| 20110210411 | ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE - An integrated circuit that senses a phenomenon, such as a magnetic field, may be mounted upside down on a carrier substrate so that the electrical connections to the integrated sensor circuit may be made on the side facing the carrier. This eliminates the need for wirebonds on the side of the sensor integrated circuit that faces the phenomenon being sensed, thereby substantially eliminating any uneven topography on that side. The sensor integrated circuit is able to sense the phenomenon by sensing it through the body of the sensor integrated circuit. The body of the sensor integrated circuit may have a thickness within a vicinity of fifty microns. | 09-01-2011 |
