STACK DEVICES CORP. Patent applications |
Patent application number | Title | Published |
20150214416 | METHOD OF PACKAGE FOR SENSOR CHIP - A method of package for sensor chip includes the steps of: a) providing a sensor chip having a plurality of conducting contacts and a sensing area, b) using an adhesive to bond the sensor chip on a circuit substrate, c) mounting a dam between the sensing area and conducting contacts of the sensor chip, d) connecting metal conducting wires between the conducting contacts of the circuit substrate and the conducting contacts of the sensor chip, and e) molding a molding compound on the circuit substrate and the sensor chip to cover the metal conducting wires and the dam. Thus, the dam can buffer the impact of stress on the sensor chip during the step e). Further, an open type sensing space is defined after the step e), facilitating signal or status sensing and improving the sensor chip package yield rate. | 07-30-2015 |
20140170797 | SENSOR CHIP PROTECTIVE IMAGE SENSOR PACKAGING METHOD - A sensor chip protective image sensor packaging method includes the steps of a) installing an image sensor chip in a circuit substrate and then covering a passivation layer on a sensing zone of the image sensor chip, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, d) removing the passivation layer, and e) mounting a light transmissive cover in the encapsulation over the sensing zone of the image sensor chip. Thus, the passivation layer protects the sensing zone of the image sensor chip against contamination and damage prior before having been protected by the cover, and therefore, this image sensor chip packaging method has high-yield performance. | 06-19-2014 |
20140170796 | IMAGE SENSOR PACKAGING METHOD - A image sensor packaging method includes the steps of: a) installing an image sensor chip in a circuit substrate and then covering a light transmissive cover on the image sensor chip over a sensing zone of the image sensor chip and then covering a passivation layer on the light transmissive cover, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, and d) removing the passivation layer. | 06-19-2014 |