| Siklu Communication Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120076224 | Ultra-high-bandwidth low-power-consumption wireless communication systems - An ultra-high-bandwidth low-power-consumption wireless communication system includes (i) a Radio Frequency Integrated Circuit (RFIC) comprising a radio transmitter, transmitting millimeter-wave signals. The radio transmitter includes a Power Amplifier (PA) outputting the millimeter-wave signals at a low power level of between −10 dBm and 20 dBm, and by that allowing inclusion of the PA in the RFIC. The radio transmitter further includes a Voltage Controlled Oscillator (VCO) and a synthesizer driving a mixer up-converting signals into the millimeter-wave signals. The VCO and synthesizer have a combined phase noise between a first level and a second level, wherein the first level is high enough to allow inclusion of the VCO and synthesizer in the RFIC, and the second level is low enough to facilitate transmitting at 16-levels Quadrature-Amplitude-Modulation (16QAM). | 03-29-2012 |
| 20120076217 | Using OFDM to correct distortions in Ultra-Wide-Band radios operating over flat millimeter-wave channels - A Point-to-Point communication system includes (i) a millimeter-wave channel having a substantially flat channel transfer function between a first frequency of millimeter-waves and a second frequency of millimeter-waves, the two frequencies are separated by at least 500 MHz, (ii) a transmission system configured to transmit an Orthogonal Frequency Division Multiplexing (OFDM) signal having a bandwidth of at least 100 MHz over the millimeter-wave channel as a millimeter-wave signal located between the first frequency and the second frequency, and (iii) a reception system comprising a radio receiver having a substantially non-flat reception transfer function over the bandwidth of the OFDM signal, configured to receive the millimeter-wave signal via the millimeter-wave channel and down-convert the millimeter-wave signal into a reconstruction of the OFDM signal having a bandwidth of at least 100 MHz, and an OFDM de-modulator configured to compensate for the substantially non-flat reception transfer function, by de-modulating the reconstruction of the OFDM signal. | 03-29-2012 |
| 20110309987 | REFLECTOR ANTENNA INCLUDING RADOME - A radome comprises a structure covering an antenna, the structure being substantially transparent to radiation of the antenna in a first direction and being less transparent to radiation of the antenna when deviating from the first direction, thereby imparting a directional profile to radiation of the antenna. The millimeter wave antenna structure comprises a sub-reflector lens, and a reflector, the sub-reflector lens in turn comprising a reflecting metal plate and a lens shaped dielectric material, the lens shaped dielectric material and the reflecting metal plate being shaped together to provide a predetermined radiation illumination pattern on the reflector. A waveguide matching holder connects a circular cross section waveguide via a circular cavity, and a rectangular waveguide feed via a rectangular cavity, the rectangular and the circular cavities being shaped to merge into each other. | 12-22-2011 |
| 20110309899 | ACCURATE MILLIMETER-WAVE ANTENNAS AND RELATED STRUCTURES - A method for accurately guiding millimeter-waves includes the following steps: Filtering millimeter-waves by applying the millimeter-waves at a first shape aperture of a filter waveguide, resulting in filtered millimeter-waves exiting a second shape aperture of the filter waveguide. Transporting the filtered millimeter-waves over a distance of between 9 centimeters and 25 centimeters, by applying the filtered millimeter-waves to an extruded waveguide having a length of between 9 centimeters and 25, and having a cavity featuring a cross-section that is accurate to within +/−0.05 millimeters throughout the length of the extruded waveguide, resulting in transported millimeter-waves. And producing, on a reflector, an illumination pattern that is accurate to a degree that allows conforming to a first level of radiation pattern accuracy, by applying the transported millimeter-waves at a focal point of the reflector. | 12-22-2011 |
| 20110299256 | PACKAGING FOR A MILLIMETER WAVE RADIO-FREQUENCY INTEGRATED CIRCUIT (RFIC) - Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity. | 12-08-2011 |
| 20110140979 | Waveguide comprising laminate structure - A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity. | 06-16-2011 |
| 20110140811 | Millimeter-Wave Chip Packaging and Interface - A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads. | 06-16-2011 |
| 20110140810 | Waveguide-backshort comprising a printed conducting layer - A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture. | 06-16-2011 |
| 20110140799 | Low-Loss Millimeter-Wave Interface Comprising a Bare-Die - A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards. | 06-16-2011 |
| 20110138619 | Methods for Constructing Millimeter-Wave Laminate Structures and Chip Interfaces - A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity. | 06-16-2011 |
| 20110057741 | INTERFACING BETWEEN AN INTEGRATED CIRCUIT AND A WAVEGUIDE - A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface. | 03-10-2011 |
| 20100302101 | ANTENNA ALIGNMENT METHOD AND APPARATUS - A method of automatic alignment of two directional beams having a known path attenuation, and an antenna gain pattern, for mutual transmission, comprises: determining a beam width between two angles of minimal detectable connection on either side of a beam maximum; then mapping points onto a scan field in a regular pattern, the pattern based on the beam width, such that a beam with the determined beam width is detected once if the beam is in the scan field at all; scanning the first antenna over the mapped scan points; and for each point allowing the second antenna to scan over all of its own set of mapped scan points, thereby providing a coarse alignment of the two antennas to achieve at least a minimal mutual connection. The coarse alignment may be followed by a fine alignment to maximize the signal. | 12-02-2010 |
