| SONY CHEMICAL & INFORMATION DEVICE CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20120119156 | ALUMINUM CHELATE LATENT CURING AGENT - A novel aluminum chelate latent curing agent that can cure a glycidyl ether epoxy compound at a lower temperature and more quickly than an aluminum chelate latent curing agent produced by emulsification and interfacial polymerization of a polyfunctional isocyanate in the presence of both a radical polymerizable monomer, such as divinyl benzene, and a radical polymerization initiator, is micro-encapsulated in a core-shell form, wherein an aluminum chelate curing agent and a cationic polymerizable compound are included in a capsule formed from an interfacial polymerization product of a polyfunctional isocyanate. | 05-17-2012 |
| 20120118483 | METHOD FOR PRODUCING DISPLAY DEVICE - A method for producing a display device includes: (a) coating a resin composition on at least one of a display part and a protective part, (b) closely adhering the display and protective parts via a resin composition interposed therebetween, and (c) arranging the cured resin layer between the display and protective parts by curing the resin composition by irradiating UV rays on an external side of the protective part. If a defect is detected, the method includes: (d) separating the display and protective parts by applying a wire to a side face of the cured resin layer where the protective and display parts are bonded and moving the wire through the cured resin layer, (e) peeling off and removing the cured resin adhered to the separated display and protective parts by a removing solution which contains an organic solvent, and (f) repeating steps (a) to (c). | 05-17-2012 |
| 20120112136 | ANISOTROPIC CONDUCTIVE ADHESIVE - An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles, the minor axis of the metal flake power being, in a length, 10 to 50% of the major axis. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %. | 05-10-2012 |
| 20120097248 | SOLAR CELL MODULE AND PRODUCTION METHOD THEREOF - A solar cell module includes a glass substrate, a first sealing resin layer, a solar cell connected to a tab wire, a second sealing resin layer, and a protective sheet, which are laminated. The second sealing resin layer is formed from a blend polymer of a thermoplastic polyurethane resin having an ester-type polyol unit and a thermoplastic polyurethane resin having an ether-type polyol unit. The blend ratio of the thermoplastic polyurethane resin having the ester-type polyol unit to the thermoplastic polyurethane resin having the ether-type polyol unit in the blend polymer is 20:80 to 50:50 by mass. | 04-26-2012 |
| 20120094072 | MAGNETIC SHEET AND PRODUCTION METHOD THEREOF - A magnetic sheet, which contains: a magnetic layer including a magnetic powder and a resin composition containing the magnetic powder therein; and a convex-concave forming layer, in which the convex-concave forming layer has Bekk smoothness of 70 sec/mL or less. A method for producing a magnetic sheet, which contains: adding a magnetic powder to a resin composition to prepare a magnetic composition, and giving the magnetic composition a shape to form a magnetic layer; and placing and stacking a convex-concave forming layer and a pattern transferring material on a surface of the magnetic layer in this order, and hot pressing the stacked layers so as to bond the convex-concave forming layer with the magnetic layer to form a laminate, as well as to transfer a surface configuration of the pattern transferring material to a surface of the laminate of the convex-concave forming layer and the magnetic layer. | 04-19-2012 |
| 20120090882 | CONDUCTIVE PARTICLE, AND ANISOTROPIC CONDUCTIVE FILM, BONDED STRUCTURE, AND BONDING METHOD - To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm. | 04-19-2012 |
| 20120058590 | METHOD FOR MANUFACTURING SOLAR CELL MODULE - In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber. | 03-08-2012 |
| 20120001720 | PROTECTIVE DEVICE - A protective device is provided that allows a fusible conductor to be fused off quickly in stability at the time of protective operation against over-current or the like. The protective device includes a fusible conductor | 01-05-2012 |
| 20110281119 | Adhesive composition - A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): | 11-17-2011 |
| 20110279219 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position and is capable of checking a retention state of the flux, enabling a speedy blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor | 11-17-2011 |
| 20110266578 | ANISOTROPIC CONDUCTIVE FILM AND LIGHT EMITTING DEVICE - An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element. | 11-03-2011 |
| 20110253345 | HEAT TRANSPORTATION DEVICE PRODUCTION METHOD AND HEAT TRANSPORTATION DEVICE - [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible. | 10-20-2011 |
| 20110237028 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×10 | 09-29-2011 |
| 20110223430 | CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE SAME - To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle. | 09-15-2011 |
| 20110211284 | PROTECTIVE ELEMENT AND METHOD FOR PRODUCING THE SAME - A protective element is provided that is applicable to reflow soldering and ensuring good responsiveness of electric current interruption operation even in a case where a solder to be used has a liquid-phase point or a solid-phase point higher than a mounting temperature. The protective element includes an elastic member firmly adhered through a solder to second conductor layers and current-carrying electrode terminals formed on a prescribed substrate in such a manner to divide a current-carrying path in plural to form an electric current interruption portion. The solder has a liquid-phase point higher than a mounting temperature at which the protective element is mounted to a protection target device. The elastic member is soldered onto the second conductor layers and the current-carrying electrode terminals in a state that the elastic member maintains a level of stress allowing at least one of the current-carrying electrode terminals among the second conductor layers and the current-carrying electrode terminals to be separated from the elastic member by deformation of the solder even in a case where the solder is not completely melted. | 09-01-2011 |
| 20110196110 | ALUMINUM CHELATE LATENT CURING AGENT AND PRODUCTION METHOD THEREOF - An aluminum chelate latent curing agent is configured such that an aluminum chelating agent and a specific arylsilane compound or a hydrolysate thereof are held in a polymer obtained by subjecting the aluminum chelating agent, the arylsilane compound, and a polyfunctional isocyanate compound to an emulsifying treatment, and then subjecting the polyfunctional isocyanate to interfacial polymerization. The aluminum chelating agent does not have an alkoxy group bonded to the aluminum. The arylsilane compound is a compound represented by the formula W. | 08-11-2011 |
| 20110192639 | NOVEL SULFONIUM BORATE COMPLEX - A novel sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). | 08-11-2011 |
| 20110159713 | ACRYLIC INSULATING ADHESIVE - A radical-polymerizable acrylic insulating adhesive for NCF-bonding an electronic part to a circuit board includes a (meth)acrylate monomer, a film-forming resin, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. The amount of the inorganic filler is 70 to 160 parts by mass with respect to a total of 100 parts by mass of the (meth)acrylate monomer and the film-forming resin. A radical polymerization cured product of the acrylic insulating adhesive exhibits a glass transition temperature of 150 to 185° C., a linear expansion coefficient (α1) of 30 to 35 ppm in a temperature range that is lower than the glass transition temperature, and a linear expansion coefficient (α2) of 105 to 125 ppm in a temperature range that is equal to or higher than the glass transition temperature. Further, α2/α1 is greater than or equal to 3.4. | 06-30-2011 |
| 20110120767 | ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING CONNECTION ASSEMBLY USING THE SAME - An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film ( | 05-26-2011 |
| 20110110066 | ANISOTROPIC CONDUCTIVE FILM - A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition. | 05-12-2011 |
| 20110108878 | ANISOTROPIC CONDUCTIVE ADHESIVE - An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM | 05-12-2011 |
| 20110100673 | FLAT CABLE - A flexible flat cable having good flexibility and bending resistance without deterioration of a good electrical characteristic of a strip structure and capable of enhancing cost effectiveness is provided. The flexible flat cable includes: a first shield member and a second shield member disposed in such a manner as to cover a surface of a cable body including a plurality of conductors arranged in parallel with a prescribed pitch therebetween. Each of the first and second shield members includes a metal member formed by placing a conductive adhesive layer placed between a plurality of metal layers, and allows one of outer most layers of the metal layers to be conductively connected with a ground layer. | 05-05-2011 |
| 20110095235 | CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE INTERCONNECTION MATERIAL THAT USES THE CONDUCTIVE PARTICLE, AND METHOD FOR PRODUCING THE CONDUCTIVE PARTICLE - There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle ( | 04-28-2011 |
| 20110088935 | CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND JOINING METHOD - The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer. | 04-21-2011 |
| 20110033732 | MAGNETIC SHEET COMPOSITION, MAGNETIC SHEET, AND METHOD FOR PRODUCING MAGNETIC SHEET - To provide a magnetic sheet composition, which contains: a binder; magnetic powder; and a curing agent, wherein the binder contains a thermosetting organic resin, and the curing agent contains a sulfonium borate complex expressed by General Formula 1: | 02-10-2011 |
| 20110017397 | METHOD AND APPARATUS FOR MOUNTING ELECTRIC COMPONENT - An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 μm is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×10 | 01-27-2011 |
| 20110012704 | PROTECTIVE ELEMENT AND SECONDARY BATTERY DEVICE - A protection element and a secondary battery device employing the protection element are provided for stably retaining a flux on a soluble conductor at a predetermined position, so as to enable appropriate blowout of the soluble conductor in the event of an abnormality. The protection element has a soluble conductor which is disposed on an insulation baseboard, and which is connected to a power supply path of a device targeted to be protected, and which causes a blowout when a predetermined abnormal electric power, amount is supplied. A flux is coated on a surface of the soluble conductor, and an insulation cover member is mounted on the baseboard and covers the soluble conductor. The protection element also includes a stepped portion for retaining the flux at a predetermined position in contact with the flux, and the stepped portion is formed opposite to the soluble conductor on an interior face of the insulation cover member. | 01-20-2011 |
| 20110005724 | HEAT TRANSPORT DEVICE MANUFACTURING METHOD AND HEAT TRANSPORT DEVICE - [Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding. | 01-13-2011 |
| 20100330359 | HARD COAT FILM - A high-hardness hard coat film having a reduced degree of curling and an ionizing ray polymerizable resin composition for forming the hard coat layer of such a hard coat film are provided. The hard coat film includes a resin film and a hard coat layer disposed on the surface of the resin film. The hard coat layer is formed of a cured product of a photopolymerizable composition containing an acrylic component, a hyperbranched acrylate resin, a silicone component, and silica particles. The cured product is produced by exposure to ionizing rays. | 12-30-2010 |
| 20100324170 | MICROCAPSULE-TYPE LATENT CURING AGENT - An aluminum chelate-based latent curing agent having excellent latency and thermal response includes a latent curing agent in which an aluminum chelating agent is retained in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound, and an enzyme-treated gelatin film coating such latent curing agent. This microcapsule-type latent curing agent can be produced by dissolving an aluminum chelating agent and a polyfunctional isocyanate compound in a volatile organic solvent, charging the obtained solution into a gelatin-containing aqueous phase, carrying out interfacial polymerization by heating and stirring, and subjecting the gelatin to an enzyme treatment by adding an enzyme to the obtained polymerization reaction mixture. | 12-23-2010 |
| 20100308476 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled. | 12-09-2010 |
| 20100290205 | ADHESIVE FILM - An adhesive film is provided that can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of a filler contained with respect to a total amount of an epoxy compound, a curing agent, and the filler is 10 to 70 mass %. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 μm. An average particle size of the conductive particles does not exceed 1.5 μm. The conductive particles is contained in an amount of 10 to 60 mass % of the filler. | 11-18-2010 |
| 20100288416 | METHOD AND APPARATUS FOR MOUNTING ELECTRIC COMPONENT - An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 μm is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×10 | 11-18-2010 |
| 20100285305 | CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE SAME - A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer. | 11-11-2010 |
| 20100283698 | ANTENNA CIRCUIT, METHOD FOR REDUCING RESISTANCE OF ANTENNA CIRCUIT, AND TRANSPONDER - A method for reducing a resistance of an antenna circuit capable of obtaining a desired property by reducing wiring resistance to a suitable value while ensuring inductance is provided. An antenna circuit is disposed to a transponder having a carrier frequency band of 13.56 MHz. The antenna circuit is formed of a prescribed base material and two antenna conductors each of which is formed of the same conductor pattern forming an antenna coil, formed on respective front and back surfaces of the base material by electrically parallel connection. Each of the two antenna conductors has a thickness of greater than equal to 5% and less than 50% of an overall thickness formed of the two antenna conductors and the base material. | 11-11-2010 |
| 20100270581 | OPTICAL SEMICONDUCTOR PACKAGE SEALING RESIN MATERIAL - An optical semiconductor package sealing resin material used to seal an optical semiconductor chip in a semiconductor package includes a thermosetting epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is hydrophobized by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide. The smectite clay mineral is bentonite, saponite, hectorite, vermiculite, stevensite, tainiolite, montmorillonite, or nontronite. | 10-28-2010 |
| 20100264357 | MAGNETIC SHEET - A magnetic sheet containing a binder, a magnetic powder, and a fire retardant, wherein the fire retardant contains at least one of a silicon atom-containing melamine cyanurate and a carboxylic acid amide-containing melamine cyanurate. | 10-21-2010 |
| 20100251541 | WIRING BOARD RECEIVING PLATE, AND DEVICE AND METHOD FOR CONNECTION OF WIRING BOARD USING THE SAME - Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head | 10-07-2010 |
| 20100249338 | THERMOSETTING EPOXY RESIN COMPOSITION - A thermosetting epoxy resin composition can be cured rapidly at low temperature with an aluminum chelate-based latent curing agent without the use of a cycloaliphatic epoxy compound. The thermosetting epoxy resin composition includes an aluminum chelate-based latent curing agent, a silanol compound of the formula (A), and a glycidyl ether-type epoxy resin: | 09-30-2010 |
| 20100245024 | PROTECTIVE ELEMENT - A protective element is provided that is capable of stopping heat generation of a heat generation resistor after all of fuse elements are surely blown out in a case where the power is distributed from a specific power distribution path. The protective element can be configured to control blowout times of a plurality of respective fuse elements in such a manner that other fuse elements are blown out prior to the blowout of a specific fuse element in a case where the power is distributed from the specific power distribution path connected with the specific fuse element among the plurality of fuse elements. | 09-30-2010 |
| 20100243962 | MICROENCAPSULATED SILANE COUPLING AGENT - A microencapsulated silane coupling agent includes adduct particles of an epoxy compound and an imidazole silane coupling agent, and an ethyl cellulose film coating a periphery of the adduct particles, in which the ethyl cellulose film is crosslinked by a polyfunctional isocyanate compound. Preferred examples of the imidazole silane coupling agent include a compound represented by the formula (1), | 09-30-2010 |
| 20100227101 | Peeling Sheet With Adhesive of Epoxy Acrylate, Non-Unsaturated Resin and Bis(methacryloyloxyethyl) Hydrogen Phosphate - An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator. | 09-09-2010 |
| 20100210166 | Method for producing display device - A technology for producing a display device for which a repair operation can be carried out easily and reliably without damage to a display part and a protective part. The method includes: (A) a step of coating a resin composition, which is a raw material of the cured resin, on at least one of the display part or the protective part, (B) a step of closely attaching the display part and the protective part via the resin composition, and (C) a step of arranging the cured resin layer between the display part and the protective part by curing the resin composition by irradiating UV rays from external side of the protective part. After the step (B), the method further includes (b | 08-19-2010 |
| 20100200160 | ANISOTROPIC CONDUCTIVE ADHESIVE - An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %. This anisotropic conductive adhesive is supplied to a connection terminal of a wiring board, and a connection terminal of an electronic component is preliminarily connected to a connection terminal of a substrate while arranging the anisotropic conductive adhesive therebetween. Then, the electronic component is heated without applying a pressure or while applying a low pressure to the electronic component to connect the substrate with the electronic component. | 08-12-2010 |
| 20100196650 | OPTICAL RECORDING MEDIUM AND REACTIVE BRIDGE RESIN COMPOSITION OF MATTER USED FOR THE SAME - In a light transmission layer, the elasticity modulus at 25 deg C. is in the range from 1*10 | 08-05-2010 |
| 20100193228 | EPOXY RESIN COMPOSITION - An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. | 08-05-2010 |
| 20100188829 | ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND JOINED STRUCTURE USING THE SAME - An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average. | 07-29-2010 |
| 20100187001 | NOVEL POLYIMIDE RESIN AND PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION - A novel polyimide resin is formed by imidizing a diamine component including an amide group-containing siloxane diamine compound represented by the following formula (1) and an acid dianhydride component including an aromatic acid dianhydride such as 3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride. This novel polyimide resin utilizes a novel polyimide resin into which a reaction group capable of reacting with a crosslinking agent to form a crosslinking point is pre-introduced before imidization. The novel polyimide resin can confer a comparatively low elastic modulus and heat resistance to a dry film or a photosensitive cover film formed from a photosensitive polyimide resin composition containing the novel polyimide resin. | 07-29-2010 |
| 20100186894 | METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE - A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device. | 07-29-2010 |
| 20100178834 | Method for producing display device - A method for producing a display device in which a repair operation can be carried out easily and reliably without damage to a bonding portion caused by a cured resin. The method comprises: (a) coating a resin composition on at least one of the display part and the protective part, (b) closely adhering the display part and the protective part via the resin composition interposed therebetween, and (c) arranging the cured resin layer between the display part and the protective part by curing the resin composition by irradiating UV rays externally side of protective part. The method further comprises, depending on the presence of defects: (d) separating the display part and the protective part by being in contact with a wire having a smaller diameter than a thickness of the cured resin layer to a side face of the cured resin layer where the protective part and the display part are bonded and moving the wire through the cured resin layer, (e) peeling off and removing the cured resin adhered to the separated display part and the protective part by a removing solution which contains an organic solvent, and (f) repeating steps (a) to (c). | 07-15-2010 |
| 20100175247 | Functional element-mounted module and a method for producing the same - A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away. | 07-15-2010 |
| 20100143604 | LATENT HARDENER, PROCESS FOR PRODUCING THE SAME, AND ADHESIVE CONTAINING LATENT HARDENER - A latent curing agent ( | 06-10-2010 |
| 20100140654 | LIGHT EMITTING ELEMENT MODULE AND METHOD FOR SEALING LIGHT EMITTING ELEMENT - Disclosed is a method for sealing a light-emitting device wherein formation of air bubbles in a light-emitting device module can be prevented by performing no gelation after fitting of a cover member. This method also enables to seal a light-emitting device by using a gel sealing material composed of a gel precursor which uses a solvent. Also disclosed is a light-emitting module formed by such a sealing method. In this method for sealing a light-emitting device, gelation of the gel precursor of a gel sealing material is performed before placing the precursor on the light-emitting device, and thus no gelation is necessary after fitting of a cover member. Consequently, a gel precursor having high viscosity that is difficult to be used in an injection method can be used in this method. Furthermore, a substance which requires use of a solvent can be used as a gel precursor of a gel sealing material. A light-emitting device module with high luminance wherein no air bubbles are included can be obtained by this method. | 06-10-2010 |
| 20100134713 | Image Display Device and Production Method Thereof - An image display device, and a production method thereof are provided, which are capable of suppressing warping of a protective panel formed from a plastic as much as possible. In an image display device having a liquid crystal display panel | 06-03-2010 |
| 20100129582 | ANISOTROPIC ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND METHOD FOR MANUFACTURING SAME - Disclosed is an anisotropic electrically conductive adhesive film for establishing electrically conductive interconnection between electronic components. The adhesive film includes a first peel film ( | 05-27-2010 |
| 20100119814 | ELECTROMAGNETIC WAVE SUPPRESSION MATERIAL AND ELECTROMAGNETIC WAVE SUPPRESSION SHEET - An electromagnetic wave suppression material that has a high light transmission performance even under a low temperature environment to display a sufficient electromagnetic wave suppression effect, and an electromagnetic wave suppression sheet that has the electromagnetic wave suppression material sealed in it, are disclosed. An electromagnetic wave suppression sheet ( | 05-13-2010 |
| 20100118406 | Antireflection Film - Disclosed is an antireflection film having high antifouling property. Specifically disclosed is an antireflection film comprising a transparent base, a high refractive index layer and a low refractive index layer. The low refractive index layer is made of a cured product of a polymerizable composition which contains hollow fine particles such as hollow silica particles, a modified silicone compound, and a second resin component such as a polyfunctional (meth)acrylate. | 05-13-2010 |
| 20100118245 | RESIN COMPOSITION AND IMAGE DISPLAY DEVICE - An image display device has an image display part and a protective part on the image display part. The image display device suppresses image unevenness and cured resin peeling caused by internal stress generated due to curing shrinkage of a cured resin between the protective part and the image display part or external stress applied on the image display part due to warping of the protective part. A cured resin layer is arranged between the image display part and the protective part. The cured resin layer has a light transmittance in the visible region of 90% or more, an elongation ratio of 700% or more at 25° C. and 400% or more at 80° C., and an adhesive force with respect to the protective part of 0.4 N/cm or more at 25° C. and 0.3 N/cm or more at 80° C. | 05-13-2010 |
| 20100116543 | ELECTROMAGNETIC WAVE SUPPRESSOR AND METHOD FOR MANUFACTURING THE SAME - An electromagnetic wave suppression sheet ( | 05-13-2010 |
| 20100116533 | ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise. | 05-13-2010 |
| 20100103630 | ANISOTROPIC CONDUCTIVE MATERIAL, CONNECTED STRUCTURE, AND PRODUCTION METHOD THEREOF - An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [η | 04-29-2010 |
| 20100099365 | MAGNETIC SHEET, METHOD FOR PRODUCING THE MAGNETIC SHEET, ANTENNA, AND PORTABLE COMMUNICATION DEVICE - The present invention provides a magnetic sheet with improved resistance to folding while maintaining good magnetic characteristics and reliability; a method for producing the magnetic sheet; an antenna; and a portable communication device. | 04-22-2010 |
| 20100097552 | RESIN COMPOSITION AND IMAGE DISPLAY APPARATUS - A thin image display apparatus capable of high luminance and high contrast display of a display part, which does not produce display defects resulting from deformation of the image display part. The thin image display apparatus has an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the image display part and the protective part. The cured resin layer has a transmittance in the visible region of 90% or higher and a storage modulus at 25° C. of 1.0×107 Pa or less. The cured resin layer is formed from a resin composition which has a curing shrinkage ratio of 5.0% or less. | 04-22-2010 |
| 20100096175 | ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles. | 04-22-2010 |
| 20100085723 | MOUNTING DEVICE, MOUNTING METHOD, PACKAGE, AND PRESSURIZING PLATE - Even pressure is applied to a mounting target, even in a case where electronic components having different heights from each other are attempted to be mounted to a substrate, or in a case where an electronic component is attempted to be mounted to a substrate whose rear surface is provided with another electronic component. A mounting device | 04-08-2010 |
| 20100085720 | JOINED STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ANISOTROPIC CONDUCTIVE FILM USED FOR THE SAME - A joined structure of the present invention including a first substrate having a wiring thereon, any one of a second substrate and an electronic part, and an anisotropic conductive film containing conductive particles, wherein the first substrate and any one of the second substrate and the electronic part are electrically joined via the anisotropic conductive film, and wherein the conductive particles pressure-bonded to the wiring of the first substrate protrude from both edges of the wiring in a width direction, and an interval of the wiring is 3.5 times or more larger than an average particle diameter of the conductive particles which are not pressure-bonded to the wiring. | 04-08-2010 |
| 20100080995 | METHOD FOR CONNECTING ELECTRONIC PART AND JOINED STRUCTURE - A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles. | 04-01-2010 |
| 20100071841 | Transfer Method of Adhesive Film - A method for transferring an adhesive film, which contains: conveying the adhesive film to an area between the heating part and the adherend; pressurizing the adhesive film with the heating part from the side of the release layer and heating the adhesive layer up to a first heating temperature so as to bring the adhesive layer into contact with the adherend; bringing a high temperature heating part, which is disposed downstream of the heating part with respect to the conveyance direction of the adhesive film, into contact with the adhesive film from the side of the release layer, and heating the adhesive layer up to a second heating temperature so as to cut the adhesive layer; and releasing the release layer from the adhesive layer which is in contact with the adherend, and transferring the adhesive layer which is in contact with the adherend to the adherend. | 03-25-2010 |
| 20100065303 | ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUCING THE JOINED STRUCTURE - Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure | 03-18-2010 |
| 20100059774 | ENCAPSULANT MATERIAL FOR OPTICAL COMPONENT AND LIGHT-EMITTING DEVICE - A light-emitting device is provided which uses an encapsulant material made from a polymer having a high relative light output. The light-emitting device includes a light-emitting element and a member sealing the light-emitting element. The encapsulant material has one or more than two kinds of units given by the following formula (1) and a refractive index of 1.55 or more. | 03-11-2010 |
| 20100051878 | CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE INTERCONNECTION MATERIAL THAT USES THE CONDUCTIVE PARTICLE, AND METHOD FOR PRODUCING THE CONDUCTIVE PARTICLE - There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle ( | 03-04-2010 |
| 20100044077 | FLAT CABLE - A flexible flat cable capable of having good flexibility and good bending strength while reducing a thickness thereof without damaging a good electrical characteristic of a strip structure and capable of enhancing cost effectiveness is provided. The flexible flat cable includes: an air-containing layer, serving as an insulating member, having a width substantially the same as a transmission path width of a cable body including a plurality of conductors arranged in a prescribed pitch, the air-containing layer being disposed in such a manner as to sandwich the cable body from both sides; and shield members disposed in such a manner as to cover a surface of the air-containing layer and to be conductively connected to a ground layer at terminal portions of both ends of the cable body. The air-containing layer includes non-woven fabrics cut in a width substantially the same as the transmission path width of the cable body. | 02-25-2010 |
| 20100043965 | METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE - A thin image display device having a resin interposed between an image display unit and a protection member having a light-shielding member is manufactured. In the manufactured image display device, display defects caused by the deformation of the image display unit do not occur, and high-brightness and high-contrast display can be achieved. In addition, the resin in the area where the light-shielding member is formed can be sufficiently cured. The method for manufacturing an image display device includes the step of forming a cured resin layer by interposing a photo-curable resin composition between a base including the image display unit and a light-transmitting protection member including a light-shielding member and then photo-curing the photo-curable resin composition. In this method, a resin composition having a curing shrinkage ratio of 5% or less, yielding a cured product having a storage elastic modulus at 25° C. of 1.0×10 | 02-25-2010 |
| 20100033661 | IMAGE DISPLAY DEVICE - A thin image display device is provided which is free from display defects caused by the deformation of an image display part and can display high brightness and high contrast images. The image display device includes an image display part | 02-11-2010 |
| 20100022801 | Novel sulfonium borate complex - A novel sulfonium borate complex, which can reduce the amount of fluorine ions produced during thermal cationic polymerization, and realize low-temperature, rapid curing properties in a thermal cationic polymerizable adhesive, is represented by the structure of the following formula (1). | 01-28-2010 |
| 20100003425 | METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE - A method for manufacturing an image display device includes the step of forming a cured resin layer | 01-07-2010 |
| 20100001226 | Sheet-like soft magnetic material and production method thereof - The present invention is to impart, to a sheet-like soft magnetic material, a configuration in which sheet thickness change is suppressed and in which fluctuation in magnetic permeability is small even under a high-temperature or a high-temperature, high-humidity environment, even when a plurality of thin curable soft magnetic sheets produced by a coating method are laminated. The sheet-like soft magnetic material is formed from a soft magnetic composition which is formed by mixing at least a flat soft magnetic powder, an acrylic rubber, an epoxy resin, a curing agent for the epoxy resin, and a solvent. The flat soft magnetic powder is arranged in an in-plane direction of the sheet-like soft magnetic material. An acrylic rubber having a glycidyl group is used for the acrylic rubber. The weight ratio of the flat soft magnetic powder with respect to the total amount of the acrylic rubber, the epoxy resin, and the curing agent for the epoxy resin is 3.7 to 5.8. | 01-07-2010 |
| 20090324982 | MAGNETIC SHEET AND PRODUCTION METHOD THEREOF - A magnetic sheet, which contains: a magnetic layer including a magnetic powder and a resin composition containing the magnetic powder therein; and a convex-concave forming layer, in which the convex-concave forming layer has Bekk smoothness of 70 sec/mL or less. A method for producing a magnetic sheet, which contains: adding a magnetic powder to a resin composition to prepare a magnetic composition, and giving the magnetic composition a shape to form a magnetic layer; and placing and stacking a convex-concave forming layer and a pattern transferring material on a surface of the magnetic layer in this order, and hot pressing the stacked layers so as to bond the convex-concave forming layer with the magnetic layer to form a laminate, as well as to transfer a surface configuration of the pattern transferring material to a surface of the laminate of the convex-concave forming layer and the magnetic layer. | 12-31-2009 |
| 20090314437 | Compression bonding device - A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained. | 12-24-2009 |
| 20090296033 | Resin Composition and Display Unit - A thin display unit that incorporates a high-luminance, high-contrast display part that is free of image detects caused by the deformation of the display part is provided. The display unit of the present invention includes an image display part | 12-03-2009 |
| 20090288857 | MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - Disclosed is a multilayer wiring board in which a copper foil is bonded by a thermocompression bonding onto an insulating layer having a bump for interlayer connection buried therein, and the copper foil and the bump are electrically connected to each other. The copper foil is provided with an oxide film having a thickness of 50 Å to 350 Å on a surface in contact with the bump and an insulating layer. In a manufacturing process, for example, an oxide coating of the copper foil to be subject to the thermocompression bonding is removed by acid cleaning, and then an oxide film having an appropriate thickness is formed by irradiating the copper foil with ultraviolet light. Consequently, reliability in electrical connection between the copper foil and the burn is adequately ensured, while achieving sufficient mechanical connection strength between the copper foil and the insulating layer. | 11-26-2009 |
| 20090280332 | Adhesive composition - An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): | 11-12-2009 |
| 20090275708 | Thermosetting Epoxy Resin Composition - Even when a terminal epoxy resin is contained as the epoxy component of a thermosetting epoxy resin composition containing an aluminum chelate/silanol curing catalyst system, the epoxy resin composition can be configured to cure rapidly at low temperatures without termination of polymerization. | 11-05-2009 |
| 20090269514 | Polarizing Plate - A polarizing plate is provided in which adhesion properties between a polarizer and a protection film are improved and in which the optical properties of the polarizer are stable under the influence of moisture and the like. Specifically, in polarizing plates | 10-29-2009 |
| 20090261149 | MOUNTING METHOD USING THERMOCOMPRESSION HEAD - A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member. | 10-22-2009 |
| 20090239082 | ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND BONDED STRUCTURE - Provided is an anisotropic conductive film, containing: an insulating layer formed of an insulating resin composition; and a conductive particle-contained layer containing a photo and thermal curing resin composition and conductive particles, the conductive particles being aligned into a monolayer in a portion adjacent to an interface with the insulating layer, in which the conductive particle-contained layer has a degree of cure which is gradually lowered in a thickness direction of the conductive particle-contained layer, from the side where the conductive particles are present to the side where the conductive particles are not present. | 09-24-2009 |
| 20090230360 | Latent Curing Agent - An aluminum chelate-based latent curing agent, which can cure a thermosetting epoxy resin at a relatively low temperature in a short time, is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound, and then further reacting the resultant mixture with a liquid epoxy resin and an imidazole compound or with an aromatic vinyl compound and a radical polymerization initiator. | 09-17-2009 |
| 20090230171 | DEVICE FOR MOUNTING ELECTRIC COMPONENT - A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×10 | 09-17-2009 |
| 20090209669 | LATENT CURING AGENT - An aluminum chelating agent-based latent curing agent is provided that can rapidly cure thermosetting epoxy resins at relatively low temperatures. A method for producing the aluminum chelating agent-based latent curing agent is also provided that enables relatively facile control of the curing conditions therefor. The latent curing agent holds an aluminum chelating agent in a porous resin obtained by the interfacial polymerization of a polyfunctional isocyanate compound, and when the latent curing agent is incorporated in a curable epoxy resin composition for differential scanning calorimetric (DSC) measurement, the DSC exothermic peak temperature of the curable epoxy resin composition for DSC measurement that contains the latent curing agent that has been treated by immersion in a nonaqueous polar solvent can be brought to not less than the DSC exothermic peak temperature of the curable epoxy resin composition for DSC measurement that incorporates the latent curing agent that has not been subjected to the immersion treatment. | 08-20-2009 |
| 20090201116 | ANTENNA CIRCUIT AND TRANSPONDER - A transponder is provided capable of having desired characteristics by a method for forming a resonance circuit, despite the fact that its cost is low and its structure is simple. An antenna circuit is provided in the transponder and comprises an antenna conductor having a predetermined conductor pattern formed on the front surface of a substrate and a sheet metal disposed on the rear surface of the substrate. A part of the sheet metal is provided with a slit so formed that its start end and terminal end are opened to the area at which the sheet metal does not exist. | 08-13-2009 |
| 20090186552 | IMAGE DISPLAY DEVICE AND ITS MANUFACTURING METHOD - It is possible to manufacture a highly reliable image display device capable of proceeding with resin cure even in the case where a protective panel is provided with a light shielding portion. | 07-23-2009 |
| 20090178834 | ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE - An anisotropic electrically conductive film formed by a thermosetting acrylic resin composition is disclosed. The composition contains at least a thermosetting agent (A), a thermo-settable ingredient (B), an acrylic rubber containing hydroxyl groups (C), organic fine particles (D) and electrically conductive particles (E). The thermo-settable ingredient (B) may include a phosphorus-containing acrylic ester (b1). The weight averaged molecular weight of the acrylic rubber containing the hydroxyl groups (C) is not less than 1000000. The organic fine particles (D) include polybutadiene-based fine particles (d1). | 07-16-2009 |
| 20090167624 | ANTENNA APPARATUS - This invention provides an antenna apparatus ( | 07-02-2009 |
| 20090152504 | Latent Curing Agent - An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound. | 06-18-2009 |
| 20090148776 | Liquid absorbing sheet and nonaqueous electrolyte battery pack - A liquid absorbing sheet has a liquid-absorbing resin layer that can effectively absorb the nonaqueous electrolyte solution used in nonaqueous electrolyte secondary cells that make nonaqueous electrolyte battery packs (in particular, lithium ion-based nonaqueous secondary battery packs). The liquid-absorbing resin layer is obtained by irradiating a particular monomer composition with UV rays or other energy rays to polymerize the monomer composition. The monomer composition contains a monofunctional monomer component (A) having a polyethylene glycol acrylate monomer and an amide bond-containing acrylic monomer; and a polyfunctional monomer component (B). | 06-11-2009 |
| 20090143505 | Curable Resin Composition - A curable resin composition is provided which has an appropriate viscosity suitable for encapsulating a light-emitting device. The cured product of the curable resin composition has a refractive index equal to or larger than that of epoxy resins, is excellent in heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a high refractive index acrylic-based monomer having a refractive index of 1.52 or more and a non-polymerizable carbazole, and further contains a polymerizable carbazole in accordance with need. An acrylate or methacrylate having a fluorene skeleton, a bisphenol-A skeleton, a biphenyl skeleton, a naphthalene skeleton, or an anthracene skeleton is used as the high refractive index acrylic-based monomer. | 06-04-2009 |
| 20090126877 | THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME - The present invention provides a thermocompression bonding head capable of mounting an electric component on a wiring board in a short time with high connection reliability, and provides a mounting device using the same. A thermocompression bonding head | 05-21-2009 |
| 20090110587 | Method for manufacturing laminated soft-magnetic sheet - A method for producing a laminated soft-magnetic sheet is provided by laminating thin soft-magnetic sheets produced by an application method. A change in sheet thickness can be suppressed and variations in the magnetic permeability are small. The method for manufacturing a laminated soft-magnetic sheet includes the step (A) of obtaining curable soft-magnetic sheets, each of the curable soft-magnetic sheets being produced by applying to a release base a soft-magnetic composition prepared by mixing at least a flat soft-magnetic powder, an acrylic rubber having a glycidyl group, an epoxy resin, a latent curing agent for the epoxy resin, and a solvent, drying the applied soft-magnetic composition at a temperature T | 04-30-2009 |
| 20090107625 | Anisotropic Conductive Film - An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes. | 04-30-2009 |
| 20090090001 | METHOD FOR PRODUCING AN ELECTRIC COMPONENT-MOUNTED SUBSTRATE - A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time. | 04-09-2009 |
| 20090075198 | Photosensitive Polyimide Resin Composition - The developability of a photosensitive polyimide resin composition with a weakly alkaline aqueous solution is improved without reduction in the solubility in general-purpose organic solvents even when a part of the diamine component is replaced with a diaminopolysiloxane-based compound or a bis(aminobenzoate)-based compound in order to reduce the warpage characteristics of the photosensitive polyimide resin composition by reducing its modulus of elasticity. The photosensitive polyimide resin composition is capable of being developed in a positive manner with a weakly alkaline aqueous solution and is soluble in an organic solvent. The photosensitive polyimide resin composition contains: a polyimide resin including a polyimide unit represented by formula (1) and a polyimide unit represented by one of formulas (2) and (3); an analogue of melamine cyanurate; and an analogue of diazonaphthoquinone. The amount of the analogue of melamine cyanurate is in the range of from 5 to 50 parts by weight with respect to 100 parts by weight of the polyimide resin. | 03-19-2009 |
| 20090074990 | Method for manufacturing optically anisotropic material - When an optically anisotropic material is manufactured, an optically anisotropic liquid crystal layer with good adhesion properties and without irregular alignment is formed on a substrate. The optically anisotropic material having the optically anisotropic liquid crystal layer formed on the substrate can be manufactured by subjecting the surface of the substrate to rubbing treatment, subjecting the rubbing-treated surface to surface treatment with the hydrolysate of an alkoxysilane compound, applying a polymerizable nematic liquid crystal composition to the surface-treated surface, subjecting the applied polymerizable liquid crystal composition to alignment treatment, and subjecting the polymerizable liquid crystal composition to curing treatment while the alignment state thereof is maintained, whereby the optically anisotropic liquid crystal layer is formed. | 03-19-2009 |
| 20090039291 | Mounting method, electric part-mounted substrate and an electric device - An electric device having high reliability is to be produced. An adhesive layer includes a thermosetting resin and a radiation-curable resin, and a portion of the adhesive layer is protruded outwardly from an edge of the electric part. Radiation rays do not pass through the electric part, and the radiation-curable resin is cured in the protruding portion, while the radiation-curable resin in that portion of the adhesive layer which is positioned right behind the electric part is not polymerized. Since the electric part is fixed with the polymerized radiation-curable type resin, the electric part is not misaligned when the electric part is pressed under heating. | 02-12-2009 |
| 20090038843 | Functional element-mounted module and a method for producing the same - A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away. | 02-12-2009 |
| 20090038753 | MOUNTING METHOD - A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained. | 02-12-2009 |
| 20090035642 | ELECTROCHEMICAL CELL AND PRODUCTION METHOD THEREOF - An object of the present invention is to provide a novel electrochemical cell, and a method of producing the novel electrochemical cell. | 02-05-2009 |
| 20090022949 | Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing - Opposed to a substrate ( | 01-22-2009 |
| 20090020214 | Thermosetting Adhesive - A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent. | 01-22-2009 |
| 20090014498 | COMPRESSION BONDING DEVICE - A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device. | 01-15-2009 |
| 20090000804 | Transmission Cable - A transmission cable is provided and includes multiple signal lines formed on one side of an insulation layer | 01-01-2009 |
| 20080319110 | Latent curing agent - A latent curing agent that can cure a thermosetting epoxy resin in a relatively short period of time and at a relatively low temperature has a structure in which an aluminum chelating agent is held by a porous resin carrier obtained through interfacial polymerization of a polyfunctional isocyanate compound. The aluminum chelating agent is preferably a complex compound comprising β-ketoenolate anion ligands coordinated to aluminum. The latent curing agent can be produced by dissolving the aluminum chelating agent and the polyfunctional isocyanate compound in a volatile organic solvent, adding the resulting solution to an aqueous phase containing a dispersing agent, and stirring the resulting mixture to cause interfacial polymerization of the isocyanate compound while the mixture is being heated. | 12-25-2008 |
| 20080311707 | Process for producing a functional device-mounted module - The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed. | 12-18-2008 |
| 20080299388 | Adhesive Composition and Adhesive Sheet - A pressure-sensitive adhesive composition capable of giving a pressure-sensitive adhesive sheet which simultaneously realizes satisfactory holding power, adhesion, and peel resistance in peeling from curved surfaces, while balancing these properties, and has satisfactory heat resistance. The composition comprises the following ingredients: (A) a maleimide crosslinking agent having two or more maleimide groups per molecule; (B) a monomer which, when caused to homopolymerize, gives a homopolymer having a glass transition temperature of −40° C. or lower; (C) a carboxylated monomer copolymerizable with the monomer of the ingredient (B); and (D) a photopolymerization initiator, the maleimide crosslinking agent of the ingredient (A) being contained in an amount of 0.01-2 parts by weight per 100 parts by weight of the sum of the monomers of the ingredients (B) and (C). | 12-04-2008 |
| 20080269457 | Process For Producing Polyimide Fine Particle - A process for producing polyimide fine particles that involves subjecting a polyamic acid solution to a thermal imidization process to directly produce polyimide fine particles. In the process, relatively monodisperse, non-aggregating fine polyimide particles can be directly obtained without using thermal imidization catalysts that are difficult to remove from the reaction mixture or without using an azeotropic solvent to remove the water produced. | 10-30-2008 |
| 20080249258 | Latent curing agent for epoxy resin and method for manufacturing the same - A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct. After the slurry was cooled, the polyfunctional isocyanate compound is added thereto to crosslink the ethyl cellulose film. | 10-09-2008 |
| 20080249257 | Latent curing agent for epoxy resin and method for manufacturing the same - A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct. After the slurry is cooled, the latent epoxy resin curing agent is filtrated. If necessary, the ethyl cellulose film is crosslinked with a polyfunctional isocyanate compound. | 10-09-2008 |
| 20080237034 | Processes for forming transparent conductive films - A target containing an indium oxide and a tin oxide is used and sputtered particles from the target are transported by a forced gas flow of a sputter gas onto an organic substrate and deposited on the organic substrate while applying a DC bias voltage or an RF bias voltage to the organic substrate. The organic substrate is close to the target so that it is positively acted on by plasma. Thus, an ITO transparent conductive film having a resistivity of 10 | 10-02-2008 |
| 20080230254 | TRANSMISSION CABLE - A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided. | 09-25-2008 |
