20140069579 | METHOD FOR MANUFACTURING A CONTACT FOR TESTING A SEMICONDUCTOR DEVICE - The present invention relates to a contact for a test socket in which conductor portions are formed so as to be arranged at certain intervals on a dielectric plate used for testing whether a semiconductor device is normal by contacting a read terminal of the semiconductor device, and more particularly, to a method for manufacturing a contact for testing a semiconductor device, wherein a dielectric plate and a conductor portion are continuously alternately bonded and stacked repeatedly, one side of the stack is cut, then the stack and a dielectric layer are again subjected to repeated alternating bonding and stacking, after which the front surface of the stack is cut to yield a finished product of a new type of contact. Thus, the pitch between adjacent conductor portions can be determined according to the thickness at which layers are formed and the cut width in the manufacturing process, so that a desired pitch of the conductor portion can be achieved. | 03-13-2014 |