMPERATURE-ADJUSTING MECHANISM - A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card. | 01-15-2009 |
