| SHIBUYA KOGYO CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110174442 | BONDING APPARATUS - A bonding apparatus includes: a bonding head having a bonding tool for sucking and holding an electronic part; elevator means lifting up/down the bonding head; a stopper provided to the bonding head; a stopper support that regulates a descending height of the bonding head with engagement with the stopper; distance detection means that detects a distance between the stopper and the stopper support; stopper support elevator means that lifts up/down the stopper support independently from the bonding head; and control means that controls the stopper support elevator means. The control means controls a height of the stopper support so as to keep the distance between the stopper and the stopper support at a predetermined distance by using a signal from the distance detection means until the bump is melted in heating and pressing the electronic part to the substrate. | 07-21-2011 |
| 20110121055 | BONDING APPARATUS - There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip. | 05-26-2011 |
| 20100127048 | CONDUCTIVE BALL MOUNTING APPARATUS - A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a plurality of conductive balls, in the bottom, by moving the ball reservoir along the array mask, by dropping the conductive balls into the individual through holes of the array mask, adopts the following means. Firstly, the conductive ball mounting apparatus comprises moving means for moving the array mask and the stage relative to each other in horizontal directions. Secondly, the positions of the conductive balls in the through holes are arranged by finely moving at least one of the array mask and the stage relative to each other in the horizontal directions after the balls were dropped. | 05-27-2010 |
| 20100044413 | MINUTE BALL ARRAY APPARATUS - A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls. | 02-25-2010 |
| 20100044412 | BALL ARRAY MASK AND BALL ARRAY MASK SUPPORTING APPARATUS - A ball array mask includes: a metal mask, which includes through holes into which minute balls are inserted, and which is positioned at a location above an object to be mounted; a hollow frame; a stretchable sheet, edges of the metal mask being affixed to the hollow frame by the stretchable sheet; and projection members that are attached to respective corners of the metal mask so as to pull the metal mask outwardly. | 02-25-2010 |
| 20090307900 | METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS - A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting positions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in positions corresponding to the mounting positions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount. | 12-17-2009 |
| 20090071945 | BONDING DEVICE - A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head. | 03-19-2009 |
| 20090057372 | CONDUCTIVE BALL MOUNTING APPARATUS - A conductive ball mounting apparatus includes a stage including a placement surface, stage moving means that moves the stage between a supply position and a mounting position, mounting means that comprises an array mask and mounts the conductive ball to the object to be mounted via the array mask, elevating means that changes a distance between the array mask of the mounting means and the placement surface of the stage, and thickness measuring means provided at the supply position so as to measure a thickness of the object to be mounted placed on the placement surface. The thickness of the object to be mounted is measured at the supply position, and the conductive ball is mounted by controlling the elevating means to set a distance between an upper surface of the array mask and an upper surface of the object to be mounted at the mounting position to a predetermined value in accordance with the measured thickness. | 03-05-2009 |
