| SEOUL SEMICONDUCTOR CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120134133 | LED ILLUMINATION APPARATUS - An LED illumination apparatus realizes wide light distribution by increasing the angular range of radiation, and achieves uniform intensity of light through the arrangement of the position of a plurality of light sources. The LED illumination apparatus includes a substrate, a first light source disposed on a peripheral area of the substrate, a second light source disposed on an inner area of the substrate, and a reflector disposed between the first light source and the second light source, wherein the reflector is configured to reflect light that is generated by the first light source. | 05-31-2012 |
| 20120132939 | LIGHT EMITTING DEVICE EMPLOYING NON-STOICHIOMETRIC TETRAGONAL ALKALINE EARTH SILICATE PHOSPHORS - Disclosed is a light emitting device employing non-stoichiometric tetragonal Alkaline Earth Silicate phosphors. The light emitting device comprises a light emitting diode emitting light of ultraviolet or visible light, and non-stoichiometric luminescent material disposed around the light emitting diode. The luminescent material adsorbs at least a portion of the light emitted from the light emitting diode and emits light having a different wavelength from the absorbed light. The non-stoichiometric luminescent material has tetragonal crystal structure, and contains more silicon in the crystal lattice than that in the crystal lattice of silicate phosphors having stoichiometric crystal structure. The luminescent material is represented as the formula (Ba | 05-31-2012 |
| 20120126174 | NON STOICHIOMETRIC TETRAGONAL COPPER ALKALINE EARTH SILICATE PHOSPHORS AND METHOD OF PREPARING THE SAME - Disclosed are non stoichiometric Copper Alkaline Earth Silicate phosphors activated by divalent europium for using them as high temperature stable luminescent materials for ultraviolet or daylight excitation. The phosphors are represented as the formula (Ba | 05-24-2012 |
| 20120098448 | LIGHT EMITTING DIODE DRIVING DEVICE - An exemplary embodiment of the present invention discloses a light emitting diode (LED) driving device for an LED device having a plurality of LEDs, the driving device including a rectifying unit configured to receive an alternating current (AC) voltage and output a rectified voltage, and a driving control unit configured to drive the plurality of LEDs based on stored data by receiving the rectified voltage at a first period. | 04-26-2012 |
| 20120098019 | LIGHT EMITTING DIODE PACKAGE HAVING HEAT DISSIPATING SLUGS - A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads. | 04-26-2012 |
| 20120097996 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 04-26-2012 |
| 20120086338 | ILLUMINATION SYSTEM AND METHOD FOR CONTROLLING THE SAME - An illumination system includes a power supply unit; and a light emitting apparatus driven by power supplied from the power supply unit. The light emitting apparatus includes: a first light emitting portion and a second light emitting portion configured to be independently driven to emit output light; and a controller configured to control a color temperature or a luminous flux of the output light by controlling operations of the first and second light emitting portions. The controller is configured to control an output color temperature of the output light according to color temperature control data for controlling an output color temperature of the second light emitting portion or control a luminous flux of the output light according to luminous flux control data for controlling an output luminous flux of the first light emitting portion. | 04-12-2012 |
| 20120074849 | ILLUMINATION SYSTEM - An illumination system according to an exemplary embodiment of the present invention includes at least one light emitting apparatus including at least one light emitting module detachably coupled to the at least one light emitting apparatus, the at least one light emitting module including an information storage unit to store characteristic information of the at least one light emitting module. The at least one light emitting apparatus also includes a controller configured to detect whether the at least one light emitting module is connected to or disconnected from the at least one light emitting apparatus, and to read out the characteristic information of the at least one light emitting module according to a detection result, wherein the characteristic information includes unique identification information or absolute lifetime information of the at least one light emitting module. | 03-29-2012 |
| 20120074446 | PHOSPHOR SHEET, LIGHT-EMITTING DEVICE HAVING THE PHOSPHOR SHEET AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a light emitting device including: a substrate; a light emitting diode (LED) chip disposed on the substrate; and a phosphor sheet disposed on an upper portion of the LED chip and including alignment members formed on a lower surface thereof. The alignment members contact the LED chip, such that the phosphor sheet is aligned with the LED chip. | 03-29-2012 |
| 20120074441 | WAFER-LEVEL LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack. | 03-29-2012 |
| 20120061717 | HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME - The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package. | 03-15-2012 |
| 20120056217 | LIGHT EMITTING DIODE PACKAGE - Disclosed herein is a light emitting diode package including a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 03-08-2012 |
| 20120056215 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 03-08-2012 |
| 20120037933 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME - The present invention provides a light emitting device comprising a first light emitting portion that emits white light at a color temperature of 6000K or more and a second light emitting portion that emits white light at a color temperature of 3000K or less, which include light emitting diode chips and phosphors and are independently driven. The present invention has an advantage in that a light emitting device can be diversely applied in a desired atmosphere and use by realizing white light with different light spectrums and color temperatures. Particularly, the present invention has the effect on health by adjusting the wavelength of light or the color temperature according to the circadian rhythm of humans. | 02-16-2012 |
| 20120037850 | SURFACE-MODIFIED SILICATE LUMINOPHORES - A surface-modified silicate luminophore includes a silicate luminophore and a coating includes at least one of (a) a fluorinated coating including a fluorinated inorganic agent, a fluorinated organic agent, or a combination of fluorinated inorganic and organic agents, the fluorinated coating generating hydrophobic surface sites and (b) a combination of the fluorinated coating and at least one moisture barrier layer. The moisture barrier layer includes MgO, Al | 02-16-2012 |
| 20120014115 | ASPHERICAL LED LENS AND LIGHT EMITTING DEVICE INCLUDING THE SAME - Exemplary embodiments of the present invention relate to an aspherical light emitting diode (LED) lens and a light emitting device including the same. The aspherical LED lens includes a light exit plane concavely depressed near a central axis, a light entrance plane including a conical plane having a vertex located on the central axis, and a plurality of protrusions arranged on a portion of a side surface of the light exit plane. The aspherical LED lens has a radially symmetrical structure with respect to the central axis. | 01-19-2012 |
| 20120007502 | WHITE LIGHT EMITTING DIODE PACKAGE FOR INCANDESCENT COLOR - The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard. | 01-12-2012 |
| 20120001205 | LIGHT EMITTING DEVICE HAVING STRONTIUM OXYORTHOSILICATE TYPE PHOSPHORS - Exemplary embodiments of the present invention relate to light emitting devices including strontium oxyorthosilicate-type phosphors. The light emitting device includes a light emitting diode, which emits light in the UV or visible range, and phosphors disposed around the light emitting diode to absorb light emitted from the light emitting diode and emit light having a different wavelength from the absorbed light. The phosphors include an oxyorthosilicate phosphor having a general formula of Sr | 01-05-2012 |
| 20110297972 | LIGHT EMITTING DEVICE HAVING PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - A light emitting device having a plurality of light emitting cells is disclosed. The light emitting device comprises a substrate; a plurality of light emitting cells positioned on the substrate to be spaced apart from one another, each of the light emitting cells comprising a p-type lower semiconductor layer, an active layer and an n-type upper semiconductor layer; p-electrodes positioned to be spaced apart from one another between the substrate and the light emitting cells, the respective p-electrodes being electrically connected to the corresponding lower semiconductor layers, each of the p-electrodes having an extension extending toward adjacent one of the light emitting cells; n-electrodes disposed on upper surfaces of the respective light emitting cells, wherein a contact surface of each of the n-electrodes electrically contacting with each light emitting cell exists both sides of any straight line that bisects the light emitting cell across the center of the upper surface of the light emitting cell; a side insulating layer for covering sides of the light emitting cells; and wires for connecting the p-electrodes and the n-electrodes, the wires being spaced apart from the sides of the light emitting cells by the side insulating layer. | 12-08-2011 |
| 20110285295 | ARTIFICIAL SOLAR LIGHT SYSTEM USING A LIGHT EMITTING DIODE - The present invention relates to an artificial solar light system, and more particularly, to an artificial solar light system using light emitting diodes. The present invention can provide an artificial solar light system using light emitting diodes, which can represent the same light emission effects as the sun with time. Further, the present invention can provide an artificial solar light system using light emitting diodes, which is inexpensive and is not affected by positions or climate. | 11-24-2011 |
| 20110284900 | LIGHT EMITTING DIODE PACKAGE - Exemplary embodiments of the present invention provide light emitting diode (LED) packages which include a housing configured to surround uplift portions formed on lead frames electrically connected to an LED chip. The LED package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip, the first lead frame and the second lead frame respectively including a first uplift portion and a second uplift portion on regions thereof facing each other, and a housing supporting the first lead frame and the second lead frame, a first side of the housing exposed to the outside. The first lead frame and the second lead frame each include a first side parallel to the first side of the housing and a second side opposite to the first side. | 11-24-2011 |
| 20110284884 | LIGHT EMITTING DIODE CHIP FOR HIGH VOLTAGE OPERATION AND LIGHT EMITTING DIODE PACKAGE INCLUDING THE SAME - A light emitting diode (LED) chip for high voltage operation and an LED package including the same arc disclosed. The LED chip includes a substrate, a first array formed on the substrate and including n light emitting cells connected in series, and a second array formed on the substrate and including m (m≦n) light emitting cells connected in series. During operation of the LED chip, the first array and the second array are operated by being connected in reverse parallel to each other. Further, when a driving voltage of the first array is delined as Vd1 and a driving voltage of the second array is defined as Vd2, a difference between Vd1 and Vd2×(n/m) is not more than 2V. | 11-24-2011 |
| 20110284822 | LIGHT EMITTING DIODE CHIP HAVING WAVELENGTH CONVERTING LAYER AND METHOD OF FABRICATING THE SAME, AND PACKAGE HAVING THE LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME - An exemplary embodiment of the present invention discloses an LED chip including a substrate, a GaN-based compound semiconductor stacked structure arranged on the substrate, an electrode electrically connected to the semiconductor stacked structure, and a wavelength converting layer covering a portion of the semiconductor stacked structure. The electrode passes through the wavelength converting layer. The semiconductor stacked structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. | 11-24-2011 |
| 20110279047 | AC LIGHT EMITTING DEVICE, DRIVING DEVICE THEREOF, AND DRIVING METHOD THEREBY - An AC light emitting device, a driving device thereof and a driving method are disclosed. The driving device includes a sub-driving part turned on corresponding to each of positive and negative voltage regions of an AC voltage source to provide current paths for operating at least two LEDs, and a free-charge part charging with a voltage to be supplied to one of the at least two LEDs which is not operated while the other LED is operated by the sub-driving part. The AC light emitting device, the driving device thereof and the driving method thereby can solve problems, such as a decrease in power factor, severe total harmonic distortion, excessive flickering, and the like, due to operating characteristics of the AC light emitting device by application of an AC voltage source thereto. | 11-17-2011 |
| 20110278636 | LIGHT EMITTING ELEMENT - A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect. | 11-17-2011 |
| 20110266555 | METHOD OF GROWING SEMICONDUCTOR HETEROSTRUCTURES BASED ON GALLIUM NITRIDE - The method of growing non-polar epitaxial heterostructures for light-emitting diodes producing white emission and lasers, on the basis of compounds and alloys in AlGaInN system, comprising the step of vapor-phase deposition of one or multiple heterostructures layers described by the formula Al | 11-03-2011 |
| 20110254793 | PANEL OPERATING APPARATUS - Disclosed is a panel operating apparatus. The panel operating apparatus changes a state of a display device electrically connected to a circuit board located below a panel. The panel operating apparatus includes a tact member mounted on the circuit board, and a resilient member electrically connected to a circuit pattern of the circuit board and separated from the panel and the circuit board. The resilient member is selectively brought into contact with the panel or the tact member depending on a degree of pressure applied to the panel, thereby allowing the apparatus to be operated in a tact manner when the apparatus cannot be operated in a touch manner due to individual features of operators or external conditions. | 10-20-2011 |
| 20110254045 | LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE SYSTEM HAVING AT LEAST TWO HEAT SINKS - There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package. | 10-20-2011 |
| 20110248296 | LIGHT EMTTING DEVICE - Disclosed herein is a light emitting device. The light emitting device includes a light emitting diode disposed on a substrate to emit light of a first wavelength. A transparent molding part encloses the LED, a lower wavelength conversion material layer is disposed on the transparent molding part, and an upper wavelength conversion material layer is disposed on the lower wavelength conversion material layer. The lower wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a second wavelength longer than the first wavelength, and the upper wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a third wavelength, which is longer than the first wavelength but shorter than the second wavelength. Light produced via wavelength conversion is prevented from being lost by the phosphor. Light emitting devices including a multilayer reflection minor are also disclosed. | 10-13-2011 |
| 20110241054 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 10-06-2011 |
| 20110235341 | METHOD OF MANUFACTURING A LIGHT EMITTING UNIT AND LIGHT EMITTING DEVICE MANUFACTURED USING THE METHOD - The present invention relates to a method of manufacturing a light emitting unit including mounting at least one light emitting element on a printed circuit board (PCB), connecting at least one terminal to the PCB, the at least one terminal to provide power to the at least one light emitting element, and molding a housing to enclose a light emitting part including the PCB and the at least one terminal. | 09-29-2011 |
| 20110227123 | Light Emitting Diode and Method of Fabricating the Same - The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip. | 09-22-2011 |
| 20110210366 | LIGHT EMITTING DEVICE - Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip. | 09-01-2011 |
| 20110204291 | LUMINESCENT MATERIAL - A luminescent material is disclosed. The luminescent material may include a first compound having a host lattice comprising first ions and oxygen. A first portion of the first ions may be substituted by copper ions. In one embodiment, the host lattice may include silicon, the copper ions may be divalent copper ions and the first compound may have an Olivine crystal structure, β-K | 08-25-2011 |
| 20110193111 | MULTI-LIGHT EMITTING DIODE PACKAGE - A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. | 08-11-2011 |
| 20110181196 | DIMMER FOR A LIGHT EMITTING DEVICE - Exemplary embodiments of the present invention relate to a dimmer for a light emitting device using an alternating (AC) voltage source. The dimmer includes a switch to be switched in response to a switching control signal and to deliver an AC voltage of an AC voltage source to the light emitting device, a current detector to detect an electric current to be provided to the light emitting device and to output a current detection signal, and a controller to output the switching control signal in response to a dimming control signal and the current detection signal. | 07-28-2011 |
| 20110180840 | LED PACKAGE - The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion. | 07-28-2011 |
| 20110175128 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 07-21-2011 |
| 20110147662 | STRONTIUM OXYORTHOSILICATE PHOSPHORS HAVING IMPROVED STABILITY UNDER A RADIATION LOAD AND RESISTANCE TO ATMOSPHERIC HUMIDITY - Exemplary embodiments of the present invention relate to inorganic phosphors based on silicate compounds having improved stability under a resulting radiation load and resistance to atmospheric humidity, which are capable of converting higher-energy excitation radiation, i.e. ultraviolet (UV) or blue light, with high efficiency into a longer-wavelength radiation which may be in the visible spectral range. A calcium molar fraction x having a value between 0 and 0.05 is added to a silicate phosphor having the general formula Sr | 06-23-2011 |
| 20110140135 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 06-16-2011 |
| 20110133244 | LIGHT EMITTING ELEMENT - A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect. | 06-09-2011 |
| 20110101275 | LUMINESCENT MATERIAL - This invention relates to luminescent materials for ultraviolet light or visible light excitation containing lead and/or copper doped chemical compounds. The luminescent material is composed of one or more than one compounds of aluminate type, silicate type, antimonate type, germanate/or germanate-silicate type, and/or phosphate type. Accordingly, the present invention is a good possibility to substitute earth alkaline ions by lead and copper for a shifting of the emission bands to longer or shorter wave length, respectively. Luminescent compounds containing copper and/or lead with improved luminescent properties and also with improved stability against water, humidity as well as other polar solvents are provided. The present invention is to provide lead and/or copper doped luminescent compounds, which has high color temperature range about 2,000K to 8,000K or 10,000K and CRI over 90. | 05-05-2011 |
| 20110073879 | LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 03-31-2011 |
| 20110050090 | LIGHT EMITTING DEVICE EMPLOYING LUMINESCENT SUBSTANCES WITH OXYORTHOSILICATE LUMINOPHORES - A light emitting device having oxyorthosilicate luminophores is disclosed. The light emitting device includes a light emitting diode and luminescent substances disposed around the light emitting diode, to adsorb at least a portion of light emitted from the light emitting diode and emitting light having different wavelength from that of the absorbed light. The luminescent substances have Eu | 03-03-2011 |
| 20110042704 | METHOD OF COATING SULFIDE PHOSPHOR AND LIGHT EMITTING DEVICE EMPLOYING COATED SULFIDE PHOSPHOR - A method of coating phosphor powder with a composite oxide, and a light emitting device that employs the phosphor powder coated with the composite oxide are disclosed. The method includes mixing a silicon oxide precursor and a precursor of another oxide in water and alcohol to form a primary coating layer on a sulfide phosphor through a sol-gel reaction, heat treating the primary coating layer to form a composite oxide layer of the silicon oxide and the other oxide from the primary coating layer. The method improves moisture stability of the sulfide phosphor compared to a sulfide phosphor coated with a single silicon oxide film. | 02-24-2011 |
| 20110026242 | BACKLIGHT PANEL EMPLOYING WHITE LIGHT EMITTING DIODE HAVING RED PHOSPHOR AND GREEN PHOSPHOR - Disclosed is a backlight panel employing a white light emitting diode. The white light emitting diode includes a blue light emitting diode chip and red and green phosphors positioned over the blue light emitting diode chip. Accordingly, since the backlighting can be performed using white light with distinct red, green and blue wavelengths, the color reproducibility can be enhanced. Further, since the white light can be implemented with a single light emitting diode, the manufacturing costs and thickness of the backlight panel can also be reduced. | 02-03-2011 |
| 20110012507 | PHOSPHOR, METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE - A phosphor is formed with a glass coating layer on a surface of a phosphor grain to have improved moisture and/or thermal stability. A method for manufacturing the phosphor comprises preparing phosphor gains excitable by light, and forming a glass coating layer on a surface of each phosphor grain. The glass coating layer may be formed by mixing the phosphor grains with a glass composition; heat-treating a mixture of the phosphor grains and the glass composition to make the glass composition melt and surround the phosphor grains; and cooling and breaking the heat-treated mixture to provide phosphors, each comprising the phosphor grain having the glass coating layer formed on a surface of the phosphor grain. | 01-20-2011 |
| 20110001091 | PHOSPHOR, METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE - A phosphor is formed with a glass coating layer on a surface of a phosphor grain to have improved moisture and/or thermal stability. A method for manufacturing the phosphor comprises preparing phosphor gains excitable by light, and forming a glass coating layer on a surface of each phosphor grain. The glass coating layer may be formed by mixing the phosphor grains with a glass composition; heat-treating a mixture of the phosphor grains and the glass composition to make the glass composition melt and surround the phosphor grains; and cooling and breaking the heat-treated mixture to provide phosphors, each comprising the phosphor grain having the glass coating layer formed on a surface of the phosphor grain. | 01-06-2011 |
| 20100330714 | MOLD FOR FORMING A MOLDING MEMBER AND METHOD OF FABRICATING A MOLDER MEMBER USING THE SAME - There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member. | 12-30-2010 |
| 20100328961 | LIGHT-EMITTING MODULE - A light-emitting module includes a printed circuit board (PCB), a fastening member, and a light-emitting package. The PCB has a power-supplying pad to provide electrical power. The fastening member is disposed on the PCB and has a package-receiving hole exposing the power-supplying pad. The light-emitting package is received by the package-receiving hole such that the light-emitting package is electrically connected to the power-supplying pad and detachably coupled with the fastening member. Therefore, the light-emitting package may be easily combined with the PCB, and the light-emitting package may be replaced when desired. | 12-30-2010 |
| 20100327229 | LUMINESCENT SUBSTANCES HAVING Eu2+-DOPED SILICATE LUMINOPHORES - Exemplary embodiments of the present invention disclose inorganic luminescent substances with Eu | 12-30-2010 |
| 20100315835 | LEAD FRAME, LIGHT EMITTING DIODE HAVING THE LEAD FRAME, AND BACKLIGHT UNIT HAVING THE LIGHT EMITTING DIODE - An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal. | 12-16-2010 |
| 20100308364 | SIDE-VIEW LIGHT EMITTING DIODE PACKAGE HAVING A REFLECTOR - Disclosed herein is a side-view light emitting diode package with a reflector. The side-view light emitting diode package of the present invention comprises first and second lead terminals spaced apart from each other. The package body supports the first and second lead terminals and has an elongated opening through which a light emitting diode chip mounting region and the first and second lead terminals are exposed. Reflectors are formed between the chip mounting region and sidewalls positioned in a major axis direction of the opening. Each of the reflectors has a height lower than that of the sidewall of the opening. Accordingly, light emitted from a light emitting diode chip can be reflected using the reflectors, thereby improving light emitting efficiency of the side-view light emitting diode package. | 12-09-2010 |
| 20100301376 | SIDE VIEW TYPE LED PACKAGE - In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body. | 12-02-2010 |
| 20100301371 | LIGHT EMITTING DEVICE - A light emitting device can be characterized as including a light emitting diode configured to emit light and a phosphor configured to change a wavelength of the light. The phosphor substantially covers at least a portion of the light emitting diode. The phosphor includes a compound having a host material. Divalent copper ions and oxygen are components of the host material. | 12-02-2010 |
| 20100270571 | SLIM LED PACKAGE - Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames. | 10-28-2010 |
| 20100265693 | TUBE-TYPE OR CHANNEL-TYPE LED LIGHTING APPARATUS - A light emitting diode (LED) lighting apparatus that may be used as interior lighting or advertisement lighting is disclosed. The LED lighting apparatus includes a channel-type or tube-type optical housing with a light emission surface and an LED array arranged in the optical housing. The light emission surface includes a valley line and a first inner ridge and a second inner ridge disposed on opposing sides of the valley line, and the LED array includes a plurality of LEDs whose centers are arranged along the valley line. | 10-21-2010 |
| 20100264448 | LIGHT EMTTING DEVICE - Disclosed herein is a light emitting device. The light emitting device includes a light emitting diode disposed on a substrate to emit light of a first wavelength. A transparent molding part encloses the LED, a lower wavelength conversion material layer is disposed on the transparent molding part, and an upper wavelength conversion material layer is disposed on the lower wavelength conversion material layer. The lower wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a second wavelength longer than the first wavelength, and the upper wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a third wavelength, which is longer than the first wavelength but shorter than the second wavelength. Light produced via wavelength conversion is prevented from being lost by the phosphor. Light emitting devices including a multilayer reflection mirror are also disclosed. | 10-21-2010 |
| 20100244727 | LIGHT-EMITTING DIODE DRIVER - A light-emitting diode (LED) driver used to power at least one LED with an alternating current (AC) voltage source is provided. The LED driver includes a rectifying unit applying N-fold higher voltage than the voltage from the AC voltage source to the LED. The rectifying unit includes a first charging unit to charge a first voltage, and a second charging unit to charge a second voltage. The first voltage includes the voltage at the AC voltage source during a first half-cycle of one AC voltage cycle, and the second voltage includes the first voltage and the voltage at the AC voltage source during the second half-cycle of the AC voltage cycle. Accordingly, the LED driver may improve light-emitting efficiency and reduce flicker of LEDs. | 09-30-2010 |
| 20100237800 | LIGHT EMITTING DEVICE AND DRIVING CIRCUIT THEREOF - A light emitting device comprises a first light emitting unit and a second light emitting unit connected in series with each other, and a PTF unit connected in parallel with the first light emitting unit and in series with the second light emitting unit. Each of the first light emitting unit and second light emitting unit comprises at least one LED. The PTF unit allows the second light emitting unit to be operated before operation of the first light emitting unit upon application of an AC voltage source. The light emitting device reduces total harmonic distortion and flickering, and improves power factor and optical efficiency. A driving circuit of the light emitting device is also disclosed. | 09-23-2010 |
| 20100224904 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 09-09-2010 |
| 20100220485 | SIDE ILLUMINATION LENS AND LUMINESCENT DEVICE USING THE SAME - The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens. | 09-02-2010 |
| 20100219428 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generate a base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light and the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 09-02-2010 |
| 20100207132 | LIGHT EMITTING DEVICE EMPLOYING NON-STOICHIOMETRIC TETRAGONAL ALKALINE EARTH SILICATE PHOSPHORS - Disclosed is a light emitting device employing non-stoichiometric tetragonal Alkaline Earth Silicate phosphors. The light emitting device comprises a light emitting diode emitting light of ultraviolet or visible light, and non-stoichiometric luminescent material disposed around the light emitting diode. The luminescent material adsorbs at least a portion of the light emitted from the light emitting diode and emits light having a different wavelength from the absorbed light. The non-stoichiometric luminescent material has tetragonal crystal structure, and contains more silicon in the crystal lattice than that in the crystal lattice of silicate phosphors having stoichiometric crystal structure. The luminescent material is represented as the formula (Ba | 08-19-2010 |
| 20100202131 | LED PACKAGE AND BACK LIGHT UNIT USING THE SAME - Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant. | 08-12-2010 |
| 20100177534 | BACKLIGHT PANEL EMPLOYING WHITE LIGHT EMITTING DIODE HAVING RED PHOSPHOR AND GREEN PHOSPHOR - Disclosed is a backlight panel employing a white light emitting diode. The white light emitting diode includes a blue light emitting diode chip and red and green phosphors positioned over the blue light emitting diode chip. Accordingly, since the backlighting can be performed using white light with distinct red, green and blue wavelengths, the color reproducibility can be enhanced. Further, since the white light can be implemented with a single light emitting diode, the manufacturing costs and thickness of the backlight panel can also be reduced. | 07-15-2010 |
| 20100176342 | LUMINESCENT MATERIAL - This invention relates to luminescent materials for ultraviolet light or visible light excitation containing lead and/or copper doped chemical compounds. The luminescent material is composed of one or more than one compounds of aluminate type, silicate type, antimonate type, germanate/or germanate-silicate type, and/or phosphate type. Accordingly, the present invention is a good possibility to substitute earth alkaline ions by lead and copper for a shifting of the emission bands to longer or shorter wave length, respectively. Luminescent compounds containing copper and/or lead with improved luminescent properties and also with improved stability against water, humidity as well as other polar solvents are provided. The present invention is to provide lead and/or copper doped luminescent compounds, which has high color temperature range about 2,000K to 8,000K or 10,000K and CRI over 90. | 07-15-2010 |
| 20100165645 | LIGHT EMITTING DEVICE - A light emitting device is disclosed. The light emitting device may include a light emitting diode (LED) for emitting light and phosphor adjacent to the LED. The phosphor may be excitable by light emitted by the LED and may include a first compound having a host lattice comprising first ions and oxygen. In one embodiment, the host lattice may include silicon, the copper ions may be divalent copper ions and first compound may have an Olivin crystal structure, a β-K2SO4 crystal structure, a trigonal Glaserite (K | 07-01-2010 |
| 20100163918 | LED PACKAGE - The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion. | 07-01-2010 |
| 20100159620 | MANUFACTURING METHOD OF LIGHT EMITTING DIODE - Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners. | 06-24-2010 |
| 20100151604 | LIGHT EMITTING DIODE HAVING PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME - The present invention discloses a light emitting diode. The light emitting diode includes a plurality of light emitting cells arranged on a substrate, each light emitting cell including a first semiconductor layer and a second semiconductor layer arranged on the first semiconductor layer; a first dielectric layer arranged on each light emitting cell and including a first opening to expose the first semiconductor layer and a second opening to expose the second semiconductor layer; a wire arranged on the first dielectric layer to couple two of the light emitting cells; and a second dielectric layer arranged on the first dielectric layer and the wire. The first dielectric layer and the second dielectric layer comprise the same material and the first dielectric layer is thicker than the second dielectric layer. | 06-17-2010 |
| 20100133565 | LEAD FRAME, LIGHT EMITTING DIODE HAVING THE LEAD FRAME, AND BACKLIGHT UNIT HAVING THE LIGHT EMITTING DIODE - An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal. | 06-03-2010 |
| 20100133561 | LIGHT EMITTING APPARATUS - The present invention provides a light emitting apparatus comprising a three-color light emitting device unit including at least three light emitting diode (LED) chips for respectively emitting red, green and blue light; a white light emitting device unit including at least one blue LED chip with a fluorescent substance formed thereon; and a substrate provided with a first electrode connected in common to ends of the LED chips and second electrodes formed to correspond respectively to the LED chips. Further, the present invention provides a light emitting apparatus comprising a plurality of LED chips; a substrate provided with a first electrode connected in common to ends of the plurality of LED chips and second electrodes formed to correspond respectively to the plurality of LED chips; an upper package formed on the substrate to surround the plurality of LED chips and to have a partition crossing the first electrode at the center of the upper package; and a molding member that encapsulates the plurality of LED chips and is divided by the partition of the upper package. | 06-03-2010 |
| 20100123156 | LIGHT EMITTING DEVICE - Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip. | 05-20-2010 |
| 20100102329 | LIGHT-EMITTING DEVICE HAVING LIGHT-EMITTING ELEMENTS WITH A SHARED ELECTRODE - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-29-2010 |
| 20100096653 | LIGHT EMITTING DIODE PACKAGE - A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved. | 04-22-2010 |
| 20100091504 | HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME - The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug. | 04-15-2010 |
| 20100079703 | BACKLIGHT UNIT AND DISPLAY APPARATUS HAVING THE SAME - An exemplary embodiment of the present invention discloses a backlight unit with a plurality of light-emitting blocks and a light source driving section. The plurality of light-emitting blocks are arranged in a matrix shape along first and second directions different from each other. Each of the light-emitting blocks includes a light source unit having at least one light-emitting chip to emit light, and a light guiding unit to guide the light. The light source driving section controls the light source unit of the light-emitting blocks to drive the light source unit. Therefore, a thickness of the backlight unit may be reduced. | 04-01-2010 |
| 20100078996 | LIGHTING APPARATUS - A lighting apparatus comprises a power unit, a fan unit, a charging unit, a light source unit and a control unit. The power unit receives power from an external power source. The fan unit is rotated using the power supplied from the power unit. The charging unit stores power generated from rotation of the fan unit. The light source unit generates light. The light source unit employs an LED as a light source. The control unit connects the light source unit to the charging unit when power level of the charging unit is greater than a specified level, and the control unit connects the light source unit to the power unit when the power level of the charging unit is lower than the specified level. Therefore, power consumed by the lighting apparatus is reduced and vibration resistance of the lighting apparatus is improved. | 04-01-2010 |
| 20100078669 | LIGHT EMITTING DEVICE AND LEAD FRAME FOR THE SAME - An LED according to the present invention includes a light-emitting chip emitting light, a chip-mounting portion on which the light-emitting chip is mounted, a light-reflecting layer formed on at least a portion of the chip-mounting portion and a gold plating layer formed on at least a portion of the light-reflecting layer, the gold plating layer having a thickness such that the gold plating layer has a different color from a color of gold. The chip-mounting portion may have various shapes and materials. For example, the chip-mounting portion may be a lead terminal, a slug, a printed circuit board, a ceramic substrate, a CNT substrate, etc. | 04-01-2010 |
| 20100072499 | LED PACKAGE - The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed. | 03-25-2010 |
| 20100065876 | LED PACKAGE WITH METAL PCB - The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns. | 03-18-2010 |
| 20100060181 | AC LED DIMMER AND DIMMING METHOD THEREBY - The disclosure relates to an AC LED dimmer and dimming method thereof. The AC LED dimmer includes a rectifier receiving AC voltage from an AC voltage source and full-wave rectifying the AC voltage; a direct current (DC)/DC converter receiving the full-wave rectified voltage from the rectifier, generating a full-wave rectified stepped-up voltage, and generating a pulse enable signal; a pulse width modulation controller receiving the full-wave rectified stepped-up voltage and generating a pulse width modulation signal to dim an AC LED in response to the pulse enable signal; a switch driving the AC LED under control of the pulse width modulation signal, and an electromagnetic interference (EMI) filter to be connected between the AC voltage source and the switch to eliminate electromagnetic interference from the AC voltage source. Accordingly, the dimmer can perform an efficient and linear dimming function and suppress harmonics. | 03-11-2010 |
| 20100025700 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generatea base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 02-04-2010 |
| 20100020531 | BACK LIGHTING UNIT HAVING PHOSPHOR FILM STRUCTURE - A back lighting unit is disclosed in which lower and upper surfaces of a light transmitting plate function as incident and exit surfaces of light, respectively, and a phosphor film structure for wavelength-converting the light is provided at a position which the light is incident on or exits from. The disclosed back lighting unit includes a light emitting means including a light emitting diode disposed to emit light upwards; a light transmitting plate disposed over the light emitting diode, the light transmitting plate having a lower surface allowing light to be incident thereon and an upper surface allowing light to exit therefrom; and a phosphor film structure including a particulate phosphor and formed on at least one of the lower and upper surfaces of the light transmitting plate. | 01-28-2010 |
| 20100002454 | LIGHT EMITTING DEVICE - A light emitting device is disclosed. The light emitting device may include a light emitting diode (LED) for emitting light and phosphor adjacent to the LED. The phosphor may be excitable by light emitted by the LED and may include a first compound having a host lattice comprising first ions and oxygen. In one embodiment, the host lattice may include silicon, the copper ions may be divalent copper ions and first compound may have an Olivin crystal structure, a β-K2SO4 crystal structure, a trigonal Glaserite (K | 01-07-2010 |
| 20090323354 | ELECTRONIC DEVICE AND FILM FOR THE SAME - An electronic device that includes a light-emitting board and a light characteristics enhancing member. The light-emitting board includes a driving substrate, a semiconductor device disposed on a first surface of the driving substrate, and a signal-receiving member receiving an external wireless control signal to control the semiconductor device. The light characteristics enhancing member includes a base film disposed over the light-emitting board, and a light characteristics enhancing layer formed on a lower surface of the base film, the lower surface facing the light-emitting board. A second refractive index of the light characteristics enhancing layer is greater than a first refractive index of the base film. Therefore, the receive sensitivity of the external wireless control signal is improved. | 12-31-2009 |
| 20090323306 | CONVERSION TYPE LIGHT EMITTING DEVICE - A conversion type light emitting device includes at least one LED element having a predetermined light emitting range and a fluorescent element performing wavelength conversion of light emitted from the LED element when disposed at a first location in the predetermined light emitting range. The fluorescent element is movable from a first location to a second location outside the predetermined light emitting range. | 12-31-2009 |
| 20090322709 | ELECTRONIC DEVICE AND TOUCH SENSOR FILM - An electronic device includes a light-emitting board, a touch sensor film and a signal connection part. The light-emitting board includes a driving substrate, and a semiconductor device disposed on a surface of the driving substrate. The touch sensor film includes a film disposed over the light-emitting board, and a touch conductor pattern formed on the film to sense an external touch event for generating a touch signal to drive the semiconductor device. The signal connection part electrically connects the touch sensor film and the light-emitting board to each other to transmit the touch signal from the touch sensor film to the light-emitting board. | 12-31-2009 |
| 20090316383 | LIGHTING APPARATUS - A lighting apparatus includes a light reflector, a light emitting diode (LED) and a light-changing film. The light reflector has a concave surface. The LED is disposed under the concave surface of the light reflector to provide the concave surface with light. The light-changing film converts a first light generated by the LED into a second light. For example, the light-changing film may be a fluorescent film receiving the first light and emitting the second light with increased wavelength. The LED and the light-changing film are spaced apart from each other to minimize discoloration of the light-changing film. | 12-24-2009 |
| 20090315053 | LIGHT EMITTING DEVICE - The present invention provides a light emitting device, comprising a first light emitting diode for emitting light in an ultraviolet wavelength region; at least one phosphor arranged around the first light emitting diode and excited by the light emitted from the first light emitting diode to emit light having a peak wavelength longer than the wavelength of the light emitted from the first light emitting diode; and at least one second light emitting diode for emitting light having a wavelength different from the peak wavelength of the light emitted from the phosphor. According to the present invention, there is provided a white light emitting device, wherein using a light emitting diode for emitting light different in wavelength from light that is ex-cititively emitted from the phosphor, an excitation light source, i.e., light in the ultraviolet region for exciting the phosphor is effectively used, thereby improving energy conversion efficiency and improving reliability. | 12-24-2009 |
| 20090308639 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board that can be used for mounting a light emitting diode. The flexible printed circuit board includes a lower insulator, an upper insulator, and a conductive pattern disposed between the upper and lower insulators. A white film is attached to the top of the upper insulator. Alternatively, the upper insulator is formed of a white insulation material. The flexible printed circuit board has a planar surface and can be properly assembled to other components. | 12-17-2009 |
| 20090303694 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME - The present invention provides a light emitting device comprising a first light emitting portion that emits white light at a color temperature of 6000K or more and a second light emitting portion that emits white light at a color temperature of 3000K or less, which include light emitting diode chips and phosphors and are independently driven. The present invention has an advantage in that a light emitting device can be diversely applied in a desired atmosphere and use by realizing white light with different light spectrums and color temperatures. Particularly, the present invention has the effect on health by adjusting the wavelength of light or the color temperature according to the circadian rhythm of humans. | 12-10-2009 |
| 20090267089 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 10-29-2009 |
| 20090267085 | LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES - Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source. | 10-29-2009 |
| 20090251902 | LIGHT EMITTING DIODE - Disclosed is a light emitting diode (LED). The LED includes a light emitting chip, a reflector formed with an annular groove in an inner surface thereof and surrounding the light emitting chip, and a lens engaged with the groove of the reflector. An inner diameter of a lens insertion portion of the groove is smaller than an outer diameter of the lens, so that the lens can be engaged with the groove through elastic deformation. Since the separately manufactured lens is engaged with and coupled into the groove of the reflector, the lens can be fixed through a simple process and aligned without an error. Since the lens is engaged with the groove of the reflector, the lens is prevented from being easily separated. In addition, since there is no need for the use of an adhesive, it is possible to prevent degradation of the reliability of the LED. | 10-08-2009 |
| 20090251057 | ARTIFICIAL SOLAR LIGHT SYSTEM USING A LIGHT EMITTING DIODE - The present invention relates to an artificial solar light system, and more particularly, to an artificial solar light system using light emitting diodes. The present invention can provide an artificial solar light system using light emitting diodes, which can represent the same light emission effects as the sun with time. Further, the present invention can provide an artificial solar light system using light emitting diodes, which is inexpensive and is not affected by positions or climate. | 10-08-2009 |
| 20090243504 | BACKLIGHT UNIT - The present invention relates to a backlight unit that includes at least one first light emitting diode (LED) package and at least one second LED package, wherein the first LED package includes a blue LED chip, a green LED chip, and a first phosphor, the first phosphor being excited by blue light and to emit light to be mixed with blue light and green light respectively emitted from the blue LED chip and the green LED chip, the first LED package to thereby emit white light; the second LED package includes a blue LED chip, a red LED chip, and a second phosphor, the second phosphor being excited by blue light and to emit light to be mixed with blue light and red light respectively emitted from the blue LED chip and the red LED chip, the second LED package to thereby emit white light; and the first LED package and the second LED package are alternately arranged. | 10-01-2009 |
| 20090243458 | LIGHT EMITTING DIODE PACKAGE FOR PROJECTION SYSTEM - A light emitting diode (LED) package for a projection system is provided, which includes a package body having an inner space formed therein and having an open upper portion; and an LED chip mounted onto a bottom of the package body, wherein the package body includes a socket coupling portion formed around the upper portion of the package body to have a certain corresponding thickness and height allowing the socket coupling portion to be inserted into the socket of the optical engine. | 10-01-2009 |
| 20090243457 | WHITE LIGHT EMITTING DIODE PACKAGE FOR INCANDESCENT COLOR - The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard. | 10-01-2009 |
| 20090242921 | METHOD FOR COATING PHOSPHOR, APPARATUS TO PERFORM THE METHOD, AND LIGHT EMITTING DIODE COMPRISING PHOSPHOR COATING LAYER - A method of forming a phosphor coating layer on a light emitting diode (LED) chip using electrophoresis includes separating phosphor particles in a suspension according to a particle size, and coating the phosphor particles on a surface of the LED chip by sequentially depositing the separated phosphor particles on the surface of the LED chip according to the particle size. An apparatus to form a phosphor coating layer on an LED chip includes an electrophoresis bath to accommodate a suspension containing phosphor particles separated into layers according to a particle size, and electrodes disposed inside the electrophoresis bath. The electrodes may include a cathode electrode on which the LED chip may be arranged, and an anode electrode. | 10-01-2009 |
| 20090242920 | SIDE VIEW LED PACKAGE AND BACK LIGHT MODULE COMPRISING THE SAME - Disclosed is a side view LED package that can be more accurately mounted onto a surface of a substrate such as a printed circuit board without distortion includes a first portion of a body allowing light to be emitted in front thereof, the first portion having a horizontal plane formed on a top or bottom side thereof; and a second portion of the body positioned backward with respect to a back end boundary line of the first portion, the second portion being formed with an inclined plane that is adjacent to the horizontal plane and has height decreased from the back end boundary line, wherein the inclined plane is partially formed with an added thickness portion that is flush with the horizontal plane. | 10-01-2009 |
| 20090237935 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 09-24-2009 |
| 20090230419 | LIGHT EMITTING DEVICE - The present invention provides a light emitting device which comprises a blue light emitting diode, and at least an orthosilicate based phosphor for emitting light ranging from a green to yellow regions and a nitride or oxynitride based phosphor for emitting light in a red region over the light emitting diode. Accordingly, since white light with a continuous spectrum ranging from green to red can be implemented, a light emitting device with improved color rendering can be provided, and the light emitting device can be used for a general illumination or a flash. Further, since the phosphors having stable chemical characteristics against their external environment such as moisture are employed, the stability in optical characteristics of the light emitting device can also be improved. | 09-17-2009 |
| 20090218586 | LED LAMP - The present invention relates to a light emitting diode (LED) lamp, and an object of the present invention is to provide an LED lamp in which an LED can be easily exchanged and external vibration can be absorbed to prevent the play thereof. To this end, an LED lamp according to the present invention comprises an LED package having a lead frame; a printed circuit board separated from the LED package and having a conductive pattern formed on a surface thereof facing the lead frame; and a pressing means for pressing the LED package toward the PCB so that the lead frame is in contact with the conductive pattern. | 09-03-2009 |
| 20090200567 | CHIP-TYPE LED PACKAGE AND LIGHT EMITTING APPARATUS HAVING THE SAME - Disclosed are a chip-type LED package and a light emitting apparatus having the same. The chip-type LED package includes a thermally conductive substrate with lead electrodes formed thereon. An LED chip is mounted on the thermally conductive substrate, and a lower molding portion covers the LED chip. In addition, an upper molding portion having hardness higher than that of the lower molding portion covers the lower molding portion. The upper molding portion is formed by performing transfer molding using resin powder. Accordingly, since the lower molding portion can be formed of a resin having hardness smaller than that of the upper molding portion, it is possible to provide a chip-type LED package in which device failure due to thermal deformation of the molding portion can be prevented. | 08-13-2009 |
| 20090200566 | SIDE-VIEW LIGHT EMITTING DIODE PACKAGE HAVING A REFLECTOR - Disclosed herein is a side-view light emitting diode package with a reflector. The side-view light emitting diode package of the present invention comprises first and second lead terminals spaced apart from each other. The package body supports the first and second lead terminals and has an elongated opening through which a light emitting diode chip mounting region and the first and second lead terminals are exposed. Reflectors are formed between the chip mounting region and sidewalls positioned in a major axis direction of the opening. Each of the reflectors has a height lower than that of the sidewall of the opening. Accordingly, light emitted from a light emitting diode chip can be reflected using the reflectors, thereby improving light emitting efficiency of the side-view light emitting diode package. | 08-13-2009 |
| 20090180273 | LIGHT EMITTING DEVICE AND LCD BACKLIGHT USING THE SAME - The present invention provides a light emitting device which comprises blue and red light emitting diode (LED) chips and at least one phosphor for emitting green light by means of light emitted from the blue LED chip, and an LCD backlight including the light emitting device. According to the light emitting device of the present invention, uniform white light can be implemented and both high luminance and wider color reproduction range can also be obtained. Accordingly, an LCD backlight for uniform light distribution on an LCD as well as low power consumption and high durability can be manufactured using the light emitting device. | 07-16-2009 |
| 20090179219 | SIDE VIEW TYPE LED PACKAGE - In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body. | 07-16-2009 |
| 20090152496 | COPPER-ALKALINE-EARTH-SILICATE MIXED CRYSTAL PHOSPHORS - This invention relates to luminescent materials for ultraviolet light or visible light excitation comprising copper-alkaline-earth dominated inorganic mixed crystals activated by rare earth elements. The luminescent material is composed of one or more than one compounds of silicate type and/or germinate or germanate-silicate type. Accordingly, the present invention is a very good possibility to substitute earth alkaline ions by copper for a shifting of the emission bands to longer or shorter wavelength, respectively. Luminescent compounds containing Copper with improved luminescent properties and also with improved stability against water, humidity as well as other polar solvents are provided. The present invention is to provide copper containing luminescent compounds, which has high correlated color temperature range from about 2,000K to 8,000K or 10,000K and CRI up to over 90. | 06-18-2009 |
| 20090146169 | METHOD OF FABRICATING LIGHT EMITTING DIODE PACKAGE WITH SURFACE TREATED RESIN ENCAPSULANT AND THE PACKAGE FABRICATED BY THE METHOD - Disclosed are a method of fabricating a light emitting diode package with a surface treated resin encapsulant and a package fabricated by the method. According to the method of fabricating a light emitting diode package, a resin encapsulant encapsulating a light emitting diode chip is surface treated using plasma. Thus, a bonding force between the surface treated resin encapsulant and a resin molding member covering it is increased. | 06-11-2009 |
| 20090134413 | LIGHT EMITTING DEVICE - The present invention relates to a light emitting device comprising at least one light emitting diode which emits light in a predetermined wavelength region, copper-alkaline earth metal based inorganic mixed crystals activated by rare earths, which include copper-alkaline earth silicate phosphors which are disposed around the light emitting diode and absorb a portion of the light emitted from the light emitting diode and to emit light different in wavelength from the absorbed light. | 05-28-2009 |
| 20090108275 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090108274 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090108273 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090108272 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 04-30-2009 |
| 20090102354 | RED PHOSPHOR, METHOD FOR MANUFACTURING THE SAME AND LIGHT EMITTING DIODE FOR USING THE SAME - The present invention provides a red phosphor, a method for manufacturing the red phosphor and a light emitting device using the red phosphor, in which the red phosphor is expressed as a chemical formula of (Ca,Sr) | 04-23-2009 |
| 20090097225 | THIOGALLATE PHOSPHOR AND WHITE LIGHT EMITTING DEVICE EMPLOYING THE SAME - The present invention relates to a thiogallate phosphor which is excited by ultraviolet or blue light to emit light with a relatively longer wavelength than that of the ultraviolet or blue light. The phosphor is expressed as a general formula of (A | 04-16-2009 |
| 20090096350 | FLUORESCENT MATERIAL AND LIGHT EMITTING DIODE USING THE SAME - The present invention relates to a thiogallate phosphor expressed as AB | 04-16-2009 |
| 20090065799 | LIGHT EMITTING DIODE PACKAGE - The present invention relates to a light emitting diode package, and provides a light emitting diode package employing a thermoelectric element therein. The light emitting diode package of the present invention is constructed such that the thermoelectric element is coupled to a housing or formed of a substrate itself so as to directly dissipate heat generated from a light emitting chip. Thus, the heat generated from the light emitting chip can be efficiently dissipated from the interior of the package to the outside, without an additional heat dissipation means. In addition, an external heat sink may be coupled to the thermoelectric element to more efficiently dissipate the heat from the light emitting chip. | 03-12-2009 |
| 20090057704 | LIGHT EMITTING DIODE PACKAGE HAVING HEAT DISSIPATING SLUGS - A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads. | 03-05-2009 |
| 20090050849 | NON STOICHIOMETRIC TETRAGONAL COPPER ALKALINE EARTH SILICATE PHOSPHORS AND METHOD OF PREPARING THE SAME - Disclosed are non stoichiometric Copper Alkaline Earth Silicate phosphors activated by divalent europium for using them as high temperature stable luminescent materials for ultraviolet or daylight excitation. The phosphors are represented as the formula (Ba | 02-26-2009 |
| 20090045430 | LIGHT EMITTING ELEMENT - A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect. | 02-19-2009 |
| 20090021186 | LIGHT EMITTING APPARATUS - The present invention provides a light emitting apparatus comprising: a first light emitting portion for emitting white light with a color temperature of 5700K or more; and a second light emitting portion capable of changing the color temperature of the white light emitted from the first light emitting portion, wherein the first and second light emitting portions are independently driven. Accordingly, the present invention has the advantage that it can be diversely applied to desired atmospheres and uses by implementing white light with various light emitting intensities and color temperatures. Further, there is an advantage in that the cumbersomeness in a process is reduced, the space efficiency is enhanced, and the costs are reduced. | 01-22-2009 |
| 20090004778 | Manufacturing Method of Light Emitting Diode - Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners. | 01-01-2009 |
| 20090003015 | Light Guide Device and Back Lighting Module Comprising the Same - A light guide device is used in a back light module that more uniformly mixes different colored light emitted from a plurality of LEDs and transfers the mixed light to a display panel, wherein a light loss can be minimized during the light mixing process and the light can be more uniformly mixed. A light guide device is disclosed for mixing different colored light emitted from a plurality of light emitting diodes (LEDs) and guiding the mixed light to a display panel, wherein the light guide device comprises a light guide portion in the form of a plate arranged at a rear of the display panel; and a light mixing portion formed integrally with the light guide portion and including a light incidence surface adjacent to the plurality of LEDs and a light mixing area for mixing the light with difference colors incident through the light incidence surface. | 01-01-2009 |
| 20090001393 | MULTI-LIGHT EMITTING DIODE PACKAGE - A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. | 01-01-2009 |
| 20080303052 | LIGHT EMITTING DIODE PACKAGE HAVING MULTIPLE MOLDING RESINS - Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented. | 12-11-2008 |
| 20080278947 | Luminous Element For Backlight Unit - The present invention relates to a luminous element, and more particularly, to a luminous element for a backlight unit with a plurality of luminous chips mounted on a substrate. The present invention provides a luminous element for a backlight unit, in which luminous chips are arranged on a substrate so that the manufacturing process and cost can be reduced and the size of a substrate is minimized when manufacturing the luminous element, thereby minimizing the size of a backlight unit. Further, the present invention provides a luminous element for a backlight unit, in which luminance uniformity can be increased by optimizing the viewing angle of the luminous element. | 11-13-2008 |
| 20080268559 | Mold for Forming a Molding Member and Method of Fabricating a Molding Member Using the Same - There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member. | 10-30-2008 |
| 20080246040 | LIGHT EMITTING DEVICE HAVING LIGHT EMITTING ELEMENTS - A light-emitting device operating on a high drive voltage and a small drive current. LEDs ( | 10-09-2008 |
| 20080241590 | METHOD OF COATING SULFIDE PHOSPHOR AND LIGHT EMITTING DEVICE EMPLOYING COATED SULFIDE PHOSPHOR - A method of coating phosphor powder with a composite oxide, and a light emitting device that employs the phosphor powder coated with the composite oxide are disclosed. The method includes mixing a silicon oxide precursor and a precursor of another oxide in water and alcohol to form a primary coating layer on a sulfide phosphor through a sol-gel reaction, heat treating the primary coating layer to form a composite oxide layer of the silicon oxide and the other oxide from the primary coating layer. The method improves moisture stability of the sulfide phosphor compared to a sulfide phosphor coated with a single silicon oxide film. | 10-02-2008 |
| 20080237625 | LIGHT EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE - Disclosed is a light emitting diode lamp that has low resistance to heat emitted therefrom. The LED lamp may include a heat coupling member thermally coupling a top part of a first lead to a top part of a second lead. The LED lamp may further include one or more top parts for lowering thermal resistance of the LED lamp. This configuration facilitates heat transfer from the first lead having an LED chip mounted thereon to the top part of the second lead and/or to the other top parts, lowering resistance to heat emitted from the LED lamp. | 10-02-2008 |
| 20080237624 | LED PACKAGE WITH METAL PCB - The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. | 10-02-2008 |
| 20080231214 | LIGHT EMITTING DEVICE HAVING VARIOUS COLOR TEMPERATURE - A light emitting device capable of emitting light having various color temperatures is disclosed. The light emitting device includes a first light emitting part emitting a daylight color having a color temperature of 6000 K or more, a second light emitting part emitting white light having a color temperature less than 6000 K, and a third light emitting part emitting light in a visible range of 580 nm or more. The second and third light emitting parts are operable independently of the first light emitting part, and realize a warm white color having a color temperature of 3000 K or less with the white light emitted from the second light emitting part and the light emitted from the third light emitting part. The light emitting device realizes white light of various spectra and color temperatures corresponding to desired mood and utility. The light emitting device is controlled to emit light having a suitable wavelength or a suitable color temperature depending on the circadian rhythm of human, thereby enabling improvement of the user's health. | 09-25-2008 |
| 20080224163 | LIGHT EMITTING DEVICE - A light emitting device can be characterized as including a light emitting diode configured to emit light and a phosphor configured to change a wavelength of the light. The phosphor substantially covers at least a portion of the light emitting diode. The phosphor includes a compound having a host material. Divalent copper ions and oxygen are components of the host material. | 09-18-2008 |
| 20080217637 | Light Emitting Diode and Method of Fabricating the Same - The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip. | 09-11-2008 |
| 20080217628 | LIGHT EMITTING DEVICE - The present invention relates to a light emitting device having a light emitting diode package with a plurality of light emitting cells and an integrated electronic element formed on the same substrate. The light emitting device comprises a substrate, a light emitting cell block having a first array with a plurality of light emitting cells formed on one region of the substrate arranged therein, a second array formed on the same region as the first array, and electrodes for AC power connecting the first and second arrays in reverse parallel; and at least one integrated electronic element formed on another region of the same substrate as the light emitting cell block. | 09-11-2008 |
| 20080211386 | LIGHT EMITTING DEVICE - Disclosed herein is a light emitting device. The light emitting device includes a light emitting diode disposed on a substrate to emit light of a first wavelength. A transparent molding part encloses the LED, a lower wavelength conversion material layer is disposed on the transparent molding part, and an upper wavelength conversion material layer is disposed on the lower wavelength conversion material layer. The lower wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a second wavelength longer than the first wavelength, and the upper wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a third wavelength, which is longer than the first wavelength but shorter than the second wavelength. Light produced via wavelength conversion is prevented from being lost by the phosphor. Light emitting devices including a multilayer reflection mirror are also disclosed. | 09-04-2008 |
