| Siemens VDO Automotive Corporation Patent applications |
| Patent application number | Title | Published |
|---|
| 20090304527 | FUEL PUMP WITH INNER CHANNEL PRIMING - A pump unit ( | 12-10-2009 |
| 20090067109 | OPERATING AND CONTROLLING INSULATED GATE BIPOLAR TRANSISTORS IN HIGH SPEED FAILURE MODE SITUATIONS - A circuit and method to provide dynamic fault protection to transistors are disclosed. The fault protection may be particularly suited for protecting insulated gate bipolar transistors (IGBTs). | 03-12-2009 |
| 20090035153 | Jet pump retention and seal method with living hinge - A fuel supply unit includes a fuel reservoir ( | 02-05-2009 |
| 20090020162 | Auxiliary side hose connection for dual chamber fuel tank - A hose connection ( | 01-22-2009 |
| 20080278978 | HIGH VOLTAGE INDUCTIVE CHARGE PUMP DC-TO-DC CONVERTER ASSEMBLY - A method and apparatus for a power converter assembly charges a first capacitor and a second capacitor in parallel to a first voltage and at a first polarity, and then discharges the first capacitor and second capacitor in series at an output voltage that is greater than the input voltage and at a second polarity that is opposite the first polarity. This “charge pump” process is repeated and filtered to produce a continuous output. | 11-13-2008 |
| 20080216800 | Fuel delivery module for low installation height applications - A fuel delivery module | 09-11-2008 |
| 20080205020 | CONNECTION OF WIRE TO A LEAD FRAME - An integrated circuit includes a first lead frame and a second lead frame that extend from an overmolded circuit assembly. Each of the lead frames includes a piercing portion to pierce through insulation on a corresponding electrical conduit. The piercing portion of the lead frames also provides a wrap around feature to mechanically secure the wire to the corresponding electrical conduit. In this manner, several processes can be eliminated and are not required for the desired mechanical and electrical connection of the integrated circuit lead frame to corresponding electrical conductors. | 08-28-2008 |
| 20080205015 | LEAD FRAME MOUNT FOR CIRCUIT COMPONENT - An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein. | 08-28-2008 |
