20130277857 | STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING AND TESTING THE SAME - There are proposed a stack type semiconductor device and a method of fabricating and testing the same. A stack type semiconductor device according to an embodiment of the present invention includes a plurality of contact pads externally exposed, a via array electrically connected to the contact pads, a semiconductor substrate configured to have vias, forming the via array, electrically conductive with each other or insulated from each other, and a bias pad configured to supply a bias to the semiconductor substrate, wherein the semiconductor substrate may be subject to back-grinding. | 10-24-2013 |