Shenzhen JT Automation Equipment Co., Ltd. Patent applications |
Patent application number | Title | Published |
20140217894 | LINEAR PLASMA SOURCE - Embodiments of the present application disclose a linear plasma source applied to the field of solar cell production. A linear plasma source comprising a housing which forms a reaction chamber having an outlet; a gas intake system comprising an internal pipeline which is mounted on the housing and located inside the reaction chamber for releasing reaction gas into the reaction chamber; an electrode system comprising at least two electrode plates which are mounted on the housing and located around the internal pipeline within the reaction chamber; and an electromagnetism system comprising an electromagnetic coil, and the electromagnetic coil is mounted at the outlet of the reaction chamber of the housing and has a plasma outlet. The embodiments of the present application have a simple structure, a low production cost, a good uniformity and a high film compactness. | 08-07-2014 |
20140202385 | FLAT-PLATE TYPE PECVD DEVICE - The present application discloses a flat-plate type PECVD device including a vacuum chamber for accommodating a work piece and a plasma emitter provided above the vacuum chamber. The plasma emitter includes an emitting box fixed to the vacuum chamber, and a radio frequency impedance matching device provided above the emitting box. A dielectric window is connected to a bottom portion of the emitting box, and an antenna body connected to the radio frequency impedance matching device is fixedly provided above the emitting box. The antenna body includes an antenna placed in the emitting box, and a connecting terminal for connecting the antenna and the radio frequency impedance matching device. A radio frequency power supply is externally connected to the radio frequency impedance matching device. A process gas intake pipe is fixedly provided on the vacuum chamber, and a mounting groove corresponding to the emitting box is provided above the vacuum chamber. | 07-24-2014 |