| SHIBAURA MECHATRONICS CORPORATION Patent applications |
| Patent application number | Title | Published |
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| 20120132617 | PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD - A plasma etching apparatus includes a processing container, a depressurization unit, a placement unit, a discharge tube, an introduction waveguide tube, a gas supply unit, a transport tube, a detection window, a coherent light detection unit, and a control unit. The control unit is configured to detect an end point of etching based on an output from the coherent light detection unit. The control unit is configured to use an output from the light receiving devices of a detection region of the coherent light detection unit to extract an output of the light receiving device of a portion of the detection region corresponding to an etching portion to detect the end point of the etching based on an intensity of the coherent light determined from the output of the light receiving device of the portion of the detection region corresponding to the etching portion. | 05-31-2012 |
| 20120129083 | METHOD FOR MANUFACTURING REFLECTIVE MASK AND APPARATUS FOR MANUFACTURING REFLECTIVE MASK - According to one embodiment, a method is disclosed for manufacturing a reflective mask. The method can include forming a reflection layer on a major surface of a substrate. The method can include forming an absorption layer on the reflection layer. The method can include forming a pattern region in the absorption layer. In addition, the method can include forming a light blocking region surrounding the pattern region in the absorption layer and the reflection layer. The forming the light blocking region includes etching-processing the reflection layer using a gas containing chlorine and oxygen. | 05-24-2012 |
| 20120077302 | LEAD WIRE CONNECTION APPARATUS AND CONNECTION METHOD OF SEMICONDUCTOR CELLS - Convey means for pitch-feeding the semiconductor cell to which the conductive tapes have been attached, lead wire processing means for forming-processing the lead wire, provisional pressure-bonding means which is provided at a part opposed to the semiconductor cell that is pitch-fed, holds the lead wires which are forming-processed, repeats provisional pressure-bonding of the lead wires to the conductive tapes provided on the upper surface and lower surface of the semiconductor cell that is pitch-fed, and alternately connects the upper surfaces and lower surfaces of the neighboring semiconductor cells, and main pressure-bonding means which is disposed on a downstream side of the provisional pressure-bonding means in a direction of conveyance of the semiconductor cell, and which mainly pressure-bonds, simultaneously, the paired upper and lower lead wires which have been provisionally pressure-bonded to the upper surface and lower surface of the semiconductor cell. | 03-29-2012 |
| 20120004773 | GRIPPING DEVICE, TRANSFER DEVICE, PROCESSING DEVICE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE - According to one embodiment, a gripping device grips a rim of a workpiece by opening and closing gripping plates. The device includes a gripping unit, a hoisting and lowering unit and a motion control unit. The gripping unit includes a first and a second gripping plate. The first gripping plate has a first gripper to contact the rim. The second gripping plate has a second gripper to contact the rim. At least one of the first and second gripping plates is moved and the first and second gripper are spaced from each other. The hoisting and lowering unit is configured to hoist and lower the gripping unit. The motion control unit is configured to control open/close operations and hoisting and lowering operations. The motion control unit mechanically controls first first hoisting and lowering operations, controls second the open/close operations, and controls third second hoisting and lowering operations. | 01-05-2012 |
| 20110290185 | SUBSTRATE COOLING DEVICE AND SUBSTRATE TREATMENT SYSTEM - A substrate cooling device configured to cool a substrate after a treatment, the device includes: a housing having a space configured to house a substrate internally; a pair of holder sections provided so as to face an inner wall of the housing, and including a groove section supporting an end neighborhood of the substrate; and a pair of cooling sections including a cooling mechanism provided to sandwich the pair of holder sections in a direction crossing a direction in which the holder sections face each other. According to the invention, a time for cooling the substrate after the treatment can be reduced. | 12-01-2011 |
| 20110278261 | ETCHING ACID WASTE LIQUID DISPOSAL SYSTEM, ETCHING ACID WASTE LIQUID DISPOSAL APPARATUS AND ETCHING ACID WASTE LIQUID DISPOSAL METHOD APPLIED TO THE SYSTEM AND THE APPARATUS - According to one embodiment, a solid removal process in a filter and a positive metal ion removal process in a positive metal ion-exchange resin column are performed sequentially through an etching acid waste liquid disposal circulation flow channel, the solid removal process is performed on an upstream side of the positive metal ion removal process, furthermore after the positive metal ion removal process, a negative metal ion removal process removing at least B using a chelate forming fiber or a chelate forming resin is performed on a downstream side of the etching acid waste liquid disposal circulation flow channel, thereby an etching acid waste liquid is recycled sequentially through the etching acid waste liquid disposal circulation flow channel. | 11-17-2011 |
| 20110263133 | SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device manufacturing apparatus includes: an accommodation section accommodating an application object; an irradiation section irradiating the application object taken out from the accommodation section with ultraviolet light; an application section including a stage allowing the application object to be placed thereon and an application head discharging a plurality of droplets of an adhesive to the application object placed on the stage, the application section applying the adhesive through the application head to the application object which is irradiated by ultraviolet light through the irradiation section and is placed on the stage; a drying section drying the adhesive applied on the application object with heat; and a transport section including a hand supporting the application object, the transport section which is capable of transporting the application object accommodated in the accommodation section to the irradiation section, the application section, and the drying section. | 10-27-2011 |
| 20110143549 | ETCHING METHOD, METHOD FOR MANUFACTURING MICROSTRUCTURE, AND ETCHING APPARATUS - In one embodiment, an etching method is disclosed. The method can include producing an oxidizing substance by electrolyzing a sulfuric acid solution, and producing an etching solution having a prescribed oxidizing species concentration by controlling a produced amount of the produced oxidizing substance. The method can include supplying the produced etching solution to a surface of a workpiece. | 06-16-2011 |
| 20110114473 | MAGNETRON SPUTTERING APPARATUS AND MAGNETRON SPUTTERING METHOD - A magnetron sputtering apparatus of the invention includes: a sputtering chamber in which a target can be opposed to an object to be subjected to film formation; a gas introduction port facing the sputtering chamber; a magnet provided outside the sputtering chamber and opposite to the target and being rotatable about a rotation center which is eccentric with respect to center of the magnet; a sensor configured to detect a circumferential position of the magnet in a plane of rotation of the magnet; and a controller configured to start voltage application to the target to cause electrical discharge in the sputtering chamber on the basis of the circumferential position of the rotating magnet and gas pressure distribution in the sputtering chamber. | 05-19-2011 |
| 20110092073 | PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - A plasma processing apparatus includes: a processing container capable of maintaining an atmosphere having a pressure lower than atmospheric pressure; an evacuation unit reducing a pressure of an interior of the processing container; a gas introduction unit introducing a process gas to the interior of the processing container; a microwave introduction unit introducing a microwave to the interior of the processing container; and a lifter pin ascendably and descendably inserted through a placement platform provided in the interior of the processing container, an end surface of the lifter pin supporting an object to be processed, the object to be processed being supported by the lifter pin at a first position proximal to an upper surface of the placement platform when the microwave is introduced and plasma is ignited, the object to be processed being supported by the lifter pin at a second position after the plasma ignition, the second position being more distal to the placement platform than the first position. | 04-21-2011 |
| 20110073565 | SPIN PROCESSING APPARATUS AND SPIN PROCESSING METHOD - A cup member, a rotary table which is provided in the cup member and is driven to rotate, holding the substrate, a treatment liquid receiver which has a ring shape open upward and is provided to be movable in vertical directions, between inner circumference of the cup member and outer circumference of the rotary table, to receive the plurality of kinds of treatment liquids scattering from the substrate rotating, a linear motor which sets the treatment liquid receiver to height levels by driving the treatment liquid receiver in the vertical directions, respectively corresponding to the plurality of types of treatment liquids supplied for the substrate, and first to third separate flow channels which are provided on the cup member and separately collect the treatment liquids received by the treatment liquid receiver, respectively corresponding to the height levels set by the linear motor. | 03-31-2011 |
| 20110073490 | CLEANING METHOD, CLEANING SYSTEM, AND METHOD FOR MANUFACTURING MICROSTRUCTURE - According to one embodiment, a cleaning method is disclosed. The method can produce an oxidizing solution including an oxidizing substance by electrolyzing a dilute sulfuric acid solution. In addition, the method can supply a highly concentrated inorganic acid solution individually, sequentially, or substantially simultaneously with the oxidizing solution to a surface of an object to be cleaned. | 03-31-2011 |
| 20110073489 | CLEANING LIQUID, CLEANING METHOD, CLEANING SYSTEM, AND METHOD FOR MANUFACTURING MICROSTRUCTURE - According to embodiments, a cleaning liquid includes an oxidizing substance and hydrofluoric acid and exhibiting acidity. A cleaning method is disclosed. The method includes producing an oxidizing solution including an oxidizing substance by one selected from electrolyzing a sulfuric acid solution, electrolyzing hydrofluoric acid added to a sulfuric acid solution, and mixing a sulfuric acid solution with aqueous hydrogen peroxide. The method includes supplying the oxidizing solution and hydrofluoric acid to a surface of an object to be cleaned. | 03-31-2011 |
| 20110048471 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes at least one liquid droplets supplying nozzle configured to eject liquid droplets; and a liquid droplet atomizer configured to atomize the liquid droplets ejected from the nozzle to supply the atomized liquid droplets to a substrate. | 03-03-2011 |
| 20100255208 | DROPLET APPLYING DEVICE, DROPLET APPLYING METHOD, LIQUID CRYSTAL DISPLAY PANEL MANUFACTURING APPARATUS, AND LIQUID CRYSTAL DISPLAY PANEL MANUFACTURING METHOD - A droplet applying device ( | 10-07-2010 |
| 20100230273 | FILM FORMING APPARATUS AND FILM FORMING METHOD - A film forming apparatus and a film forming method includes: a vacuum chamber; a holder for a film formation object, the holder being rotatably provided in the vacuum chamber; and a sputter source capable of holding a plurality of targets, the sputter source being spinnably provided so that the opposed area of the target with respect to the film formation object can be varied. They can perform uniform and efficient film formation in accordance with the size of a film formation object using a simple configuration, with less possibility of contamination and easy maintenance. | 09-16-2010 |
| 20100210447 | PHOTOCATALYST ELEMENT, METHOD AND DEVICE FOR PREPARING THE SAME - A photocatalyst according to the invention comprises a photocatalytic film of a compound of titanium and oxygen and is characterized in that the photocatalytic film is made porous and has 0.02 or higher value as a value calculated by dividing the arithmetical mean deviation of profile Ra with the film thickness. The photocatalytic film can also be specified by the intensity ratio between x-ray diffraction peaks of the anatase structure of titanium oxide. Such a porous photocatalytic material can be obtained by a reactive sputtering method in conditions of adjusting film formation parameters such as the film formation rate, the sputtering pressure, the substrate temperature, the oxygen partial pressure and the like in proper ranges, respectively, and the photocatalyst material is provided with excellent decomposition and hydrophilization capability. | 08-19-2010 |
| 20100206723 | PHOTOCATALYST ELEMENT, METHOD AND DEVICE FOR PREPARING THE SAME - A photocatalyst according to the invention comprises a photocatalytic film of a compound of titanium and oxygen and is characterized in that the photocatalytic film is made porous and has 0.02 or higher value as a value calculated by dividing the arithmetical mean deviation of profile Ra with the film thickness. The photocatalytic film can also be specified by the intensity ratio between x-ray diffraction peaks of the anatase structure of titanium oxide. Such a porous photocatalytic material can be obtained by a reactive sputtering method in conditions of adjusting film formation parameters such as the film formation rate, the sputtering pressure, the substrate temperature, the oxygen partial pressure and the like in proper ranges, respectively, and the photocatalyst material is provided with excellent decomposition and hydrophilization capability. | 08-19-2010 |
| 20100177953 | DISC WAFER INSPECTING DEVICE AND INSPECTING METHOD - [Problem] An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided. | 07-15-2010 |
| 20100122772 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - Provided is a substrate treatment apparatus that treats a surface of a substrate while rotating the substrate. The substrate treatment apparatus includes: a physical tool unit including a physical tool configured to treat the surface of the substrate; a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate; a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate; and a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate. | 05-20-2010 |
| 20100117540 | METHOD OF DETECTING AN ARC IN A GLOW-DISCHARGE DEVICE AND APPARATUS FOR CONTROLLING A HIGH-FREQUENCY ARC DISCHARGE - In a method of detecting arc discharge in a glow-discharge apparatus GD that has a high-frequency power source PS, a cutting pulse is output for time T | 05-13-2010 |
| 20100066998 | SURFACE INSPECTION APPARATUS - [Problem] To provide a surface inspection apparatus able to suitably inspect the outer circumference edge part of a semiconductor wafer or other plate-shaped member. | 03-18-2010 |
| 20100048035 | ROBOT APPARATUS AND PROCESSING APPARATUS PROVIDED THEREWITH, ASHING SYSTEM, AND ASHING METHOD - A robot apparatus according to the invention is configured to hand over a workpiece by rotating by a prescribed angle a finger including a holding means for holding the workpiece. The robot apparatus includes: a drive shaft including a first finger and a second finger spaced from each other. The first finger includes a first arm portion and a second arm portion extending from its rotation center with a prescribed angle therebetween so as to be distanced from each other. The second finger includes a third arm portion and a fourth arm portion extending from its rotation center with a prescribed angle therebetween so as to be distanced from each other. The second arm portion and the fourth arm portion are distanced from each other when the first arm portion and the third arm portion overlap in the axial direction of the drive shaft. The robot apparatus can further improve productivity without incurring size increase and high cost. | 02-25-2010 |
| 20090194409 | MAGNETRON SPUTTERING MAGNET ASSEMBLY, MAGNETRON SPUTTERING DEVICE, AND MAGNETRON SPUTTERING METHOD - A magnetron sputtering magnet assembly of the invention is a magnetron sputtering magnet assembly movable in a direction generally parallel to a sputtered surface of a target while facing the target, the magnetron sputtering magnet assembly comprises an inner magnet extending in a direction generally perpendicular to the direction of the movement, the N pole or S pole of the inner magnet being opposed to the target; an outer magnet surrounding the inner magnet with a spacing from the inner magnet, the magnetic pole of the outer magnet opposed to the target being opposite to that of the inner magnet; and a nonmagnetic member provided between the inner magnet and the outer magnet and holding the inner magnet and the outer magnet. The magnetic pole opposed to the target in each of the inner magnet and the outer magnet is invertible. The nonuniformity of electron density at the end of the target can be reduced, and the plasma density therein can be made uniform. Thus, the sputtering rate at the target end can be made uniform, and the nonuniformity of film formation distribution on the object under film formation can be reduced. Furthermore, the nonuniformity of target erosion can also be decreased to improve target utilization efficiency. | 08-06-2009 |
| 20090177415 | Surface Roughness Inspection System - [Problem] To provide a surface roughness inspection system enabling suitable inspection even when the surface of the object being inspected is curved. | 07-09-2009 |
| 20090134022 | METHOD AND APPARATUS FOR PRODUCING PHOTOCATALYST - A method of producing a photocatalyst according to the invention comprises forming an amorphous titanium oxide and heat-treating it in an atmosphere containing oxygen, whereby a photocatalyst having a good photocatalysis can be obtained. In particular, the amorphous titanium oxide is obtained by using the reactive sputtering method and via deposition at a low temperature and at a high film formation rate. This apparatus can be provided with cooling means to allow enhancement of the throughput of the film formation process. | 05-28-2009 |
| 20090078582 | APPARATUS FOR ELECTROLYZING SULFURIC ACID, METHOD OF PERFORMING ELECTROLYSIS, AND APPARATUS FOR PROCESSING A SUBSTRATE - An apparatus for electrolyzing sulfuric acid, the apparatus comprising an electrolytic cell comprising a cathode chamber having a cathode and an anode chamber having an anode, the cathode chamber and the anode chamber being separated by a diaphragm, a sulfuric acid tank configured to store the sulfuric acid, a supply pipe connecting the sulfuric acid tank to an inlet port of the anode chamber, a connection pipe connecting an outlet port of the cathode chamber to the inlet port of the anode chamber, a first supply pump provided on the supply pipe and configured to supply the sulfuric acid from the sulfuric acid tank to the cathode chamber through the supply pipe, and a drain pipe connected to an outlet port of the anode chamber and configured to supply to a solution tank a solution containing an oxidizing agent generated by electrolysis in the anode chamber. | 03-26-2009 |
| 20090071511 | SUBSTRATE TREATMENT APPARATUS - A substrate treatment apparatus, which treats a substrate with a treatment liquid that is ultrasonically vibrated, includes an oscillator body which is rectangular-parallelepiped and has a treatment liquid supply path having an opening on a lower surface thereof in a first end portion in a longitudinal direction thereof and inclining to a second end portion in the longitudinal direction thereof, a vibrator which is provided on an upper surface of the oscillator body and ultrasonically vibrates the oscillator, and a heat exchanger which cools the treatment liquid supplied to the treatment liquid supply path. | 03-19-2009 |
| 20090066933 | SURFACE INSPECTION APPARATUS AND SURFACE INSPECTION METHOD FOR STRAINED SILICON WAFER - An image pickup device disposed in a predetermined position relative to a surface of a strained silicon wafer photographs the surface of the strained silicon wafer in a plurality of rotation angle positions on photographing conditions under which bright lines appearing on the surface of the strained silicon wafer can be photographed, in an environment where a light source device illuminates the surface of the strained silicon wafer which is rotating. A composite image in a predetermined angle position is generated from surface images of the strained silicon wafer in a plurality of rotation angle positions obtained by the image pickup device. | 03-12-2009 |
| 20090050274 | ADHESIVE TAPE ADHERING APPARATUS - An apparatus comprises a pressurizing tool including a plurality of pressurizing surfaces and rotatably mounted on a base member, a supply reel which supplies a release tape to which adhesive tape adheres along pressurizing surfaces of a periphery of the pressurizing tool, a cutter which is disposed to face one of the pressurizing surfaces of the pressurizing tool and cuts only the adhesive tape adhering to the release tape into a predetermined length, and a backup tool which is disposed to face a pressurizing surface located downstream from the pressurizing surface facing the cutter and supports a lower surface of the side portion of the substrate when the base member is driven downward in the vertical direction and adheres the adhesive tape cut into the predetermined length to the upper surface of the side portion of the substrate by the pressurizing surface. | 02-26-2009 |
| 20090045749 | PLASMA GENERATING APPARATUS AND PLASMA TREATMENT APPARATUS - A plasma generating apparatus according to the invention includes coaxial conversion means for coaxial-converting a microwave, a generally annular ring slot for passing the coaxial-converted microwave, and a dielectric window for propagating the microwave passed through the ring slot, wherein a plasma can be produced by the microwave propagated through the dielectric window. This enables stable formation of a plasma having a uniform distribution over a large area. | 02-19-2009 |
| 20080251376 | Vacuum Processing Device and Method of Manufacturing Optical Disk - To provide a vacuum treatment device capable of reducing the occurrence of the tilt and deformation of treated materials by suppressing the heating of a substrate by continuous spattering in a vacuum. This vacuum treatment device is characterized by comprising a main chamber capable of being vacuated in a vacuum state, a load lock mechanism carrying disk-like treated materials into and out of the main chamber while holding the vacuum state of the main chamber, a horizontal rotary carrying table disposed in the main chamber, having a plurality of susceptors exchanging the disk-like treated materials with the load lock mechanism for mounting, rotated about a rotating shaft, and forming a carrying route for the disk-like treated materials, a plurality of film-forming chambers for forming a multi-layer film on the disk-like treated materials disposed in the main chamber along a circumference about the rotating shaft and carried by the rotary carrying table, and cooling mechanism disposed between the film-forming chambers and cooling the disk-like treated materials. | 10-16-2008 |
| 20080196743 | CLEANING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - A cleaning method includes: producing an oxidizing solution by electrolysis of sulfuric acid; and cleaning a workpiece with the oxidizing solution. The oxidizing solution is heated by heat of mixing to clean the workpiece. A method for manufacturing an electronic device includes: producing a workpiece; producing an oxidizing solution by electrolysis of sulfuric acid; and cleaning the workpiece with the oxidizing solution. The oxidizing solution is heated by heat of mixing to clean the workpiece. | 08-21-2008 |
