SMOLTEK AB Patent applications |
Patent application number | Title | Published |
20130334704 | Deposition and Selective Removal of Conducting Helplayer for Nanostructure Processing - A method for making one or more nanostructures is disclosed, the method comprising: depositing a conducting layer on an upper surface of a substrate; depositing a patterned layer of catalyst on the conducting layer; growing the one or more nanostructures on the layer of catalyst; and selectively removing the conducting layer between and around the one or more nanostructures. A device is also disclosed, comprising a substrate, wherein the substrate comprises one or more exposed metal islands separated by one or more insulating areas; a conducting helplayer disposed on the substrate covering at least some of the one or more exposed metal islands or insulating areas; a catalyst layer disposed on the conducting helplayer; and one or more nanostructures disposed on the catalyst layer. | 12-19-2013 |
20130230736 | NANOSTRUCTURE DEVICE AND METHOD FOR MANUFACTURING NANOSTRUCTURES - A method for manufacturing a plurality of nanostructures ( | 09-05-2013 |
20120301607 | Connecting and Bonding Adjacent Layers with Nanostructures - An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same. | 11-29-2012 |
20120224327 | Integrated Circuits Having Interconnects and Heat Dissipators Based on Nanostructures - The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices. | 09-06-2012 |
20120125537 | Connecting and Bonding Adjacent Layers with Nanostructures - An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same. | 05-24-2012 |
20110195141 | TEMPLATE AND METHOD OF MAKING HIGH ASPECT RATIO TEMPLATE FOR LITHOGRAPHY AND USE OF THE TEMPLATE FOR PERFORATING A SUBSTRATE AT NANOSCALE - Template and method of making high aspect ratio template, stamp, and imprinting at nanoscale using nanostructures for the purpose of lithography, and to the use of the template to create perforations on materials and products. | 08-11-2011 |
20100328898 | Integrated Circuits Having Interconnects and Heat Dissipators Based on Nanostructures - The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices. | 12-30-2010 |
20100171093 | Controlled Growth of a Nanostructure on a Substrate, and Electron Emission Devices Based on the Same - The present invention provides for an array of nanostructures grown on a conducting substrate. The array of nanostructures as provided herein is suitable for manufacturing electronic devices such as an electron beam writer, and a field emission device. | 07-08-2010 |
20090072408 | Connecting and Bonding Adjacent Layers with Nanostructures - An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same. | 03-19-2009 |