| SEMIKRON Elektronik GmbH & Co. KG Patent applications |
| Patent application number | Title | Published |
|---|
| 20120092895 | Circuit and Method for Potential-Isolated Energy Transfer with Two Output DC Voltages - A circuit for potential-isolated power transfer from a primary side to a secondary side with two secondary-side output DC voltages, wherein the absolute value of the first output DC voltage is higher than the absolute value of the second output DC voltage. The circuit comprises a transformer, which has first and second windings with a common center tap on the primary side and a third winding on the secondary side. The ratio of the number of turns of the first and second windings is a function of the ratio of the two secondary-side output DC voltages. The center tap is connected to a DC voltage source, the first winding is connected to a first transistor and the second winding is connected to a second transistor. The transistors are connected to the primary-side reference potential. The output voltages are present at two diodes connected to the secondary-side third winding. | 04-19-2012 |
| 20120007223 | Power Semiconductor Element With Two-Stage Impurity Concentration Profile - A power semiconductor component having a pn junction, a body with a first basic conductivity, a well-like region with a second conductivity which is arranged horizontally centrally in the body, has a first two-level doping profile and has a first penetration depth from the first main surface into the body. In addition, this power semiconductor component has an edge structure which is arranged between the well-like region and the edge of the power semiconductor component and which comprises a plurality of field rings with a single-level doping profile, a second conductivity and a second penetration depth, wherein the first penetration depth is no more than about 50% of the second penetration depth. | 01-12-2012 |
| 20110304389 | Drive Circuit With a Transmission Circuit for Capacitively Transmitting a Signal and Associated Method - A drive circuit with a circuit for transmitting a signal from a primary side having a first ground to a secondary side having a second ground. The transformer has capacitive coupling between the primary and secondary sides. The transformer has an ON transmission branch and an OFF transmission branch, which each have a first partial branch and a second partial branch. Capacitive coupling between the primary and secondary sides is effected in each partial branch by high-voltage capacitors. In the inventive method, in each transmission branch, the signal generates a current flow through a first HV capacitor of a first partial branch and an inverse current flow through a second HV capacitor of a second partial branch. This respective current flow is detected on the secondary side and is supplied to an evaluation circuit common to the two partial branches and reconstructs the primary-side input signal on the secondary side. | 12-15-2011 |
| 20110304210 | Switching Configuration and Procedure for the Production of One Alternating Voltage from a Majority of Unrelated Supply Terminals with Temporally Variable Output DC Voltage - A circuit, having a plurality of regulated, parallel, voltage sources, an a.c.-d.c. converter circuit and a regulating unit, and a method for controlling it. The regulated voltage sources include an unregulated voltage source of a temporally variable output d.c. voltage, a step-up converter and an associated regulating device, where the step-up converter is a three-point step-up converter. The regulating unit measures the intermediate circuit voltage of the a.c.-d.c. converter circuit and is connected with the regulating devices. In the method for control, the regulating unit determines the voltage in the intermediate circuit of the a.c.-d.c. converter circuit and from this determines, as a function of the maximally and minimally permissible intermediate circuit voltage, a set-point value for the output voltage of the regulated voltage sources. This set-point value is transmitted to the regulating devices, from which the regulating devices determine the control conditions for the step-up converter. | 12-15-2011 |
| 20110235377 | Circuit and Method for Generating an AC Voltage from a Plurality of Voltage Sources Having a Temporally Variable DC Output Voltage - A circuit comprising at least one parallel-connected partial circuit for feeding at least one inverter circuit. A partial circuit consists of an unregulated voltage source having a temporally varying DC output voltage, a voltage doubling circuit and a voltage regulating circuit with an associated regulating device. In the inventive method, the voltage doubling circuit doubles the voltage of the unregulated voltage source. The regulation of the current/voltage characteristic curve, the MPP tracking, of the unregulated voltage source is effected by the regulating device of the voltage regulating circuit. | 09-29-2011 |
| 20110203967 | Arrangement Comprising at Least One Power Semiconductor Module and a Transport Packaging - An arrangement comprising: at least one power semiconductor module and a transport packaging. The power semiconductor module has a base element, a housing and connection elements. The transport packaging has a cover layer, an interlayer with a respective cutout assigned to the power semiconductor module, and a cover film. The cover layer is generally planar, and has a first main surface facing the power semiconductor module. The interlayer is arranged on the first main surface of the cover layer. The power semiconductor module is arranged in the cutout, on the first main surface of the cover layer, wherein the base element of the power semiconductor module is disposed on the first main surface of the cover layer. The cover film bears on and covers substantial parts of the housing of the power semiconductor module. The cover film is connected to the first main surface of the interlayer. | 08-25-2011 |
| 20110180918 | Arrangement Comprising at Least One Power Semiconductor Module and a Transport Packaging - An arrangement comprising at least one power semiconductor module and a transport packaging, wherein the power semiconductor module has a base element, a housing and connection elements and the transport packaging has a generally planar cover layer, a cover film and at least one trough-like plastic shaped body for each power semiconductor module. The at least one plastic shaped body only partly encloses the respective power semiconductor module and a part of the plastic shaped body does not directly contact the power semiconductor module. Furthermore, a first side of the at least one power semiconductor module becomes situated directly or indirectly on the first main surface of the cover layer, while the cover film covers the further sides of the power semiconductor module directly and/or indirectly, and bears at least partly against the plastic shaped body. | 07-28-2011 |
| 20110122669 | Modularly Constructed Power Converter Arrangement - A modularly constructed power converter arrangement has two end-side elements and at least one power converter module arranged therebetween. One end-side element has, a fan of an air cooling device, while the other end-side element has, aligned with the fan, cutouts acting as air passages. At least one end-side element has an electrical connection device. The at least one power converter module has, as part of the cooling device, a heat sink, through which air can flow from one end-side element to the other and on which is arranged at least one power semiconductor module connected to a control device and to a capacitor device. For this purpose, the at least one power converter module has a housing, which is open at the end sides and which can be connected in each case at the end sides to an end-side element or a further power converter module. | 05-26-2011 |
| 20110110021 | Modularly Constructed Converter Arrangement - A converter arrangement comprising a switchgear cabinet for a plurality of converter assemblies forming respective main modules and each consisting of submodules, formed as a switching module and a capacitor module. The switchgear cabinet has connection devices for electrical connection of the converter assemblies and also, for each converter assembly, a rail system for the mechanical arrangement thereof. The capacitor module has a DC voltage contact device for electrical connection to the assigned switching module, and also sliding elements. The switching module has a cooling device, power semiconductor modules and also dedicated sliding elements. The sliding elements of the submodules are arranged in a stacked manner in the same rails of the rail system of the switchgear cabinet. | 05-12-2011 |
| 20110103024 | Power Semiconductor Module - A power semiconductor module in which a substrate is provided with at least one power semiconductor and has first and second contact areas, wherein a first load connection element with first contact elements provided thereon is supported on the first contact areas and a second load connection element with second contact elements provided thereon is supported on the second contact areas. Wherein at least one spring element is provided for producing a pressure contact between the contact elements and the contact areas. To reduce the structural size of the module, the pressure contact between the contact elements and the contact areas is exerted by at least one electrical component arranged between the spring element and one of the load connection elements. | 05-05-2011 |
| 20110042831 | Layered Chip For Use In Soldering - A layer assemblage for a semiconductor chip having a chip body for producing a soldering connection for the chip. The assemblage is provided on a side of a chip body formed from a semiconducting material, wherein the layer assemblage is formed from a plurality of sequential metal layers which follow one above another and are produced by means of a physical coating method, and wherein a solderable soldering layer is provided between a noble metal layer situated at a surface of the layer assemblage and the chip body. In order to avoid an undesired penetration of a solder through the layer assemblage the soldering layer has at least one internal interface formed by an interruption of the coating method. | 02-24-2011 |
| 20110037442 | PERMANENT MAGNET GENERATOR CONTROL - A method of and a system for controlling a permanent magnet AC generator ( | 02-17-2011 |
| 20110001244 | Method for Producing a Power Semiconductor Module, and Power Semiconductor Module Comprising a Connection Device - A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module. | 01-06-2011 |
| 20100330766 | Method for Producing a Plurality of Integrated Semiconductor Components - A method for producing a plurality of integrated semiconductor components on a carrier, in which an active basic structure is introduced into the carrier in a continuous fashion at least across a portion of the boundaries of the semiconductor components to be created. The regions of the semiconductor components on the carrier are defined, and a covering layer is applied to the carrier in the region of each semiconductor component with the aid of a mask. The carrier is severed to form the individual semiconductor components at the boundaries thereof. | 12-30-2010 |
| 20100264537 | Semiconductor Arrangement - A semiconductor arrangement, in particular a power semiconductor arrangement, in which a semiconductor having a top side provided with contacts is connected to an electrical connection device formed from a film assembly wherein an underfill is provided between the connection device and the top side of the semiconductor. The underfill has a matrix formed from a preceramic polymer. | 10-21-2010 |
| 20100258935 | Power Semiconductor Module Comprising A Connection Device With Internal Contact Spring Connection Elements - A power semiconductor module comprises at least one power semiconductor component and a connection device which makes contact with the power semiconductor component. The connection device is composed of a layer assembly having at least one first electrically conductive layer facing the power semiconductor component and forming at least one first conductor track, and an insulating layer following in the layer assembly, and a second layer following further in the layer assembly and forming at least one second conductor track, the second layer being remote from the power semiconductor component. The power semiconductor module has at least one internal connection element, wherein the internal connection element is embodied as a contact spring having a first and a second contact section and a resilient section. The first contact section has a common contact area with a first or a second conductor track of the connection device. | 10-14-2010 |
| 20100181963 | Battery Charger and Method for its Operation - A battery charger having an RF storage transformer whose primary winding is connected via a clock to a two-pole input for receiving an AC voltage, and whose secondary winding is connected as a flyback converter to a rectifier with a two-pole output for the battery. The charger has a measurement unit, which detects the input current and voltage and a controller which operates the clock as a function thereof. A method for operating the charger, wherein the controller continually switches the clock on for a first interval and switches it off for a second interval, wherein the first interval ends when the current rises to a value corresponding to the instantaneous value of the voltage times a scaling factor, and the duration of the first and second intervals is sufficiently long that their total duration corresponds to the period of one interval of permissible operating frequencies of the transformer. | 07-22-2010 |
| 20100130035 | Power Semiconductor Module with Prestressed Auxiliary Contact Spring - A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient section and a second contact device. The pressure member has two stop elements. The first contact device is electrically conductively connected to the contact surfaces of the substrate. The second contact device is arcuate in shape and has at least one deformation at the beginning and at the end of the arc, wherein, as a result of the deformations of the second contact device co-operating with the two stop elements of the pressure member, the connection element is prestressed. | 05-27-2010 |
| 20100127379 | Power Semiconductor Module with Control Functionality and Integrated Transformer - A power semiconductor module comprising: a substrate, a plurality of conductor tracks arranged thereon, the conductor tracks being electrically insulated from one another, and including power semiconductor components arranged thereon; a connecting device, composed of an alternating layer sequence of at least two electrically conductive layers and at least one electrically insulating layer disposed therebetween, for the circuit-conforming connection of the power semiconductor components, the conductor tracks and/or external contact devices. The electrically conductive layers form connecting tracks and at least one transformer is formed integrally with, and thus from the constituent parts of, the connecting device. The transformer is composed of at least one transmitter coil and at least one receiver coil, which are in each case arranged coaxially with respect to one another and are formed with spiral windings. | 05-27-2010 |
| 20100090328 | Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module - A power semiconductor module comprising a substrate, a circuit formed thereon and having a plurality of conductor tracks that are electrically insulated from one another and power semiconductor components arranged on the conductor tracks. The latter are connected in a circuit-conforming manner by a connection device, which has an alternating layer sequence of at least two electrically conductive layers with at least one electrically insulating layer between them. In this case, the substrate has a first sealing area, which uninterruptedly encloses the circuit. Furthermore, this sealing area is connected to an assigned second sealing area on a layer of the connection device by a connection layer. According to the invention, this power semiconductor module is produced by applying pressure to the substrate, to the power semiconductor components and to the connection device. | 04-15-2010 |
| 20100085106 | Method for Operating a Converter Circuit with Voltage Boosting - Method for operating a converter circuit with voltage boosting with N half-bridges, which in each case can be connected by their center connection to a phase of an N-phase generator and at an end side are connected in parallel with a series circuit formed by two capacitances, wherein each half-bridge contains a Top switch and a Bot switch, in which, in a PWM method with a fixed period duration at the beginning of the period duration, all the TOP switches are simultaneously switched on for the duration of a TOP switched-on interval. After half the period duration all the BOT switches are simultaneously switched on for the duration of a BOT switched-on interval wherein the TOP switched-on interval, and the BOT switched-on interval amount at most to half the duration of the period. | 04-08-2010 |
| 20100039774 | Power Semiconductor Module And Method For Its Production - A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing. | 02-18-2010 |
| 20100019754 | Power Converter for Solar Electrical Current Installations and Method for Controlling it - A power converter having a d.c. voltage input which varies over time and has a maximum voltage, a level converter and at least one inverter, which can be connected to an electrical network. The positive input of the d.c. voltage input is connected with a first switch and with the anode of a first diode. The negative input of the d.c. voltage input is connected with a second switch and with the cathode of a second diode. The cathode of the first diode is connected with a first capacitor, the anode of the second diode with a second capacitor. The two switches and the two capacitors are connected, and their center taps are likewise connected. This constitutes the level converter, which is connected with a downstream inverter. The two capacitors are thereby charged, independently of the input voltage, each at half the value of the set-point intermediate circuit voltage. | 01-28-2010 |
| 20100019578 | Power Converter for Solar Electrical Current Installations and Method for Controlling it - A power converter arrangement with a plurality of d.c voltage inputs of a chronologically varying input voltage, preferably from a solar cell arrangement, is described. In this case, every d.c. voltage input is connected with an associated converter cell, which in turn has at least one step-up converter connected with the input poles, and a recovery diode arranged between the two output poles. Furthermore, the output poles of the converter cells are connected in series and thus constitute the summed d.c. voltage output. The associated method regulates the pulse width of the step-up converter of each converter cell in such a way that the power output of the converter cell fluctuates around the actual theoretical maximum value. | 01-28-2010 |
| 20090284936 | Combination of a Main Carrier and a Printed Circuit Board with Components - A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board. | 11-19-2009 |
| 20080231321 | Drive circuit with a TOP level shifter for transmission of an input signal, and method for transmission - A TOP level switch for use in a drive circuit in power-electronic systems having a half-bridge circuit formed by two power switches, a first so-called TOP switch and a second so-called BOT switch, which are arranged connected in series. The TOP level shifter transmits an input signal from drive logic to a TOP driver. In this case, the TOP level shifter is designed as an arrangement of an UP and a DOWN level shifter path, as well as a downstream signal evaluation circuit. In the associated method for transmission of this input signal, the signal evaluation circuit passes an output signal to the TOP driver when either the UP or the DOWN, or both, level shifter paths emit a signal to the respectively associated input of the signal evaluation circuit. | 09-25-2008 |
