| SEMICS INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120074977 | WAFER PROBE STATION CAPABLE OF ACTIVELY CONTROLLING TILT OF CHUCK AND CONTROLLING METHOD THEREOF - The wafer probe station includes: a plurality of the pressure sensors; a tilt correction unit which is constructed with a plurality of actuators, a plurality of displacement sensors which are disposed at positions adjacent to the corresponding actuators and a microcomputer; and a control unit which allows the wafer to be come in contact with the probe card by lifting up a Z-axis stage by a predetermined overdriving amount, extracts the pressure values of the installation positions from the pressure sensors, calculates driving amounts of the actuators of the tilt correction unit by using the pressure values so that a uniform load is applied to the chuck, calculates X and Y directional displacement values w occurring according to a change in a tilt of the chuck, lifts down the Z-axis stage, and after that, corrects an eccentric load of the chuck by driving the actuators of the tilt correction unit according to the driving amounts, and controls movement of the XY-axis stage by using the X and Y directional displacement values w. Accordingly, it is possible to accurately sense an eccentric load occurring at the time of performing the overdriving, and it is possible to rapidly and accurately perform initial setting for the eccentric load by adjusting a tilt of the chuck, so that it is possible to reduce a read time of a testing process. | 03-29-2012 |
| 20100244877 | METHOD AND APPARATUS FOR CONTROLLING POSITION OF Z-AXIS FOR WAFER PROBER - The present invention relates to a method and apparatus for controlling the Z axis position of a wafer prober. The apparatus includes a first sensor unit ( | 09-30-2010 |
| 20100166291 | APPARATUS FOR MEASURING AND CALIBRATING ERROR OF WAFER PROBER - Provided is an error measurement and correction device of a stage of a wafer prober. The error measurement and correction device includes a jig member, a vision module, a central processing unit, and an interface unit. The jig member is disposed on a chuck on the stage, and the vision module is disposed on an upper plate of the wafer prober disposed at a position facing the jig member to enable the camera of the vision module to acquire images of the patterns of the jig member and transmits the acquired images to the central processing unit. The central processing unit acquires images of the patterns of the jig member disposed on the chuck by using the vision module to extract reference position information, moves the stage at a unit interval of the pattern, acquires images of the patterns of the jig member again to extract measured position information, and generates and stores mapping data by calculating difference between the measured position information and the reference position information. The central processing unit corrects the movement position information on the stage to be moved by using the mapping data when the stage is moved, so that irrespective of physical deterioration of the stage, the stage can be moved to an accurate position. | 07-01-2010 |
