| SILTRONIC CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20110099830 | TOOL POSITIONING SYSTEM - A system and a process are provided for positioning a tool relative to a surface. The system may include a mount fixed in location relative to the surface. A positioning assembly may be coupled to the mount that holds the tool adjacent the surface and moves the tool relative to the surface. The positioning assembly may move the tool to a reference location, identify such location, and then move to the tool to an operating position defined at a specified distance from the reference position. The positioning assembly may include a strain gauge to identify contact of the tool with the surface at the reference location via an indicator coupled to the strain gauge. The positioning assembly may also include a micrometer attached at its body to the mount and a spindle operable to move the tool. Fixtures couple the micrometer, strain gauge and tool to maintain fixed relative positions except for calibrated movement of the tool. | 05-05-2011 |
| 20110078884 | TOOL FOR COMPRESSING AND INSERTING A PLIABLE MEMBER INTO A CHANNEL - A tool is provided for compressing and inserting a pliable member past a rim of a channel and into the channel. The tool may be used to install o-rings in a segmented fashion. The tool may include a handle for the user to hold and operate the tool. A support for a press may be coupled to the handle. The support may be a shaft mounted partially within, and movable relative to, the handle. The shaft may include a slot adjacent the press to receive and be aligned with the pliable member. The handle and the press may be movable between a nominal position and a compressing position. The press may include pivoting arms with opposing faces, each having a beveled portion, that are operable, when moved to the compressing position, to compress the pliable member and push it into the channel. An actuator, such as a collar on the handle, may operate on the press arms as the handle is moved downwardly, to move them inwardly to the compressed position. | 04-07-2011 |
| 20090215202 | CONTROLLED EDGE RESISTIVITY IN A SILICON WAFER - An epitaxial silicon wafer is produced with a resistivity in the area adjacent the edge that is greater or less than the resistivity adjacent the center. The wafer may be manufactured by a method wherein one or more process parameters are adjusted during deposition of epitaxial layer to control the edge resistivity. Such process parameters may include using a non-homogeneous temperature and/or a process reactant gas flow across the front surface of the wafer. | 08-27-2009 |
| 20090214843 | CONTROLLED EDGE RESISTIVITY IN A SILICON WAFER - An epitaxial silicon wafer is provided with a thickness in the area adjacent the edge that is greater or less than the thickness adjacent the center. The wafer may be manufactured by a method wherein one or more process parameters are adjusted during deposition of epitaxial layer to control the edge thickness. | 08-27-2009 |
