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Siimpel Corporation

Siimpel Corporation Patent applications
Patent application numberTitlePublished
20100308431Mechanical Isolation For MEMS Electrical Contacts - In accordance with the disclosure, a MEMS substrate is provided that includes: a central planar portion configured to support a MEMS device; and a first electrical pad coplanar with the central planar portion, the first pad being connected to the central planar portion through a first flexure, wherein the first flexure is configured to substantially mechanically isolate the first electrical pad from the central planar portion.12-09-2010