| Skorpios Technologies, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120057610 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER AND A PHASE MODULATOR - A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes an optical modulator optically coupled to the gain medium, a phase modulator optically coupled to the optical modulator, and a waveguide disposed in the substrate and optically coupled to the gain medium. The tunable laser further includes a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate, an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide, and an output mirror. | 03-08-2012 |
| 20120057609 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER AND A MACH ZEHNDER MODULATOR - A tunable pulsed laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable pulsed laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, an optical modulator optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable pulsed laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 03-08-2012 |
| 20110267676 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF AN OPTO-ELECTRONIC INTEGRATED CIRCUIT - An opto-electronic integrated circuit (OEIC) includes an SOI substrate, a set of composite optical transmitters, a set of composite optical receivers, and control electronics disposed in the substrate and electrically coupled to the set of composite optical transmitters and receivers. Each of the composite optical transmitters includes a gain medium including a compound semiconductor material and an optical modulator. Each of the composite optical receivers includes a waveguide disposed in the SOI substrate, an optical detector bonded to the SOI substrate, and a bonding region disposed between the SOI substrate and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region and a direct semiconductor-semiconductor bond at a second portion of the bonding region. The OEIC also includes control electronics disposed in the SOI substrate and electrically coupled to the set of composite optical transmitters and the set of composite optical receivers. | 11-03-2011 |
| 20110085577 | METHOD AND SYSTEM OF HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION - A hybrid integrated optical device includes a substrate comprising a silicon layer and a compound semiconductor device bonded to the silicon layer. The device also includes a bonding region disposed between the silicon layer and the compound semiconductor device. The bonding region includes a metal-semiconductor bond at a first portion of the bonding region. The metal-semiconductor bond includes a first pad bonded to the silicon layer, a bonding metal bonded to the first pad, and a second pad bonded to the bonding metal and the compound semiconductor device. The bonding region also includes an interface assisted bond at a second portion of the bonding region. The interface assisted bond includes an interface layer positioned between the silicon layer and the compound semiconductor device, wherein the interface assisted bond provides an ohmic contact between the silicon layer and the compound semiconductor device. | 04-14-2011 |
| 20110085572 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER - A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 04-14-2011 |
