| 20110236712 | COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PARTS, AND MATING-TYPE CONNECTING PART AND METHOD FOR PRODUCING THE SAME - The surface roughness of a copper sheet is adjusted to have an arithmetic mean roughness Ra of 0.5 μm or more and 4.0 μm or less in a direction parallel to a sliding direction upon connection, a mean projection-depression interval RSm of 0.01 mm or more and 0.3 mm or less in the direction, a skewness Rsk of less than 0, and a protrusion peak portion height Rpk of 1 μm or less. Further, as a surface coating layer, a Sn coating layer group X observed as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is present adjacent to each side of each of Sn coating layers constituting the Sn coating layer group X. The maximum height roughness Rz is 10 μm or less in a direction of part insertion. At the time of stamping the copper sheet, the copper sheet is surface-roughened by pressing, thereby forming depressions observed as a plurality of parallel lines in the surface of the copper sheet. The copper sheet is then plated with Cu and Sn, followed by reflowing to complete the production. | 09-29-2011 |
