| SEMTECH CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20120115279 | CHIP-SCALE SEMICONDUCTOR DIE PACKAGING METHOD - A method of packaging one or more semiconductor dies is provided. The method includes: providing a first die having a circuit surface and a connecting surface; providing a chip-scale frame having an inside surface and an outside surface, the chip-scale frame having a well region having an opening in the inside surface; coupling the first die to a wall of the well region using a first coupling mechanism for electrical and mechanical coupling; providing a substrate having a top surface and a bottom surface; coupling the inside surface of the chip-scale frame with the top surface of the substrate by a second coupling mechanism, wherein a gap is provided between the circuit surface of the first die and the top surface of the substrate; coupling a heat sink to the outside surface of the chip-scale frame using a third coupling mechanism. | 05-10-2012 |
| 20110241125 | Power Semiconductor Device with Low Parasitic Metal and Package Resistance - A power semiconductor device includes a semiconductor die with a power transistor on a semiconductor substrate, a plurality of wiring layers vertically spaced apart from one another and the transistor, and a plurality of conductive bumps on each wire of the wiring layer spaced farthest from the substrate. Each wire of the layer closest to the substrate is electrically connected to a terminal of the transistor. The wires of the layer spaced farthest from the substrate extend in generally parallel lines and are electrically connected to a terminal of the transistor through each underlying layer. An additional metal layer having a thickness of at least 50 μm is connected to the die so that contact regions of the additional metal layer are electrically connected to the bumps of the die. | 10-06-2011 |
| 20090184687 | Method and Apparatus for Battery Charging Based on Battery Capacity and Charging Source Constraints - A battery charging circuit sets charging current according to either the capacity of the battery under charge or a constraint of the charging source, depending on the properties of the charging source. The battery charging circuit sets termination current, however, according to the capacity of the battery under charge, regardless of the properties of the charging source. For example, the termination current may be set as a fixed fraction of the recommended C rate of the battery even if the charging current supplied by the charging source is below this C rate. Always setting the termination current in proportion to the battery's capacity permits detection of the current at which charging should terminate even when the charging current is constrained by the charging source and no longer depends on the battery's capacity. | 07-23-2009 |
| 20090066308 | Switched Mode Power Supply Having Variable Minimum Switching Frequency - In a switched mode power supply (SMPS) that regulates an output voltage in response to load conditions by switching an inductor circuit between a supply voltage and ground at a switching frequency, under light loading conditions, the switching frequency of the SMPS is reduced down to a variable minimum switching frequency sufficiently high to avoid audible noise generation. | 03-12-2009 |
| 20090016085 | Method and Apparatus for a Charge Pump DC-to-DC Converter Having Parallel Operating Modes - According to one or more aspects of DC-to-DC voltage conversion as taught herein, a DC-to-DC converter selectively operates in a first mode wherein an included linear pass output circuit supplies the output power from the DC-to-DC converter, in a second mode wherein an included charge pump output circuit supplies the output power, and in a third mode wherein the linear pass and charge pump output circuits operate in parallel to supply the output power. With this third mode, also referred to as a “dual” mode, wherein the linear pass and charge pump output circuits operate in parallel, the DC-to-DC converter keeps the more efficient output circuit on after it has begun switching to operation with the less efficient output circuit. Such switchover may be performed dynamically in response to changing operating conditions. Detected operating conditions may include input voltages, output voltages, and output load conditions. | 01-15-2009 |
