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Silicon Base Development Inc.
| Silicon Base Development Inc. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20090261375 | PACKAGE-BASE STRUCTURE OF LUMINESCENT DIODE AND FABRICATING PROCESS THEREOF - A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure. | 10-22-2009 |