| S.E.S. CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100092661 | ELECTROLESS PLATING METHOD - This invention provides an electroless plating method comprising electrolessly plating the surface of a metal base sample using a supercritical fluid or a subcritical fluid in such a state that a metal powder is dispersed in an electroless plating liquid. According to this method, a homogeneous and thick plating layer is formed in a short time by taking advantage of an induction eutectoid phenomenon. In the electroless plating method, the metal powder may have an average particle diameter of not less than 1 nm and not more than 100 &mgr;m, and the electroless plating method may also be applied to a damascene process or a dual damascene process which is a method for forming a fine metal wiring within a semiconductor element. The above constitution can provide an electroless plating method which can realize the formation of an even film by electroless plating in a short time using a subcritical fluid or a supercritical fluid by taking advantage of an induction eutectoid phenomenon. | 04-15-2010 |
| 20100000872 | ELECTROPLATING METHOD - The surface of a metal base is electroplated by utilizing an induction codeposition phenomenon using at least one of carbon dioxide and inert gas, an electroplating liquid containing a metal powder dispersed therein, and a surfactant in a supercritical state or a subcritical state. The concentration of the metal in the electroplating liquid is in a saturated or supersaturated state. Accordingly, the dissolution speed of the metal base can be suppressed, and, at the same time, a plating layer having a smooth surface can be formed in a short time by utilizing an induction codeposition phenomenon. The electroplating method can be applied even when the metal base is formed of a metallic thin film provided on a surface of an insulating film provided on the substrate, or even when the metal is copper, zinc, iron, nickel, or cobalt. The above constitution can provide an electroplating method which, in electroplating on the surface of a metal base, can prevent the dissolution of the metal base to realize normal electroplating even in the case of a very thin metal base. | 01-07-2010 |
| 20090165534 | METHOD AND APPARATUS FOR TESTING LEAKAGE OF PIPE PASSAGE - A method for testing leakage of a pipe passage employs a flow rate of gas used in testing supplied to the inside of a pipe passage undergoing testing hermetically sealed on one side while detecting flow rate with a flow measuring device and pressure with a pressure detector, and detecting temperature of the gas used, and inputting the detected values of pressure, flow rate and temperature into a computation treatment apparatus, and internal capacity V | 07-02-2009 |
