| SMARTRAC IP B.V. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100226107 | METHOD AND SEMIFINISHED PRODUCT FOR PRODUCING AN INLAY - The invention relates to a method and a semifinished product for producing an inlay, in particular for chip cards, stored value cards, identification documents, or the like, having at least two electronic components, all electronic components being arranged in a relative configuration on a carrier substrate to implement a component configuration and the component configuration being arranged in a filler material. Furthermore, the invention relates to a method for producing a card having a semifinished product and a card produced using the semifinished product. | 09-09-2010 |
| 20100097280 | TRANSPONDER DEVICE - The present disclosure pertains to a transponder device ( | 04-22-2010 |
| 20100083485 | METHOD FOR PRODUCING A SECURITY LAYERED CONSTRUCTION AND SECURITY LAYERED CONSTRUCTION AND IDENTIFICATION DOCUMENTS CONTAINING SUCH A CONSTRUCTION - A method for producing a security layered construction as well as a security layered construction for an identification document ( | 04-08-2010 |
| 20100060458 | TRANSPONDER DEVICE - The present disclosure generally pertains to a transponder device ( | 03-11-2010 |
| 20100001078 | TRASPONDER UNIT - The invention relates to a transponder unit ( | 01-07-2010 |
| 20080314990 | Chip Card and Method For the Production of a Chip Card - The invention pertains to a chip card and to a method for producing a chip card with a chip module that is contacted with an external contact arrangement arranged in the contact surface of a card body, as well as with an antenna device arranged in a card inlay, wherein the card inlay is initially produced in a first production device and the card inlay is subsequently provided with at least one respective external layer on both sides in a second production device, namely in such a way that the external contact arrangement arranged on the external contact side of the chip carrier is introduced into a recess of the assigned external layer, and wherein a connection between the card inlay and the external layers is subsequently produced in a laminating process. | 12-25-2008 |
