| SEMICONDUCTOR ENERGY LABORATORY CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120129329 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - The present invention is provided in order to remove contamination due to contaminant impurities of the interfaces of each film which forms a TFT, which is the major factor that reduces the reliability of TFTs. By connecting a washing chamber and a film formation chamber, film formation can be carried out without exposing TFTs to the air during the time from washing step to the film formation step and it becomes possible to maintain the cleanliness of the interfaces of each film which form the TFT. | 05-24-2012 |
| 20120129318 | ATMOSPHERIC PRESSURE PLASMA ETCHING APPARATUS AND METHOD FOR MANUFACTURING SOI SUBSTRATE - The atmospheric pressure plasma etching apparatus is provided with a state detecting unit for detecting a state of the object to be processed, and the operation of the atmospheric pressure plasma etching apparatus is controlled in accordance with information detected by the state detecting unit. Thus, in the atmospheric pressure plasma etching apparatus, the object to be processed can be etched while the state of the object to be processed is detected. Accordingly, the object to be processed can be etched favorably. Further, an SOI substrate is manufactured using the atmospheric pressure plasma etching apparatus, whereby both reduction in manufacturing cost of the SOI substrate and suppression of peeling in the SOI substrate can be achieved. | 05-24-2012 |
| 20120129288 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME - A display device including a thin film transistor with high electric characteristics and high reliability, and a method for manufacturing the display device with high mass-productivity. In a display device including an inverted-staggered channel-stop-type thin film transistor, the inverted-staggered channel-stop-type thin film transistor includes a microcrystalline semiconductor film including a channel formation region, and an impurity region containing an impurity element of one conductivity type is selectively provided in a region which is not overlapped with source and drain electrodes, in the channel formation region of the microcrystalline semiconductor film. | 05-24-2012 |
| 20120129287 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one aspect of the present invention, a laminated structure of conductive transparent oxide layers containing silicon or silicon oxide is applied as an electrode on the side of injecting a hole (a hole injection electrode; an anode) instead of the conventional conductive transparent oxide layer such as ITO. In addition, according to another aspect of the invention, a laminated structure of conductive transparent oxide layers containing silicon or silicon oxide, each of which content is different, is applied as a hole injection electrode. Preferably, silicon or a silicon oxide, concentration of the conductive layer on the side where it is connected to a TFT ranges from 1 atomic % to 6 atomic % and a silicon or silicon oxide concentration on the side of a layer containing an organic compound ranges from 7 atomic % to 15 atomic %. | 05-24-2012 |
| 20120127781 | SEMICONDUCTOR MEMORY DEVICE - To increase a storage capacity of a memory module per unit area, and to provide a memory module with low power consumption, a transistor formed using an oxide semiconductor film, a silicon carbide film, a gallium nitride film, or the like, which is highly purified and has a wide band gap of 2.5 eV or higher is used for a DRAM, so that a retention period of potentials in a capacitor can be extended. Further, a memory cell has n capacitors with different capacitances and the n capacitors are each connected to a corresponding one of n data lines, so that a variety of the storage capacitances can be obtained and multilevel data can be stored. The capacitors may be stacked for reducing the area of the memory cell. | 05-24-2012 |
| 20120127384 | DRIVING METHOD OF STEREOSCOPIC IMAGE DISPLAY DEVICE - A display device capable of high-quality stereoscopic display without decreasing resolution is provided. A pixel portion including a plurality of pixels arranged in matrix is divided into plural regions, lighting of backlight units each emitting light of different hues is controlled in each region, and the backlight units of the plural regions are turned off simultaneously at a regular interval so as to display black. The right-eye image and the left-eye image are alternately displayed with black display interposed therebetween, and light incident on the right eye of a viewer is blocked when a left-eye image is displayed, and light incident on the left eye of the viewer is blocked when a right-eye image is displayed. An image signal is written into a pixel in a black display period during which the backlight units are turned off. | 05-24-2012 |
| 20120127382 | LIQUID CRYSTAL SHUTTER GLASSES - Provided is liquid crystal shutter glasses in which light leakage at the time when a liquid crystal shutter is closed is suppressed. The liquid crystal shutter glasses includes a first substrate and a second substrate with a liquid crystal layer containing a liquid crystal material exhibiting a blue phase provided therebetween, a first electrode with a comb shape and a first common electrode with a comb shape which are provided between the first substrate and the liquid crystal layer, and a second electrode with a comb shape and a second common electrode with a comb shape which are provided between the second substrate and the liquid crystal layer. The first electrode overlaps with the second electrode. The first common electrode overlaps with the second common electrode. The first electrode is connected to the second electrode. | 05-24-2012 |
| 20120126863 | ELECTRONIC CIRCUIT, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - The electronic circuit includes a first comparator and a second comparator in which an induced electromotive force of a coil are compared with each of a first reference potential and a second reference potential and which output a pulse signal in accordance with conditions; the first signal processing circuit which outputs a first receiving rectangular wave signal and a first error signal in accordance with conditions of the pulse signal output from the first comparator and in which data held in accordance with conditions of pulse signal output from the second comparator is reset; and the second signal processing circuit which outputs a second receiving rectangular wave signal and a second error signal in accordance with conditions of the pulse signal output from the second comparator and in which data held in accordance with conditions of pulse signal output from the first comparator is reset. | 05-24-2012 |
| 20120126693 | LIGHTING DEVICE - A highly reliable lighting device is provided at low cost by using a simple structure and a simple process. A lighting device with improved convenience, which has a shape suitable for a purpose and can respond to diversified applications is provided. A light-emitting panel which includes a light-emitting element provided over a flexible substrate and including an electroluminescent (EL) layer (the panel is also referred to as an “EL film”) is put in a glass housing. The EL film is flexible and thus can be provided in a variety of forms in accordance with the shape of the glass housing. | 05-24-2012 |
| 20120126268 | LIGHTING DEVICE - A lighting device is provided with a structure body which has an inner surface including a region with a negative Fresnel lens shape and a high refractive index material layer which is closely in contact with the inner surface. The high refractive index material layer has a Fresnel lens shape in a region closely in contact with the inner surface, and a plane light-emitting body is provided over the structure body with the high refractive index material layer interposed therebetween. The high refractive index material layer is provided so as to fill at least the negative Fresnel lens shape of the structure body and thus has a surface including the region with the Fresnel lens shape at the interface with the structure body. | 05-24-2012 |
| 20120126238 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS USING THE SAME - A semiconductor device with high function, multifunction and high added value. The semiconductor device includes a PLL circuit that is provided over a substrate and outputs a signal with a correct frequency. By providing such a PLL circuit over the substrate, a semiconductor device with high function, multifunction and high added value can be achieved. | 05-24-2012 |
| 20120126234 | Semiconductor Apparatus and Fabrication Method of the Same - It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity. | 05-24-2012 |
| 20120126232 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - An object is to provide a display device with excellent display characteristics, where a pixel circuit and a driver circuit provided over one substrate are formed using transistors which have different structures corresponding to characteristics of the respective circuits. The driver circuit portion includes a driver circuit transistor in which a gate electrode layer, a source electrode layer, and a drain electrode layer are formed using a metal film, and a channel layer is formed using an oxide semiconductor. The pixel portion includes a pixel transistor in which a gate electrode layer, a source electrode layer, and a drain electrode layer are formed using an oxide conductor, and a semiconductor layer is formed using an oxide semiconductor. The pixel transistor is formed using a light-transmitting material, and thus, a display device with higher aperture ratio can be manufactured. | 05-24-2012 |
| 20120126226 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE - It is an object of the present invention to simplify steps needed to process a wiring in forming a multilayer wiring. In addition, when a droplet discharging technique or a nanoimprint technique is used to form a wiring in a contact hole having a comparatively long diameter, the wiring in accordance with the shape of the contact hole is formed, and the wiring portion of the contact hole is likely to have a depression compared with other portions. A penetrating opening is formed by irradiating a light-transmitting insulating film with laser light having high intensity and a pulse high in repetition frequency. A plurality of openings having a minute contact area is provided instead of forming one penetrating opening having a large contact area to have an even thickness of a wiring by reducing a partial depression and also to ensure contact resistance. | 05-24-2012 |
| 20120126224 | SEMICONDUCTOR MEMORY DEVICE - An object is to provide a semiconductor memory device which can be miniaturized and also secures a sufficient margin for the refresh period. A memory cell includes a reading transistor, a writing transistor, and a capacitor. In the above structure, the capacitor controls a potential applied to a gate of the reading transistor. The writing transistor controls writing and erasing of data and, when the transistor is off, has small current so that loss of electric charges stored in the capacitor, which is due to leakage current of the writing transistor, can be prevented. A semiconductor layer included in the writing transistor is provided so as to extend from the gate electrode toward a source region of the reading transistor. The capacitor is provided to overlap with the gate electrode of the reading transistor. | 05-24-2012 |
| 20120122298 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE - Defects in a semiconductor substrate are reduced. A semiconductor substrate with fewer defects is manufactured with high yield. Further, a semiconductor device is manufactured with high yield. A semiconductor layer is formed over a supporting substrate with an oxide insulating layer interposed therebetween, adhesiveness between the supporting substrate and the oxide insulating layer in an edge portion of the semiconductor layer is increased, an insulating layer over a surface of the semiconductor layer is removed, and the semiconductor layer is irradiated with laser light, so that a planarized semiconductor layer is obtained. For increasing the adhesiveness between the supporting substrate and the oxide insulating layer in the edge portion of the semiconductor layer, laser light irradiation is performed from the surface of the semiconductor layer. | 05-17-2012 |
| 20120122277 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE - An object is to provide favorable interface characteristics of a thin film transistor including an oxide semiconductor layer without mixing of an impurity such as moisture. Another object is to provide a semiconductor device including a thin film transistor having excellent electric characteristics and high reliability, and a method by which a semiconductor device can be manufactured with high productivity. A main point is to perform oxygen radical treatment on a surface of a gate insulating layer. Accordingly, there is a peak of the oxygen concentration at an interface between the gate insulating layer and a semiconductor layer, and the oxygen concentration of the gate insulating layer has a concentration gradient. The oxygen concentration is increased toward the interface between the gate insulating layer and the semiconductor layer. | 05-17-2012 |
| 20120120742 | SEMICONDUCTOR DEVICE - An object is to provide a semiconductor device having a memory which can efficiently improve a yield by employing a structure which facilitates the use of a spare memory cell. The semiconductor device includes a memory cell array having a memory cell and a spare memory cell, a decoder connected to the memory cell and the spare memory cell, a data holding circuit connected to the decoder, and a battery which supplies electric power to the data holding circuit. The spare memory cell operates in accordance with an output from the data holding circuit. | 05-17-2012 |
| 20120120715 | SEMICONDUCTOR DEVICE - Provided is a memory device in which memory capacity per unit area is increased without making the manufacturing process complicated. The memory device includes a plurality of memory cells, a plurality of word lines, and a plurality of bit lines. Each of the plurality of memory cells includes a switching element and a capacitor including a first electrode and a second electrode. In at least one of the plurality of memory cells, in accordance with a potential applied to one of the plurality of word lines, the switching element controls a connection between one of the plurality of bit lines and the first electrode, and the second electrode is connected to another one of the plurality of word lines. | 05-17-2012 |
| 20120120336 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - There is provided a high quality liquid crystal panel having a thickness with high accuracy, which is designed, without using a particulate spacer, within a free range in accordance with characteristics of a used liquid crystal and a driving method, and is also provided a method of fabricating the same. The shape of a spacer for keeping a substrate interval constant is made such that it is a columnar shape, a radius R of curvature is 2 μm or less, a height H is 0.5 μm to 10 μm, a diameter is 20 μm or less, and an angle α is 65° to 115°. By doing so, it is possible to prevent the lowering of an opening rate and the lowering to of light leakage due to orientation disturbance. | 05-17-2012 |
| 20120120126 | LIGHT EMITTING DEVICE AND PRODUCTION SYSTEM OF THE SAME - To provide a light emitting device without nonuniformity of luminance, a correcting circuit for correcting a video signal supplied to each pixel to a light emitting device. The correcting circuit is stored with data of a dispersion of a characteristic of a driving TFT among pixels and data of a change over time of luminance of a light emitting element. Further, by correcting a video signal inputted to the light emitting device in conformity with a characteristic of the driving TFT of each pixel and a degree of a deterioration of the light emitting element based on the over-described two data, nonuniformity of luminance caused by a deterioration of an electroluminescent layer and nonuniformity of luminance caused by dispersion of a characteristic of the driving TFT are restrained. | 05-17-2012 |
| 20120119270 | DRIVING METHOD OF A SEMICONDUCTOR DEVICE - A horizontal scanning period is divided into n parts (n is a natural number), so that horizontal scanning can be performed (n×y) times in one frame period. That is, n signals can be outputted from each pixel, and storage times of the n signals are different from one another. Then, since a signal suited to the intensity of light irradiated to each pixel can be selected, information of an object can be accurately read. | 05-17-2012 |
| 20120119251 | LIGHTING DEVICE - An object of the invention is to provide a lighting device which can suppress luminance nonuniformity in a light emitting region when the lighting device has large area. A layer including a light emitting material is formed between a first electrode and a second electrode, and a third electrode is formed to connect to the first electrode through an opening formed in the second electrode and the layer including a light emitting material. An effect of voltage drop due to relatively high resistivity of the first electrode can be reduced by electrically connecting the third electrode to the first electrode through the opening. | 05-17-2012 |
| 20120119214 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - An object is to reduce a capacitance value of parasitic capacitance without decreasing driving capability of a transistor in a semiconductor device such as an active matrix display device. Further, another object is to provide a semiconductor device in which the capacitance value of the parasitic capacitance was reduced, at low cost. An insulating layer other than a gate insulating layer is provided between a wiring which is formed of the same material layer as a gate electrode of the transistor and a wiring which is formed of the same material layer as a source electrode or a drain electrode. | 05-17-2012 |
| 20120119213 | SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME - A thin film transistor of the present invention has an active layer including at least source, drain and channel regions formed on an insulating surface. A high resistivity region is formed between the channel region and each of the source and drain regions. A film capable of trapping positive charges therein is provided on at least the high resistivity region so that N-type conductivity is induced in the high resistivity region. Accordingly, the reliability of N-channel type TFT against hot electrons can be improved. | 05-17-2012 |
| 20120119212 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device is manufactured using a transistor in which an oxide semiconductor is included in a channel region and variation in electric characteristics due to a short-channel effect is less likely to be caused. The semiconductor device includes an oxide semiconductor film having a pair of oxynitride semiconductor regions including nitrogen and an oxide semiconductor region sandwiched between the pair of oxynitride semiconductor regions, a gate insulating film, and a gate electrode provided over the oxide semiconductor region with the gate insulating film positioned therebetween. Here, the pair of oxynitride semiconductor regions serves as a source region and a drain region of the transistor, and the oxide semiconductor region serves as the channel region of the transistor. | 05-17-2012 |
| 20120119073 | INPUT/OUTPUT DEVICE AND DRIVING METHOD THEREOF - An input/output device includes a pixel area; a light emission circuit provided in the pixel area and configured to emit light; and a photodetection circuit provided in the pixel area and configured to generate a voltage having a value corresponding to an intensity of incident light. The light emission circuit includes a drive transistor and a light emitting element. The light emitting element includes a first current terminal electrically connected to the source or the drain of the drive transistor and a second current terminal to which a first voltage is input, and emits light in accordance with a current flowing between the first and second current terminals. The light emission circuit includes a switching element including a first terminal to which a second voltage is input, and a second terminal electrically connected to the first current terminal of the light emitting element. | 05-17-2012 |
| 20120118979 | SEMICONDUCTOR DEVICE - In an RF tag, a mask ROM or a flash memory is used for storing data such as an ID number. Although the mask ROM can be realized at a low price, rewriting is not possible. In addition, in the flash memory, although electric rewriting is possible, production cost increases. Accordingly, it is difficult to provide an RF tag by which data rewriting is possible at a low price. An RF tag is provided with a power supply circuit having a function to generate a power supply voltage from a weak radio signal and a memory which can hold data stored in a data holding portion by the power supply voltage. With the above structure, a high-performance RF tag capable of rewriting data such as an ID number after production can be provided at a low price. | 05-17-2012 |
| 20120118352 | PHOTOELECTRIC CONVERSION MODULE AND PHOTOELECTRIC CONVERSION DEVICE - A reflection member is provided for a space between photoelectric conversion cells or a periphery of the photoelectric conversion cells, which is the place not provided with the photoelectric conversion cell, so that a peak portion of the reflection member is higher than a surface of the photoelectric conversion cells. Accordingly; light having entered the space between the photoelectric conversion cells or the periphery of the photoelectric conversion cells, which does not contribute to power generation under normal circumstances, can be guided to the photoelectric conversion cell through reflection by the reflection member. Note that since the peak portion of the reflection member is higher than the surface of the photoelectric conversion cells, sunlight can be guided to the photoelectric conversion cell through one-time reflection, whereby the object can be achieved. | 05-17-2012 |
| 20120115290 | MANUFACTURING METHOD OF CRYSTALLINE SEMICONDUCTOR FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - The crystalline semiconductor film is formed following steps that supplying a film formation gas to a second gas diffusion area from a gas introduction port provided in an upper electrode; supplying the film formation gas to a first gas diffusion area from the second gas diffusion area through holes provided in a dispersion plate between the first gas diffusion area and the second gas diffusion area; supplying the film formation gas into a treatment room from the first gas diffusion area through holes in a shower plate between the first gas diffusion area and the treatment room; generating glow discharge plasma by supplying high frequency electricity from an electrode surface of the upper electrode; generating crystal nuclei on a substrate provided over a lower electrode facing the upper electrode; and growing the crystal nuclei. A portion of the dispersion plate which faces the gas introduction port has no hole. | 05-10-2012 |
| 20120115285 | METHOD FOR FORMING MICROCRYSTALLINE SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A seed crystal which includes mixed phase grains including an amorphous silicon region and a crystallite which is a microcrystal that can be regarded as a single crystal is formed on an insulating film by a plasma CVD method under a first condition that enables mixed phase grains having high crystallinity and high uniformity of grain sizes to be formed at a low density, and then a microcrystalline semiconductor film is formed to be stacked on the seed crystal by a plasma CVD method under a second condition that enables the mixed phase grains to grow to fill a space between the mixed phase grains. | 05-10-2012 |
| 20120115283 | WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THEREOF - The present invention provides a thin wiring pattern such as wiring formed by discharging a droplet. In the present invention, a porous (including microporous) substance is formed as a base film in forming pattern by using a droplet discharge method (also referred to as an ink-jetting method). One feature of a wiring substrate according to the present invention provides a porous film and a conductive layer thereon. One feature of a semiconductor device of the present invention provides a thin film transistor in which a gate electrode is formed by the conductive layer having the above-described structure. | 05-10-2012 |
| 20120115273 | MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION DEVICE - A photoelectric conversion device has a structure that includes a first amorphous silicon layer and a second amorphous silicon layer that are in contact with a single crystalline silicon substrate, and a first microcrystalline silicon layer with one conductivity type and a second microcrystalline silicon layer with a conductivity type that is opposite the one conductivity type that are in contact with the first and second amorphous silicon layers, respectively. The first and second microcrystalline silicon layers are formed using a plasma CVD apparatus that is suitable for high pressure film formation conditions. | 05-10-2012 |
| 20120113707 | SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD OF SEMICONDUCTOR MEMORY DEVICE - A novel semiconductor memory device whose power consumption is low is provided. A source of a writing transistor WTr_n_m, a gate of a reading transistor RTr_n_m, and one electrode of a capacitor CS_n_m are connected to each other. A gate and a drain of the writing transistor WTr_n_m are connected to a writing word line WWL_n and a writing bit line WBL_m, respectively. The other electrode of the capacitor CS_n_m is connected to a reading word line RWL_n. A drain of the reading transistor RTr_n_m is connected to a reading bit line RBL_m. Here, the potential of the reading bit line RBL_m is input to an inverting amplifier circuit such as a flip-flop circuit FF_m to be inverted by the inverting amplifier circuit. This inverted potential is output to the writing bit line WBL_m. | 05-10-2012 |
| 20120113378 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - To control the positioning of a spacer more accurately in a liquid crystal display device to prevent display defects due to incorrect positioning in a display region. To provide a liquid crystal display device with higher image quality and reliability, and to provide a method for manufacturing the liquid crystal display device with high yield. In a liquid crystal display device, a region onto which a spherical spacer is discharged is subjected to liquid-repellent treatment in order to reduce the wettability with respect to a liquid in which the spherical spacer is dispersed. The liquid (the droplet) does not spread over the liquid-repellent region and is dried while moving the spherical spacer toward the center of the liquid. Thus, incorrect positioning shortly after discharging, which has been caused by the loss of control in the liquid, can be corrected by moving the spherical spacer while drying the liquid. | 05-10-2012 |
| 20120113373 | LIQUID CRYSTAL DISPLAY DEVICE - It is an object of the present invention to provide a method for manufacturing a thin phase difference film of a liquid crystal display easily so as not to prevent a liquid crystal from being driven so that cost for manufacturing a liquid crystal display is reduced. A liquid crystal display device according to the present invention has a structure in which phase difference films that have the same function as a conventional phase difference film are formed by using a liquid crystal stabilized with a polymer over a first substrate and a second substrate that have electrodes formed thereover, and a liquid crystal material is interposed between these substrates. In addition to the structure, it is also a feature that the phase difference film formed over the substrate is formed by using a liquid crystal that is stabilized with a polymer including a conductive material. | 05-10-2012 |
| 20120113345 | Display Device and Method of Fabricating the Same - A driver circuit for use with a passive matrix or active matrix electro-optical display device such as a liquid crystal display is fabricated to occupy a reduced area. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. The driver circuit can be formed on a large-area substrate such as a glass substrate, while the display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. | 05-10-2012 |
| 20120113341 | VARIABLE CAPACITOR AND LIQUID CRYSTAL DISPLAY DEVICE - A variable capacitor with high controllability and stable operation is provided. A liquid crystal display device with low power consumption and excellent display quality is provided. A variable capacitor is formed using two overlapping electrodes of different areas and a substantially intrinsic semiconductor layer formed in contact with one of the electrodes. According to the voltage applied to the electrodes, the semiconductor layer can be considered as a dielectric or a conductor, thereby allowing varying the capacitance of the variable capacitor. The variable capacitor is applied to pixels of a liquid crystal display device configured to switch between a low capacitance and a high capacitance of the variable capacitor in accordance with a moving image display mode and a still image display mode, respectively, whereby a liquid crystal display device with low power consumption and excellent display quality can be realized. | 05-10-2012 |
| 20120113086 | METHOD FOR DRIVING DISPLAY DEVICE - A method for driving a display device in which characteristics of a transistor including an oxide semiconductor can approximately be recovered to characteristics before deterioration is provided. In the method for driving the display device, by which images are displayed with the use of a plurality of frame periods, the display device is driven so that a voltage of 20 V or higher can be applied to a gate of a transistor, which is a driving element, for 1 millisecond or longer in a period, in which any one of scan lines is selected, in each frame period. For a plurality of frame periods, the rows are selected so that a voltage of 20 V or higher is applied to gates of all of the transistors which are driving elements for 1 millisecond or longer, whereby characteristics of the transistor can approximately be recovered to characteristics before deterioration. | 05-10-2012 |
| 20120113058 | INFORMATION DEVICE - Problems exist in areas such as image visibility, endurance of the device, precision, miniaturization, and electric power consumption in an information device having a conventional resistive film method or optical method pen input function. Both EL elements and photoelectric conversion elements are arranged in each pixel of a display device in an information device of the present invention having a pen input function. Information input is performed by the input of light to the photoelectric conversion elements in accordance with a pen that reflects light by a pen tip. An information device with a pen input function, capable of displaying a clear image without loss of brightness in the displayed image, having superior endurance, capable of being miniaturized, and having good precision can thus be obtained. | 05-10-2012 |
| 20120112257 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device with a novel structure in which stored data can be retained even when power is not supplied, and which does not have a limitation on the number of writing. The semiconductor device includes both a memory circuit including a transistor including an oxide semiconductor (in a broader sense, a transistor whose off-state current is sufficiently small), and a peripheral circuit such as a driver circuit including a transistor including a material other than an oxide semiconductor (that is, a transistor capable of operating at sufficiently high speed). Further, the peripheral circuit is provided in a lower portion and the memory circuit is provided in an upper portion, so that the area and size of the semiconductor device can be decreased. | 05-10-2012 |
| 20120112196 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF - The present invention provides a structure of the TFT in which a current-voltage characteristic can be improved. The present invention refers to a thin film transistor comprising a lamination layer wherein a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covering the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, and a region which is in contact with the first insulating film and the third conductive film is a channel forming region in semiconductor film, and the third conductive film is a gate electrode. | 05-10-2012 |
| 20120112192 | POWER STORAGE DEVICE - A semiconductor device comprises a thin film transistor provided over a substrate having an insulating surface, and an electrode penetrating the substrate. The thin film transistor is provided between a first structural body and a second structural body, which has a higher rigidity than the first structural body, which serve as protectors because the structural bodies have resistance to a pressing force such as a tip of a pen or bending stress applied from outside so malfunction due to the pressing force and the bending stress can be prevented. | 05-10-2012 |
| 20120112191 | SEMICONDUCTOR DEVICE - A data retention period in a semiconductor device or a semiconductor memory device is lengthened. The semiconductor device or the semiconductor memory includes a memory circuit including a first transistor including a first semiconductor layer and a first gate and a second transistor including a second semiconductor layer, a second gate, and a third gate The first semiconductor layer is formed at the same time as a layer including the second gate. | 05-10-2012 |
| 20120112184 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device having a novel structure or a method for manufacturing the semiconductor device is provided. For example, the reliability of a transistor which is driven at high voltage or large current is improved. For improvement of the reliability of the transistor, a buffer layer is provided between a drain electrode layer (or a source electrode layer) and an oxide semiconductor layer such that the end portion of the buffer layer is beyond the side surface of the drain electrode layer (or the source electrode layer) when seen in a cross section, whereby the buffer layer can relieve the concentration of electric field. The buffer layer is a single layer or a stacked layer including a plurality of layers, and includes, for example, an In—Ga—Zn—O film containing nitrogen, an In—Sn—O film containing nitrogen, an In—Sn—O film containing SiOx, or the like. | 05-10-2012 |
| 20120112183 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An object is to provide a semiconductor device including an oxynitride semiconductor whose carrier density is controlled. By introducing controlled nitrogen into an oxide semiconductor layer, a transistor in which an oxynitride semiconductor having desired carrier density and on characteristics is used for a channel can be manufactured. Further, with the use of the oxynitride semiconductor, even when a low resistance layer or the like is not provided between an oxynitride semiconductor layer and a source electrode and between the oxynitride semiconductor layer and a drain electrode, favorable contact characteristics can be exhibited. | 05-10-2012 |
| 20120112045 | SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING TRANSISTOR - When a positive bias voltage is applied to a gate electrode of a transistor including an oxide semiconductor for longer than or equal to 10 msec, electric characteristics of the transistor, which have varied due to the light irradiation, can be brought to the state which is substantially the same as the state before the light irradiation. Note that a positive bias voltage is applied to the gate electrode of the transistor at an appropriate timing with reference to the amount of incident light received by the transistor. Accordingly, a display device in which a reduction in display quality is suppressed even when light irradiation is performed can be realized. | 05-10-2012 |
| 20120108049 | CRYSTALLINE SEMICONDUCTOR THIN FILM, METHOD OF FABRICATING THE SAME, SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING THE SAME - There is provided a technique to form a single crystal semiconductor thin film or a substantially single crystal semiconductor thin film. A catalytic element for facilitating crystallization of an amorphous semiconductor thin film is added to the amorphous semiconductor thin film, and a heat treatment is carried out to obtain a crystalline semiconductor thin film. After the crystalline semiconductor thin film is irradiated with ultraviolet light or infrared light, a heat treatment at a temperature of 900 to 1200° C. is carried out in a reducing atmosphere. The surface of the crystalline semiconductor thin film is extremely flattened through this step, defects in crystal grains and crystal grain boundaries disappear, and the single crystal semiconductor thin film or substantially single crystal semiconductor thin film is obtained. | 05-03-2012 |
| 20120108029 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - It is an object of the present invention to provide a technique in which a high-performance and high reliable memory device and a semiconductor device provided with the memory device are manufactured at low cost with high yield. The semiconductor device includes an organic compound layer including an insulator over a first conductive layer and a second conductive layer over the organic compound layer including an insulator. Further, the semiconductor device is manufactured by forming a first conductive layer, discharging a composition of an insulator and an organic compound over the first conductive layer to form an organic compound layer including an insulator, and forming a second conductive layer over the organic compound layer including an insulator. | 05-03-2012 |
| 20120108014 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to provide a highly reliable semiconductor device that has tolerance to external stress and electrostatic discharge. Another object is to prevent defective shapes and defective characteristics due to the external stress or an electrostatic discharge in the manufacturing process, and to manufacture a semiconductor device with high yield. Still another object is to manufacture a semiconductor device at low cost and with high productivity. With the use of a conductive shield, electrostatic breakdown (malfunctions of the circuit or damages of a semiconductor element) due to electrostatic discharge of the semiconductor integrated circuit is prevented. The conductive shield is formed so that at least the conductive shields on the top and bottom surfaces are electrically connected by a plating method. In addition, a semiconductor device can be formed at low cost with high productivity because a plating method is used for the formation of the conductive shield. | 05-03-2012 |
| 20120108007 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - It is an object to provide a semiconductor device including a thin film transistor with favorable electric properties and high reliability, and a method for manufacturing the semiconductor device with high productivity. In an inverted staggered (bottom gate) thin film transistor, an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer, and a buffer layer formed using a metal oxide layer is provided between the semiconductor layer and a source and drain electrode layers. The metal oxide layer is intentionally provided as the buffer layer between the semiconductor layer and the source and drain electrode layers, whereby ohmic contact is obtained. | 05-03-2012 |
| 20120108006 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - It is an object to provide a semiconductor device including a thin film transistor with favorable electric properties and high reliability, and a method for manufacturing the semiconductor device with high productivity. In an inverted staggered (bottom gate) thin film transistor, an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer, and a buffer layer formed using a metal oxide layer is provided between the semiconductor layer and a source and drain electrode layers. The metal oxide layer is intentionally provided as the buffer layer between the semiconductor layer and the source and drain electrode layers, whereby ohmic contact is obtained. | 05-03-2012 |
| 20120107985 | Semiconductor Device and Its Manufacturing Method - A manufacturing method of a semiconductor device includes forming a pixel portion and a driving circuit including a semiconductor layer. A scan line in a pixel portion and a first wiring in a driving circuit are formed by patterning a first conductive layer, and a data line in the pixel portion and a second wiring in the driving circuit are formed by patterning a second conductive layer. The first wiring, a channel formation region of the semiconductor layer, and the second wiring are overlapped with each other. | 05-03-2012 |
| 20120106226 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a bit line; two or more word lines; and a memory cell including two or more sub memory cells that each include a transistor and a capacitor. One of a source and a drain of the transistor is connected to the bit line, the other of the source and the drain of the transistor is connected to the capacitor, a gate of the transistor is connected to one of the word lines, and each of the sub memory cells has a different capacitance of the capacitor. | 05-03-2012 |
| 20120105788 | ELECTRONIC DEVICE HAVING LIQUID CRYSTAL DISPLAY DEVICE - A display device of the present invention includes a thin film transistor in a pixel region formed over a substrate, the thin film transistor including an active layer and a gate electrode with a gate insulating film interposed between the active layer and the gate electrode, a silicon nitride film formed over the thin film transistor, a resin film formed over the silicon nitride film, an inorganic insulating film formed over the resin film; a metal layer formed over the substrate; and a sealing material formed over the metal layer, wherein the sealing material covers a region where the resin film is not formed over the silicon nitride film. | 05-03-2012 |
| 20120105415 | LIGHT EMITTING DEVICE - Power consumption required for charging and discharging a source signal line is reduced in an active matrix EL display device. A bipolar transistor (Bi | 05-03-2012 |
| 20120105130 | RECEIVING CIRCUIT, LSI CHIP, AND STORAGE MEDIUM - A receiving circuit with a simple circuit structure for performing wireless communication utilizing electromagnetic induction is provided. An LSI chip and a storage medium where wireless communication utilizing electromagnetic induction is performed and the circuit scale and circuit size can be reduced are provided. The following receiving circuit may be used: a parallel circuit where two diode elements whose directions are opposite are connected in parallel is used, one end of the parallel circuit is connected to the other end of a coil whose one end is connected to a ground potential line, and a capacitor is connected in series with the other end of the parallel circuit. A transistor whose leakage current is markedly reduced may be used as a diode in the receiving circuit. Such a receiving circuit may be used in an LSI chip or a storage medium. | 05-03-2012 |
| 20120104862 | PHOTOELECTRIC CONVERSION DEVICE - A photoelectric conversion device includes at least two photoelectric conversion elements which have voltage-current characteristics different from each other. Further, one of the photoelectric conversion elements has photoelectric conversion efficiency higher than that of the other photoelectric conversion element under the environment in which room light can be obtained. Furthermore, the other photoelectric conversion element has photoelectric conversion efficiency higher than the one of the photoelectric conversion elements under the environment in which sunlight can be obtained. Moreover, each of the voltage of electric power generated in the at least two photoelectric conversion elements is adjusted by one of at least two DC-DC converters corresponding the photoelectric conversion element. In addition, part of the electric power generated in the one of the photoelectric conversion elements is used as drive electric power of the at least two DC-DC converter. | 05-03-2012 |
| 20120104568 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - To provide a method for manufacturing a large-area semiconductor device, to provide a method for manufacturing a semiconductor device with high efficiency, and to provide a highly-reliable semiconductor device in the case of using a large-area substrate including an impurity element. A plurality of single crystal semiconductor substrates are concurrently processed to manufacture an SOI substrate, so that an area of a semiconductor device can be increased and a semiconductor device can be manufactured with improved efficiency. In specific, a series of processes is performed using a tray with which a plurality of semiconductor substrates can be concurrently processed. Here, the tray is provided with at least one depression for holding single crystal semiconductor substrates. Further, deterioration of characteristics of a manufactured semiconductor element is prevented by providing an insulating layer serving as a barrier layer against an impurity element which may affect characteristics of the semiconductor element. | 05-03-2012 |
| 20120104480 | STORAGE DEVICE - A storage device in which stored data can be held even when power is not supplied, and stored data can be read at high speed without turning on a transistor included in a storage element is provided. In the storage device, a memory cell having a transistor including an oxide semiconductor layer as a channel region and a storage capacitor is electrically connected to a capacitor to form a node. The voltage of the node is boosted up in accordance with stored data by capacitive coupling through a storage capacitor and the potential is read with an amplifier circuit to distinguish data. | 05-03-2012 |
| 20120104425 | Method of Driving A Light Emitting Device - The present invention is characterized in that a transistor with its L/W set to 10 or larger is employed, and that |V | 05-03-2012 |
| 20120104386 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, there occurs a problem that it is difficult to mount an IC chip including a driver circuit for driving the gate and signal lines by bonding or the like, whereby manufacturing cost is increased. A pixel portion and a driver circuit for driving the pixel portion are provided over the same substrate, and at least part of the driver circuit includes a thin film transistor using an oxide semiconductor interposed between gate electrodes provided above and below the oxide semiconductor. The pixel portion and the driver portion are provided over the same substrate, whereby manufacturing cost can be reduced. | 05-03-2012 |
| 20120104385 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first gate electrode; a gate insulating layer covering the first gate electrode; an oxide semiconductor layer that overlaps with the first gate electrode; oxide semiconductor layers having high carrier density covering end portions of the oxide semiconductor layer; a source electrode and a drain electrode in contact with the oxide semiconductor layers having high carrier density; an insulating layer covering the source electrode, the drain electrode, and the oxide semiconductor layer; and a second gate electrode that is in contact with the insulating layer. Each of the oxide semiconductor layers is in contact with part of each of an upper surface, a lower surface, and a side surface of one of the end portions of the oxide semiconductor layer and part of an upper surface of the gate insulating layer. | 05-03-2012 |
| 20120104379 | ORGANIC COMPOUND, ANTHRACENE DERIVATIVE, AND LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, AND ELECTRONIC DEVICE USING ANTHRACENE DERIVATIVE - Objects of the present invention are to provide novel anthracene derivatives and novel organic compounds; a light-emitting element that has high emission efficiency; a light-emitting element that is capable of emitting blue light with high luminous efficiency; a light-emitting element that is capable of operation for a long time; and a light-emitting device and an electronic device that have lower power consumption. An anthracene derivative represented by a general formula (1) and an organic compound represented by a general formula (17) are provided. A light-emitting element that has high emission efficiency can be obtained by use of the anthracene derivative represented by the general formula (1). Further, a light-emitting element that has a long life can be obtained by use of the anthracene derivative represented by the general formula (1). | 05-03-2012 |
| 20120104238 | PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR OPERATING THE SAME - To provide a photoelectric conversion device with low power consumption and a method for operating the photoelectric conversion device. The photoelectric conversion device includes a charge storage capacitor portion, a photodiode, and a plurality of transistors. The charge storage capacitor portion is charged after being reset. Then, the charge storage capacitor portion is discharged through the photodiode or a current mirror circuit connected to the photodiode for a given period of time, and after that, the potential of the charge storage capacitor portion is read. Since power is consumed only at the time of charging, power consumption can be reduced. | 05-03-2012 |
| 20120100890 | DEFECTIVE PIXEL SPECIFYING METHOD, DEFECTIVE PIXEL SPECIFYING SYSTEM, IMAGE CORRECTING METHOD, AND IMAGE CORRECTING SYSTEM - A defective pixel specifying method and a defective pixel specifying system for a semiconductor device having a defective pixel are provided. Also provided are an image correcting method and an image correcting system for making a defective pixel inconspicuous on the screen when a read image is displayed. The present invention determines whether or not there is a defective pixel for each pixel and specifies the coordinate of the defective pixel using image signals obtained by reading a plurality of images. The image signal of the defective pixel is set based on the image signals of the pixels adjacent to the defective pixel to correct the image of the subject read. | 04-26-2012 |
| 20120100677 | METHOD FOR MANUFACTURING MICROCRYSTALLINE SEMICONDUCTOR AND THIN FILM TRANSISTOR - A technique for manufacturing a microcrystalline semiconductor layer with high mass productivity is provided. In a reaction chamber of a plasma CVD apparatus, an upper electrode and a lower electrode are provided in almost parallel to each other. A hollow portion is formed in the upper electrode, and the upper electrode includes a shower plate having a plurality of holes formed on a surface of the upper electrode which faces the lower electrode. A substrate is provided over the lower electrode. A gas containing a deposition gas and hydrogen is supplied to the reaction chamber from the shower plate through the hollow portion of the upper electrode, and a rare gas is supplied to the reaction chamber from a portion different from the upper electrode. Accordingly, high-frequency power is supplied to the upper electrode to generate plasma, so that a microcrystalline semiconductor layer is formed over the substrate. | 04-26-2012 |
| 20120100675 | MANUFACTURING METHOD OF MICROCRYSTALLINE SILICON FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a manufacturing method of a microcrystalline silicon film having both high crystallinity and high film density. In the manufacturing method of a microcrystalline silicon film according to the present invention, a first microcrystalline silicon film that includes mixed phase grains is formed over an insulating film under a first condition, and a second microcrystalline silicon film is formed thereover under a second condition. The first condition and the second condition are a condition in which a deposition gas containing silicon and a gas containing hydrogen are used as a first source gas and a second source gas. The first source gas is supplied under the first condition in such a manner that supply of a first gas and supply of a second gas are alternately performed. | 04-26-2012 |
| 20120100309 | PLASMA TREATMENT APPARATUS AND PLASMA CVD APPARATUS - A plasma treatment apparatus includes a treatment chamber covered with a chamber wall, where an upper electrode faces a lower electrode; and a line chamber separated from the treatment chamber by the upper electrode and an insulator, covered with the chamber wall, and connected to a first gas diffusion chamber between a dispersion plate and a shower plate. The first gas diffusion chamber is connected to a second gas diffusion chamber between the dispersion plate and the upper electrode. The second gas diffusion chamber is connected to a first gas pipe in the upper electrode. The upper electrode and the chamber wall are provided on the same axis. The dispersion plate includes a center portion with no gas hole and a peripheral portion with plural gas holes. The center portion faces a gas introduction port of the first gas pipe, connected to an electrode plane of the upper electrode. | 04-26-2012 |
| 20120100284 | Switching Element, Method For Manufacturing The Same, And Display Device Including Switching Element - A method for manufacturing a switching element which has enough resistance to repeat switching operations and which can be miniaturized and have low power consumption, and a display device including the switching element are provided. The switching element includes a first electrode to which a constant potential is applied, a second electrode adjacent to the first electrode, and a third electrode over the first electrode with a spacer layer formed of a piezoelectric material interposed therebetween and provided across the second electrode such that there is a gap between the second electrode and the third electrode. A potential which is different from or approximately the same as a potential of the first electrode is applied to the third electrode to expand and contract the spacer layer, so that a contact state or a noncontact state between the second electrode and the third electrode can be selected. | 04-26-2012 |
| 20120099368 | METHOD FOR DRIVING SEMICONDUCTOR DEVICE - It is an object to obtain a memory element (DRAM) storing multilevel data easily. The amount of charge accumulated in a capacitor of a memory element (DRAM) is controlled by changing the potential of a wiring (a bit line), which is used for writing data to the memory element (DRAM), in a period in which a transistor included in the memory element (DRAM) is on. Thus, multilevel data stored in the memory element (DRAM) can be obtained without a complex configuration of a semiconductor device including the memory element (DRAM). | 04-26-2012 |
| 20120099360 | SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - In a memory cell, a transistor with extremely high off-resistance is used as a write transistor; a drain and a source of the write transistor are connected to a write bit line and an input of an inverter, respectively; and a drain and a source of a read transistor are connected to a read bit line and an output of the inverter, respectively. Capacitors may be intentionally disposed to the source of the write transistor. Alternatively, parasitic capacitance may be used. Since the data retention is performed using charge stored on these capacitors, a potential difference between power sources for the inverter can be 0. This eliminates leakage current between the positive and negative electrodes of the inverter, thereby reducing power consumption. | 04-26-2012 |
| 20120099331 | LIGHTING DEVICE - To improve reliability of a lighting device using an electroluminescent material. In a lighting device which includes a light-emitting element containing an electroluminescence (EL) layer, a first housing is provided on a light emission surface of the light-emitting element, a metal plate and a second housing covering the metal plate are provided over a top surface of the light-emitting element, and the first housing is connected to both the metal plate and the second housing, whereby the light-emitting element is doubly sealed. Further, a depressed portion is provided for the first housing in a region in contact with the metal plate or a region in contact with the second housing through an adhesive layer; thus, adhesion between the housings is improved. | 04-26-2012 |
| 20120099048 | LIGHT-EMITTING ELEMENT UNIT AND DISPLAY DEVICE - A light-emitting element unit which can improve color purity of light emitted from a color filter is provided. A display device with high color purity and high color reproducibility is provided. The light-emitting element unit includes a wiring board, a light-emitting element chip provided over the wiring board, a micro optical resonator provided over the wiring board and at the periphery of the light-emitting element chip, and a phosphor layer covering the light-emitting element chip and the micro optical resonator. The display device includes a display panel having a coloring layer and a backlight module having the light-emitting element unit. Examples of the display panel include: a liquid crystal panel; and a display panel including an opening portion provided over a first substrate, MEMS moving over the opening portion in the lateral direction, and a second substrate provided with a coloring layer in a portion corresponding to the opening portion. | 04-26-2012 |
| 20120098738 | DISPLAY DEVICE AND DRIVING METHOD THEREOF - It is an object of the present invention to provide a display device in which problems such as an increase of power consumption and increase of a load of when light is emitted are reduced by using a method for realizing pseudo impulsive driving by inserting an dark image, and a driving method thereof. A display device which displays a gray scale by dividing one frame period into a plurality of subframe periods, where one frame period is divided into at least a first subframe period and a second subframe period; and when luminance in the first subframe period to display the maximum gray scale is Lmax | 04-26-2012 |
| 20120098086 | SOI SUBSTRATE AND METHOD FOR MANUFACTURING SOI SUBSTRATE - An SOI substrate and a manufacturing method of the SOI substrate, by which enlargement of the substrate is possible and its productivity can be increased, are provided. A step (A) of cutting a first single crystal silicon substrate to form a second single crystal silicon substrate which has a chip size; a step (B) of forming an insulating layer on one surface of the second single crystal silicon substrate, and forming an embrittlement layer in the second single crystal substrate; and a step (C) of bonding a substrate having an insulating surface and the second single crystal silicon substrate with the insulating layer therebetween, and conducting heat treatment to separate the second single crystal silicon substrate along the embrittlement layer, and forming a single crystal silicon thin film on the substrate having an insulating surface, are conducted. | 04-26-2012 |
| 20120097994 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - To provide a light emitting device high in reliability with a pixel portion having high definition with a large screen. According to a light emitting device of the present invention, on an insulator ( | 04-26-2012 |
| 20120097963 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A first shape of semiconductor region having on its one side a plurality of sharp convex top-end portions is formed first and a continuous wave laser beam is used for radiation from the above region so as to crystallize the first shape of semiconductor region. A continuous wave laser beam condensed in one or plural lines is used for the laser beam. The first shape of semiconductor region is etched to form a second shape of semiconductor region in which a channel forming region and a source and drain region are formed. The second shape of semiconductor region is disposed so that a channel foaming range would be formed on respective crystal regions extending from the plurality of convex end portions. A semiconductor region adjacent to the channel forming region is eliminated. | 04-26-2012 |
| 20120097960 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device having high operating performance and reliability, and a manufacturing method thereof are provided. An LDD region | 04-26-2012 |
| 20120097942 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - It is an object of an embodiment of the present invention to reduce leakage current between a source and a drain in a transistor including an oxide semiconductor. As a first gate film in contact with a gate insulating film, a compound conductor which includes indium and nitrogen and whose band gap is less than 2.8 eV is used. Since this compound conductor has a work function of greater than or equal to 5 eV, preferably greater than or equal to 5.5 eV, the electron concentration in an oxide semiconductor film can be maintained extremely low. As a result, the leakage current between the source and the drain is reduced. | 04-26-2012 |
| 20120097941 | SEMICONDUCTOR DEVICE - A transistor in a display device is expected to have higher withstand voltage, and it is an object to improve the reliability of a transistor which is driven by high voltage or large current. A semiconductor device includes a transistor in which buffer layers are provided between a semiconductor layer forming a channel formation region and source and drain electrode layers. The buffer layers are provided between the semiconductor layer forming a channel formation region and the source and drain electrode layers in order to particularly relieve an electric field in the vicinity of a drain edge and improve the withstand voltage of the transistor. | 04-26-2012 |
| 20120094446 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Electric characteristics of a thin film transistor including a channel formation region including a microcrystalline semiconductor are improved. The thin film transistor includes a gate electrode, a gate insulating film formed over the gate electrode, a microcrystalline semiconductor layer formed over the gate insulating film, a semiconductor layer which is formed over the microcrystalline semiconductor layer and includes an amorphous semiconductor, and a source region and a drain region which are formed over the semiconductor layer. A channel is formed in the microcrystalline semiconductor layer when the thin film transistor is placed in an on state, and the microcrystalline semiconductor layer includes an impurity element for functioning as an acceptor. The microcrystalline semiconductor layer is formed by a plasma-enhanced chemical vapor deposition method. In forming the microcrystalline semiconductor layer, a process gas is excited with two or more kinds of high-frequency electric power with different frequencies. | 04-19-2012 |
| 20120094445 | ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device with high electric characteristics is provided. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas including an HBr gas, a CF | 04-19-2012 |
| 20120094433 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device so as not expose a semiconductor layer to moisture and the number of masks is reduced. For example, a first conductive film, a first insulating film, a semiconductor film, a second conductive film, and a mask film are formed. The first mask film is processed to form a first mask layer. Dry etching is performed on the first insulating film, the semiconductor film, and the second conductive film with the use of the first mask layer to form a thin film stack body, so that a surface of the first conductive film is at least exposed. Sidewall insulating layers covering side surfaces of the thin film stack body are formed. The first conductive film is side-etched to form a first electrode. A second electrode layer is formed with the second mask layer. | 04-19-2012 |
| 20120094420 | MANUFACTURING METHOD OF GROUP OF WHISKERS - A seed substrate is placed to face a formation substrate, and then a gas containing silicon is introduced and chemical vapor deposition is performed. There is no particular limitation on a kind of a material used for the formation substrate as long as the material can withstand the temperature at which the reduced pressure chemical vapor deposition is performed. A group of silicon whiskers which does not include a seed atom can be grown directly on and in contact with the formation substrate. Further, the substrate provided with the group of whiskers can be applied to a solar cell, a lithium ion secondary battery, and the like, by utilizing surface characteristics of the group of whiskers. | 04-19-2012 |
| 20120094412 | METHOD FOR MANUFACTURING WIRING, THIN FILM TRANSISTOR, LIGHT EMITTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE, AND DROPLET DISCHARGE APPARATUS FOR FORMING THE SAME - As a semiconductor device, specifically, a pixel portion included in a semiconductor device is made to have higher precision and higher aperture ratio, it is required to form a smaller wiring in width. In the case of forming a wiring by using an ink-jet method, a dot spreads on a wiring formation surface, and it is difficult to narrow width of a wiring. In the present invention, a photocatalytic substance typified by TiO | 04-19-2012 |
| 20120094411 | LIQUID CRYSTAL ELECTRO-OPTIC DEVICE - In a horizontal electric field drive type liquid crystal electro-optic device, a gate electrode, a source electrode, a drain electrode, a semiconductor film and a common electrode are formed on a glass substrate and a liquid crystal material is driven by controlling the strength of an electric field substantially parallel to the glass substrate. The electrodes and the semiconductor film are made curved, for example semi-circular or semi-elliptical, in sectional profile. These curved sectional profiles can be formed by suitably selecting and combining various patterning and etching methods. | 04-19-2012 |
| 20120092587 | DISPLAY DEVICE AND DRIVING METHOD FOR DISPLAY DEVICE - An object is to suppress degradation of an image quality of a display image. A plurality of display circuits arranged in M rows (M is a natural number of 2 or more) and N columns (N is a natural number) and a light unit are included; the light unit includes a plurality of light-emitting diode groups arranged in X rows (X is a natural number of 2 or more), overlaps with a display circuit in at least different one or more rows every row, and includes a light-emitting diode emitting red light, a light-emitting diode emitting green light and a light-emitting diode emitting blue light and a light guide plate formed between the plurality of display circuits and the plurality of light-emitting diode groups. The light guide plate includes X light guide members which transmits the light of the light-emitting diode groups in the rows different from each other. | 04-19-2012 |
| 20120091405 | METHOD FOR MANUFACTURING POSITIVE ELECTRODE ACTIVE MATERIAL FOR POWER STORAGE DEVICE - In a manufacturing process of a positive electrode active material for a power storage device, which includes a lithium silicate compound represented by a general formula Li | 04-19-2012 |
| 20120088157 | ELECTRODE MATERIAL, POWER STORAGE DEVICE, AND ELECTRONIC DEVICE - To provide an electrode material with an increased capacity and a power storage device including the electrode material. Lithium iron phosphate having improved crystallinity is provided in which the lattice constant in the a-axis direction is greater than or equal to 10.3254×10 | 04-12-2012 |
| 20120088156 | METHOD FOR MANUFACTURING POSITIVE ELECTRODE ACTIVE MATERIAL FOR ENERGY STORAGE DEVICE AND ENERGY STORAGE DEVICE - An energy storage device having high capacity per weight or volume and a positive electrode active material for the energy storage device are manufactured. A surface of a main material included in the positive electrode active material for the energy storage device is coated with two-dimensional carbon. The main material included in the positive electrode active material is coated with a highly conductive material which has a structure expanding two-dimensionally and whose thickness is ignorable, whereby the amount of carbon coating can be reduced and an energy storage device having capacity close to theoretical capacity can be obtained even when a conduction auxiliary agent is not used or the amount of the conduction auxiliary agent is extremely small. Accordingly, the amount of carbon coating in a positive electrode and the volume of the conduction auxiliary agent can be reduced; consequently, the volume of the positive electrode can be reduced. | 04-12-2012 |
| 20120087134 | LIGHTING DEVICE - One object is to reduce the weight of a lighting device including an electroluminescent material. An object is to achieve high reliability of a lighting device including an electroluminescent material. In a lighting device including a light-emitting element having an electroluminescence (EL) layer, a housing formed using an organic resin whose refractive index is greater than or equal to that of the EL layer is provided to cover a light emission surface and a top surface of the light-emitting element. In addition, an inorganic insulating film covering an inner wall of the housing provided with the light-emitting element and the top surface of the light-emitting element is preferably provided. | 04-12-2012 |
| 20120086692 | Electric Circuit - As for a transistor, overlapped are factors such as a variation of a gate insulation film which occurs due to a difference of a manufacturing process and a substrate used and a variation of a crystalline state in a channel forming region and thereby, there occurs a variation of a threshold voltage and mobility of a transistor. | 04-12-2012 |
| 20120086422 | DCDC CONVERTER, SEMICONDUCTOR DEVICE, AND POWER GENERATION DEVICE - A DCDC converter includes a control circuit, a transistor in which switching is controlled by being supplied voltage output from the control circuit to a gate electrode of the transistor, a voltage conversion portion in which supply of input voltage is controlled by the switching of the transistor and output power commensurate with duty ratio of the switching of the transistor, and a detection circuit detecting the output power. Further, the control circuit includes a control signal generation circuit generating a control signal with a pulse voltage waveform and a selection circuit applying voltage of the control signal to the gate electrode in the case where current detected by the detection circuit is the same as or exceeds the threshold value and applying voltage for turning on the transistor to the gate electrode in the case where the current detected by the detection circuit falls below the threshold value. | 04-12-2012 |
| 20120086346 | CLOCKED INVERTER, NAND, NOR AND SHIFT REGISTER - In a display device including a substrate, a pixel portion, and a driver circuit having first to ninth transistors and first and second inverters, the various transistors are configured such that one of a source and a drain of the fifth transistor is electrically connected to a gate of the first transistor. In embodiments, the electrical connection may be a direct connection. Additionally, a switch may be provided that is directly connected to an output terminal of the second inverter. | 04-12-2012 |
| 20120086061 | Semiconductor Device - A semiconductor device with a transistor for supplying a current to a pixel comprising an EL element, that can supply an accurate current without the influence of variations even when a small signal current, is provided. A precharge voltage is supplied in advance for the current supply to a pixel and subsequently, the signal writing is completed quickly. The precharge voltage is outputted from a circuit for supplying voltage and current that supplies a current to a current source circuit for supplying a current to the pixel. As the precharge voltage, a gate voltage of a transistor for supplying a current to the current source circuit is supplied to the pixel. Optimum precharge voltage can be supplied in the case where W/L of a transistor in the pixel and W/L of a transistor for supplying current in the circuit for supplying voltage and current are approximately equivalent to each other. | 04-12-2012 |
| 20120086012 | LIQUID CRYSTAL DISPLAY DEVICE - A method of manufacturing, with high mass productivity, liquid crystal display devices having highly reliable thin film transistors with excellent electric characteristics is provided. In a liquid crystal display device having an inverted staggered thin film transistor, the inverted staggered thin film transistor is formed as follows: a gate insulating film is formed over a gate electrode; a microcrystalline semiconductor film which functions as a channel formation region is formed over the gate insulating film; a buffer layer is formed over the microcrystalline semiconductor film; a pair of source and drain regions are formed over the buffer layer; and a pair of source and drain electrodes are formed in contact with the source and drain regions so as to expose a part of the source and drain regions. | 04-12-2012 |
| 20120086006 | SEMICONDUCTOR DEVICE - Techniques are provided for obtaining a photoelectric conversion device having a favorable spectral sensitivity characteristic and reduced variation in output current without a contamination substance mixed into a photoelectric conversion layer or a transistor, and for obtaining a highly reliable semiconductor device including a photoelectric conversion device. A semiconductor device may include, over an insulating surface, a first electrode; a second electrode; a color filter between the first electrode and the second electrode; an overcoat layer covering the color filter; and a photoelectric conversion layer over the overcoat layer, where one end portion of the photoelectric conversion layer is in contact with the first electrode, and where an end portion of the color filter lies inside the other end portion of the photoelectric conversion layer. | 04-12-2012 |
| 20120086005 | PHOTOELECTRIC CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF - A photoelectric conversion device including a single crystal silicon substrate; a first amorphous silicon layer in contact with a surface (a light-receiving surface) of the single crystal silicon substrate; a first polarity (p-type) impurity diffusion layer in contact with the first amorphous silicon layer; a second amorphous silicon layer in contact with a back surface of the single crystal silicon substrate; and a second polarity (n-type) impurity diffusion layer in contact with the second amorphous silicon layer, in which the first and second polarity impurity diffusion layers are microcrystalline silicon layers formed under a deposition condition where a pressure in a reaction chamber is adjusted to be greater than or equal to 450 Pa and less than or equal to 10000 Pa is provided. | 04-12-2012 |
| 20120086000 | THIN FILM ELEMENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME - An object is to provide a method for manufacturing a semiconductor device without exposing a specific layer to moisture or the like at all. A thin film element is manufactured in such a manner that a first film, a second film, and a third film are stacked in this order; a resist mask is formed over the third film; a mask layer is formed by etching the third film with the use of the resist mask; the resist mask is removed; a second layer and a first layer are formed by performing dry etching on the second film and the first film with the use of the mask layer; a fourth film is formed to cover at least the second layer and the first layer; and sidewall layers are formed to cover at least the entire side surfaces of the first layer by performing etch back on the fourth film. | 04-12-2012 |
| 20120085968 | ELECTRODE MATERIAL AND METHOD FOR MANUFACTURING POWER STORAGE DEVICE - To provide a power storage device including an electrode material having a large capacity. First heat treatment is performed on a mixture of a compound containing lithium; a compound containing a metal element selected from manganese, iron, cobalt, and nickel; and a compound containing phosphorus. A cleaning step is performed on the mixture subjected to the first heat treatment. Second heat treatment is performed on the mixture subjected to the cleaning step, so that a lithium phosphate compound is produced. With the use of the lithium phosphate compound, an electrode is formed. | 04-12-2012 |
| 20120085892 | PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR OPERATING THE SAME - In a photoelectric conversion device including a photodiode and a current mirror circuit, a diode-connected transistor is provided in parallel with the photodiode. The transistor serves as a leakage path for rapidly discharging charge stored in the gate capacitance in the current mirror circuit. Thus, the response speed of the photoelectric conversion device is increased, and output of an abnormal value is reduced. | 04-12-2012 |
| 20120083078 | METHOD FOR MANUFACTURING TRANSISTOR - To provide a method for manufacturing a transistor which has little variation in characteristics and favorable electric characteristics. A gate insulating film is formed over a gate electrode; a semiconductor layer including a microcrystalline semiconductor is formed over the gate insulating film; an impurity semiconductor layer is formed over the semiconductor layer; a mask is formed over the impurity semiconductor layer, and then the semiconductor layer and the impurity semiconductor layer are etched with use of the mask to form a semiconductor stacked body; the mask is removed and then the semiconductor stacked body is exposed to plasma generated in an atmosphere containing a rare gas to form a barrier region on a side surface of the semiconductor stacked body; and a wiring over the impurity semiconductor layer of the semiconductor stacked body is formed. | 04-05-2012 |
| 20120081948 | SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - In a conventional DRAM, errors in reading data are likely to occur when the capacitance of a capacitor is reduced. A plurality of cells is connected to one main bit line Each cell includes a sub bit line and 2 to 32 memory cells. Further, each cell includes a selection transistor and a reading transistor, and a sub bit line is connected to a gate of the reading transistor. Since the parasitic capacitance of the sub bit line is sufficiently small, data of electric charge of a capacitor of each memory cell can be amplified without an error in the reading transistor and output to the main bit line. | 04-05-2012 |
| 20120081935 | SEMICONDUCTOR DEVICE - A semiconductor device includes rectifying elements which are connected in series and has a rectifying function from a first input terminal portion to an output terminal portion; a first wiring and a second wiring, which are connected to a second input terminal portion; and a boosting circuit including a plurality of capacitor elements each having a first electrode, an insulating film, and a second electrode and storing a boosted potential. The plurality of capacitor elements includes a capacitor element in which the first electrode and the second electrode are formed using conductive films, and a capacitor element in which at least the second electrode is formed using a semiconductor film. In the plurality of capacitor elements, at least a capacitor element in a first stage is a capacitor element in which the first electrode and the second electrode are formed using conductive films. | 04-05-2012 |
| 20120081909 | ANTI-REFLECTION FILM AND DISPLAY DEVICE - An anti-reflection film that can provide high visibility and has an anti-reflection function by which reflection of incident light from external can be further reduced, and a display device having such an anti-reflection film. A plurality of contiguous pyramidal projections is arranged in a geometric pattern, so that reflection of incident light is prevented. In addition, a protective layer formed of a material having a lower refractive index than the pyramidal projections is provided so as to fill a space between the plurality of pyramidal projections. The plurality of pyramidal projections has a hexagonal shape and can be densely arranged with no space therebetween. Further, since six sides of each pyramidal projection are provided at a different angle from the base, light can be effectively scattered in many directions. | 04-05-2012 |
| 20120081646 | LIQUID CRYSTAL DISPLAY DEVICE - To provide a liquid crystal display device excellent in mechanical reliability, in which gap holding materials are arranged uniformly in a limited pixel, in an active matrix liquid crystal display device including a columnar gap holding material and liquid crystal between two substrates which face each other, at least one of wirings in a thin film transistor includes a non-expanded portion which is connected to any of electrodes of the thin film transistor and a expanded portion having a first region having the same wiring width as the non-expanded portion and a second region in contact with the first region. Further, one side of the columnar gap holding material is in contact with components on the second substrate, and the other side of the columnar gap holding material is in contact with components provided over the first substrate. Furthermore, the columnar gap holding material overlaps with the expanded portion. | 04-05-2012 |
| 20120081186 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME - A semiconductor device includes an antenna circuit for receiving a wireless signal, a power supply circuit generating power by the wireless signal received by the antenna circuit, and a clock generation circuit to which power is supplied. The clock generation circuit includes a ring oscillator which self-oscillates and a frequency divider which adjusts frequency of an output signal of the ring oscillator in an appropriate range. A digital circuit portion is driven by a clock having high frequency accuracy, so that a malfunction such as an incorrect operation or no response is prevented. | 04-05-2012 |
| 20120081089 | POWER SUPPLY CIRCUIT - A power supply circuit includes: an analog/digital converter for converting an analog signal to a digital signal; a pulse width modulation signal control circuit for generating a setting control signal varying in accordance with the difference between a reference voltage and a feedback voltage and a control signal for controlling a pulse width modulation signal, which is based on the digital signal; and a pulse width modulation signal generation circuit for generating the pulse width modulation signal, to which the count signal and the control signal are input, in which the control signal controls the duty cycle of the pulse width modulation signal, and the setting control signal controls the cycle of updating the duty cycle of the pulse width modulation signal. | 04-05-2012 |
| 20120080810 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer. | 04-05-2012 |
| 20120080727 | MICRO ELECTRO MECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF - A micro structure and an electric circuit included in a micro electro mechanical device are manufactured over the same insulating surface in the same step. In the micro electro mechanical device, an electric circuit including a transistor and a micro structure are integrated over a substrate having an insulating surface. The micro structure includes a structural layer having the same stacked-layer structure as a layered product of a gate insulating layer of the transistor and a semiconductor layer provided over the gate insulating layer. That is, the structural layer includes layers formed of the same insulating film as the gate insulating layer and the same semiconductor film as the semiconductor layer of the transistor. Further, the micro structure is manufactured by using each of conductive layers used for a gate electrode, a source electrode, and a drain electrode of the transistor as a sacrificial layer. | 04-05-2012 |
| 20120080714 | LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - The present invention provides a light-emitting device including a light-emitting element over a substrate, the light-emitting element is partitioned from an adjacent light-emitting element by a partition wall, the light-emitting element comprising a first electrode, a layer formed over the first electrode, a light-emitting layer formed over the layer and a second electrode formed over the light-emitting layer, the layer contains an inorganic compound, an organic compound and a halogen atom, the partition wall contains the inorganic compound and the organic compound, and the layer. The light-emitting device provides higher reliability and fewer defects. | 04-05-2012 |
| 20120080685 | Semiconductor Device and Method of Fabricating the Same - An active matrix display device having a pixel structure in which pixel electrodes, gate wirings and source wirings are suitably arranged in the pixel portions to realize a high numerical aperture without increasing the number of masks or the number of steps. The device comprises a gate electrode and a source wiring on an insulating surface, a first insulating layer on the gate electrode and on the source wiring, a semiconductor layer on the first insulating film, a second insulating layer on the semiconductor film, a gate wiring connected to the gate electrode on the second insulating layer, a connection electrode for connecting the source wiring and the semiconductor layer together; and a pixel electrode connected to the semiconductor layer. | 04-05-2012 |
| 20120080682 | METHOD FOR PRODUCING DISPLAY DEVICE - In a liquid crystal display device, a first substrate includes electrical wirings and a semiconductor integrated circuit which has TFTs and is connected electrically to the electrical wirings, and a second substrate includes a transparent conductive film on a surface thereof. A surface of the first substrate that the electrical wirings are formed is opposite to the transparent conductive film on the second substrate. Also, in a liquid crystal display device, a first substrate includes a matrix circuit and a peripheral driver circuit, and a second substrate is opposite to the first substrate. Spacers are provided between the first and second substrates. A seal material is formed outside the matrix circuits and the peripheral driver circuits in the first and second substrates. A protective film is formed on the peripheral driver circuit has substantially a thickness equivalent to an interval between the substrates which is formed by the spacers. | 04-05-2012 |
| 20120080669 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting element having an organic compound, which can be extended its longevity is provided. According to the present invention, there is provided a constitution in which, in order to protect a light emitting element from moisture, an inorganic insulating film | 04-05-2012 |
| 20120077987 | ORGANIC COMPOUND, LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE - A novel substance with which an increase in life and emission efficiency of a light-emitting element can be achieved is provided. A carbazole compound having a structure represented by General Formula (G1) is provided. Note that a substituent which makes the HOMO level and the LUMO level of a compound in which a bond of the substituent is substituted with hydrogen deep and shallow, respectively is used as each of substituents in General Formula (G1) (R | 03-29-2012 |
| 20120077330 | METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE - First etching is performed on a surface of a single crystal semiconductor layer formed with no substrate bias applied. The single crystal semiconductor layer is formed by attaching a single crystal semiconductor substrate including an embrittled region to a supporting substrate so that an oxide layer is sandwiched between the single crystal semiconductor substrate and the supporting substrate and separating the single crystal semiconductor substrate into the single crystal semiconductor layer and part of the single crystal semiconductor substrate at the embrittled region. After the first etching, the single crystal semiconductor layer is irradiated with a laser beam and at least part of the surface of the single crystal semiconductor layer is melted and solidified. Then, second etching is performed on the surface of the single crystal semiconductor layer with no substrate bias applied. | 03-29-2012 |
| 20120075917 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING THE SAME - In a conventional DRAM, when the capacitance of a capacitor is reduced, an error of reading data easily occurs. A plurality of cells are connected to one bit line MBL_m. Each cell includes a sub bit line SBL_n_m and 4 to 64 memory cells (a memory cell CL_n_m | 03-29-2012 |
| 20120075897 | RECTIFIER CIRCUIT AND SEMICONDUCTOR DEVICE USING THE SAME - An object is to provide a rectifier circuit of which the drop in the output voltage by the threshold voltage of a transistor used as a rectifier element is suppressed. Another object is to provide a rectifier circuit whose variations in the output voltage are suppressed even in the case where the amplitude of input AC voltage varies greatly. A transistor may be used as a rectifier element in such a way that a gate electrode of the transistor is connected to a second electrode of the transistor through a capacitor, and the potential of the gate electrode is held to be higher than the potential of the second electrode by a difference greater than or equal to the threshold voltage. | 03-29-2012 |
| 20120075007 | REFERENCE CURRENT GENERATING CIRCUIT, REFERENCE VOLTAGE GENERATING CIRCUIT, AND TEMPERATURE DETECTION CIRCUIT - A reference current generating circuit with high current mirror accuracy is provided by low power supply voltage operation. The reference current generating circuit includes a cascode current mirror circuit | 03-29-2012 |
| 20120074985 | SEMICONDUCTOR DEVICE - In the case where data is rewritten in a delay period of a signal in a flip flop and a shift register which use an inverted clock signal, current inhibiting charging may flow, whereby data cannot written quickly, so that charging is not completed, which makes operation unstable. In view of the above, a flip flop and a shift register without using an inverted clock signal, which have high stability are provided. Current inhibiting charging of a node where that current inhibiting charging flows is cut off at the time of rewriting data so that data is rewritten quickly. | 03-29-2012 |
| 20120074481 | SECURITIES, CHIP MOUNTING PRODUCT, AND MANUFACTURING METHOD THEREOF - The invention provides an ID chip with reduced cost, increased impact resistance and attractive design, as well as products and the like mounting the ID chip and a manufacturing method thereof. In view of the foregoing, an integrated circuit having a semiconductor film with a thickness of 0.2 μm or less is mounted on securities including bills, belongings, containers of food and drink, and the like (hereinafter referred to as products and the like). The ID chip of the invention can be reduced in cost and increased in impact resistance as compared with a chip formed over a silicon wafer while maintaining an attractive design. | 03-29-2012 |
| 20120074419 | LIGHT EMITTING DEVICE AND ELECTRONIC EQUIPMENT - A display device capable of keeping the luminance constant irrespective of temperature change is provided as well as a method of driving the display device. A current mirror circuit composed of transistors is placed in each pixel. A first transistor and a second transistor of the current mirror circuit are connected such that the drain current of the first transistor is kept in proportion to the drain current of the second transistor irrespective of the load resistance value. The drain current of the first transistor is controlled by a driving circuit in accordance with a video signal and the drain current of the second transistor is caused to flow into an OLED, thereby controlling the OLED drive current and the luminance of the OLED. | 03-29-2012 |
| 20120074418 | SEMICONDUCTOR DEVICE - NTFT of the present invention has a channel forming region, n-type first, second, and third impurity regions in a semiconductor layer. The second impurity region is a low concentration impurity region that overlaps a tapered potion of a gate electrode with a gate insulating film interposed therebetween, and the impurity concentration of the second impurity region increases gradually from the channel forming region to the first impurity region. And, the third impurity region is a low concentration impurity region that does not overlap the gate electrode. Moreover, a plurality of NTFTs on the same substrate have different second impurity region lengths, respectively, according to difference of the operating voltages. That is, when the operating voltage of the second TFT is higher than the operating voltage of the first TFT, the length of the second impurity region is longer on the second TFT than on the first TFT. | 03-29-2012 |
| 20120074407 | Semiconductor device and method for manufacturing the same - An object is to provide a semiconductor device having a novel structure in which a transistor including an oxide semiconductor and a transistor including a semiconductor material other than an oxide semiconductor are stacked. The semiconductor device includes a first transistor, an insulating layer over the first transistor, and a second transistor over the insulating layer. In the semiconductor device, the first transistor includes a first channel formation region, the second transistor includes a second channel formation region, the first channel formation region includes a semiconductor material different from a semiconductor material of the second channel formation region, and the insulating layer includes a surface whose root-mean-square surface roughness is less than or equal to 1 nm. | 03-29-2012 |
| 20120073984 | METHOD FOR RECOVERING METALLIC LITHIUM - An object is to recover metallic lithium from metallic lithium on which an unnecessary substance is formed without discarding the metallic lithium on which an unnecessary substance is formed. The present invention relates to a method for recovering metallic lithium in such a manner that metallic lithium on which a substance is formed is reacted with nitrogen to form lithium nitride; the lithium nitride is reacted with carbon dioxide to form lithium carbonate; the lithium carbonate is reacted with hydrochloric acid to form lithium chloride; the lithium chloride and potassium chloride are melted; and electrolysis is applied to the melted lithium chloride and potassium chloride. | 03-29-2012 |
| 20120073627 | SOLAR CELL MODULE - A solar cell module that is prevented from being damaged by the wind and can be installed at low cost is provided. The solar cell module includes a supporting substrate, a plurality of first cells, and a plurality of second cells. The first cell is disposed so as to form an angle a between the first cell and the supporting substrate. The second cell is disposed so as to form an angle b between the second cell and the first cell and so as to form the angle a+the angle b between the second cell and the supporting substrate. A light-receiving surface of the first cell and a light-receiving surface of the second cell face each other. The module can be installed substantially horizontally to the level ground without impairing power generation capability. | 03-29-2012 |
| 20120070919 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THEREOF, AND METHOD OF MANUFACTURING BASE MATERIAL - It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate element characteristics, and a method of manufacturing thereof. A protective film having superior gas barrier properties (which is a protective film that is likely to damage an element if the protective film is formed on the element directly) is previously formed on a heat-resistant substrate other than a substrate with the element formed thereon. The protective film is peeled off from the heat-resistant substrate, and transferred over the substrate with the element formed thereon so as to seal the element. | 03-22-2012 |
| 20120070738 | NEEDLE-LIKE MICROSTRUCTURE AND DEVICE HAVING NEEDLE-LIKE MICROSTRUCTURE - A needle-like structure of silicon is provided. A crystalline silicon region is formed over a metal substrate by an LPCVD method, whereby whisker-like crystalline silicon which is a polycrystalline body and grows in the < | 03-22-2012 |
| 20120069637 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE - An object is to provide a semiconductor memory device which holds data of an SRAM or a flip-flop circuit and holds data in the SRAM while electric power is not supplied from a reader or electric power is not enough, without changing a battery for driving a power supply corresponding to deterioration of the battery with time, and a semiconductor device provided with the semiconductor memory device. An SRAM cell, a decoder connected to the SRAM cell through a word line, a read/write circuit connected to the SRAM cell through the data line, and a power storage unit connected to the SRAM cell are provided. The power storage unit is charged when data is written to or read from the SRAM cell through the data line. | 03-22-2012 |
| 20120069634 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR INSPECTING THE SAME - When the threshold voltage V | 03-22-2012 |
| 20120068915 | LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS - To solve degradation with time of a light emitting element by a new method. When the potential of an electrode of a monitor pixel is sampled and fed back to a light emitting pixel, degradation with time of a light emitting element can be corrected. In addition, when a writing period is divided into a plurality of periods during which a plurality of rows are selected, a gray scale can be expressed by a weighted light emitting period. That is to say, a light emitting device of the invention has a plurality of monitoring light emitting elements, a monitor line for monitoring changes in the potentials of electrodes of the plurality of light emitting elements, and a means for preventing, when any one of the plurality of monitoring light emitting elements is short-circuited, a current from flowing to the short-circuited monitoring light emitting element through the monitor line. | 03-22-2012 |
| 20120068271 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - After forming a semiconductor film over a substrate, a Ni film is deposited over the semiconductor film while heating the substrate, thereby forming Ni silicide on the semiconductor film. Alternatively, after forming a semiconductor film over a substrate, a Ni film is deposited over the semiconductor film while heating the substrate up to 450° C. or higher, thereby forming Ni silicide on the semiconductor film. Alternatively, after forming a semiconductor film over a substrate, a Ni film is deposited with a thickness of 10 nm or more over the semiconductor film while heating the substrate to 450° C. or higher, thereby forming Ni silicide on the semiconductor film. Alternatively, after forming a semiconductor film over a substrate, and removing an oxide film on the semiconductor film, a Ni film is deposited over the semiconductor film while heating the substrate up to 450° C. or higher, thereby forming Ni silicide on the semiconductor film. | 03-22-2012 |
| 20120068266 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor having low leak current and high mobility are obtained in the same time in a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter. | 03-22-2012 |
| 20120068183 | POWER-INSULATED-GATE FIELD-EFFECT TRANSISTOR - To provide a power MISFET using oxide semiconductor. A gate electrode, a source electrode, and a drain electrode are formed so as to interpose a semiconductor layer therebetween, and a region of the semiconductor layer where the gate electrode and the drain electrode do not overlap with each other is provided between the gate electrode and the drain electrode. The length of the region is from 0.5 μm to 5 μm. In such a power MISFET, a power source of 100 V or higher and a load are connected in series between the drain electrode and the source electrode, and a control signal is input to the gate electrode. | 03-22-2012 |
| 20120068181 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE - An object of the present invention is to provide a structure of a thin film circuit portion and a method for manufacturing a thin film circuit portion by which an electrode for connecting to an external portion can be easily formed under a thin film circuit. A stacked body including a first insulating film, a thin film circuit formed over one surface of the first insulating film, a second insulating film formed over the thin film circuit, an electrode formed over the second insulating film, and a resin film formed over the electrode, is formed. A conductive film is formed adjacent to the other surface of the first insulating film of the stacked body to be overlapped with the electrode. The conductive film is irradiated with a laser. | 03-22-2012 |
| 20120068173 | LIQUID CRYSTAL DISPLAY DEVICE - A first transistor, a second transistor, a third transistor, a fourth transistor are provided. In the first transistor, a first terminal is electrically connected to a first wiring; a second terminal is electrically connected to a gate terminal of the second transistor; a gate terminal is electrically connected to a fifth wiring. In the second transistor, a first terminal is electrically connected to a third wiring; a second terminal is electrically connected to a sixth wiring. In the third transistor, a first terminal is electrically connected to a second wiring; a second terminal is electrically connected to the gate terminal of the second transistor; a gate terminal is electrically connected to a fourth wiring. In the fourth transistor, a first terminal is electrically connected to the second wiring; a second terminal is electrically connected to the sixth wiring; a gate terminal is connected to the fourth wiring. | 03-22-2012 |
| 20120064729 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An object of the present invention is to increase adhesiveness between thin films, particularly a high molecular film formed on an insulating surface, and the present invention provides a semiconductor device with high reliability and a method for manufacturing the semiconductor device with high yield. A semiconductor device of the present invention comprises a laminate structure formed in close contact with an organic insulating film on a hydrophobic surface of an inorganic insulating film including silicon and nitrogen. A film having the hydrophobic surface is an insulating film having a contact angle of water of equal to or more than 30°, preferably of equal to or more than 40°. | 03-15-2012 |
| 20120064703 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - An object is to provide a technique by which a semiconductor device including a high-performance and high-reliable transistor is manufactured. A protective conductive film which protects an oxide semiconductor layer when a wiring layer is formed from a conductive layer is formed between the oxide semiconductor layer and the conductive layer, and an etching process having two steps is performed. In a first etching step, an etching is performed under conditions that the protective conductive film is less etched than the conductive layer and the etching selectivity of the conductive layer to the protective conductive film is high. In a second etching step, etching is performed under conditions that the protective conductive film is more easily etched than the oxide semiconductor layer and the etching selectivity of the protective conductive film to the oxide semiconductor layer is high. | 03-15-2012 |
| 20120064677 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device with fewer masks and in a simple process. A gate electrode is formed. A gate insulating film, a semiconductor film, an impurity semiconductor film, and a conductive film are stacked in this order, covering the gate electrode. A source electrode and a drain electrode are formed by processing the conductive film. A source region, a drain region, and a semiconductor layer, an upper part of a portion of which does not overlap with the source region and the drain region is removed, are formed by processing the upper part of the semiconductor film, while the impurity semiconductor film is divided. A passivation film over the gate insulating film, the semiconductor layer, the source region, the drain region, the source electrode, and the drain electrode are formed. An etching mask is formed over the passivation film. At least the passivation film and the semiconductor layer are processed to have an island shape while an opening reaching the source electrode or the drain electrode is formed, with the use of the etching mask. The etching mask is removed. A pixel electrode is formed over the gate insulating film and the passivation film. | 03-15-2012 |
| 20120064665 | DEPOSITION APPARATUS, APPARATUS FOR SUCCESSIVE DEPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An oxide semiconductor layer is formed with a deposition apparatus including a transfer mechanism for a substrate, a first deposition chamber in which an oxide semiconductor is deposited, and a first heating chamber in which first heat treatment is performed. The first deposition chamber and the first heating chamber are sequentially provided along a path of the substrate transferred by the transfer mechanism. The substrate is held so that an angle formed by a deposition surface of the substrate and the vertical direction is in a range of greater than or equal to 1° and less than or equal to 30°. Without exposure to the air, the first heat treatment can be performed after a first film is formed over the substrate. | 03-15-2012 |
| 20120064664 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to manufacture a semiconductor device including an oxide semiconductor film, which has stable electric characteristics and high reliability. A crystalline oxide semiconductor film is formed, without performing a plurality of steps, as follows: by utilizing a difference in atomic weight of plural kinds of atoms included in an oxide semiconductor target, zinc with low atomic weight is preferentially deposited on an oxide insulating film to form a seed crystal including zinc; and tin, indium, or the like with high atomic weight is deposited on the seed crystal while causing crystal growth. Further, a crystalline oxide semiconductor film is formed by causing crystal growth using a seed crystal with a hexagonal crystal structure including zinc as a nucleus, whereby a single crystal oxide semiconductor film or a substantially single crystal oxide semiconductor film is formed. | 03-15-2012 |
| 20120064650 | MANUFACTURING METHOD OF THIN FILM TRANSISTOR AND LIQUID CRYSTAL DISPLAY DEVICE - Etching of a semiconductor layer including a part over a gate wiring and formation of a contact hole for connection between a pixel electrode and a drain electrode are performed by one-time photolithography step and one-time etching step; thus, the number of photolithography steps is reduced. The exposed part of the gate wiring is covered by an insulating layer, and this insulating layer also functions as a spacer for maintaining a space for a liquid crystal layer. By the reduction in the number of photolithography steps, a liquid crystal display device can be provided at lower cost and higher productivity. Using an oxide semiconductor for the semiconductor layer can realize a liquid crystal display device with low power consumption and high reliability. | 03-15-2012 |
| 20120064648 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME - It is an object of the present invention to provide a method for manufacturing a display device in which unevenness generated under a light-emitting element does not impart an adverse effect on the light-emitting element. It is another object of the invention to provide a method for manufacturing a display device in which penetration of water into the inside of the display device through a film having high moisture permeability can be suppressed without increasing processing steps considerably. A display device of the present invention comprises a thin film transistor and a light-emitting element, the light-emitting element including a light-emitting laminated body interposed between a first electrode and a second electrode; wherein the first electrode is formed over an insulating film formed over the thin film transistor; and wherein a planarizing film is formed in response to the first electrode between the first electrode and the insulating film. | 03-15-2012 |
| 20120063209 | MEMORY DEVICE AND SEMICONDUCTOR DEVICE - An object of one embodiment of the present invention is to propose a memory device in which a period in which data is held is ensured and memory capacity per unit area can be increased. In the memory device of one embodiment of the present invention, bit lines are divided into groups, and word lines are also divided into groups. The word lines assigned to one group are connected to the memory cell connected to the bit lines assigned to the one group. Further, the driving of each group of bit lines is controlled by a dedicated bit line driver circuit of a plurality of bit line driver circuits. In addition, cell arrays are formed on a driver circuit including the above plurality of bit line driver circuits and a word line driver circuit. The driver circuit and the cell arrays overlap each other. | 03-15-2012 |
| 20120063208 | MEMORY DEVICE - In a memory device, memory capacity per unit area is increased while a period in which data is held is ensured. The memory device includes a driver circuit provided over a substrate, and a plurality of memory cell arrays which are provided over the driver circuit and driven by the driver circuit. Each of the plurality of memory cell arrays includes a plurality of memory cells. Each of the plurality of memory cells includes a first transistor including a first gate electrode overlapping with an oxide semiconductor layer, and a capacitor including a source electrode or a drain electrode, a first gate insulating layer, and a conductive layer. The plurality of memory cell arrays is stacked to overlap. Thus, in the memory device, memory capacity per unit area is increased while a period in which data is held is ensured. | 03-15-2012 |
| 20120063207 | SEMICONDUCTOR DEVICE - An object of one embodiment of the present invention is to miniaturize a semiconductor device. Another object of one embodiment of the present invention is to reduce the area of a driver circuit of a semiconductor device including a memory element. A plurality of cells in which the positions of input terminals and output terminals are fixed is arranged in a first direction, wirings each of which is electrically connected to the input terminal or the output terminal of each cell are stacked over the plurality of cells, and the wirings extend in the same direction as the first direction in which the cells are arranged; thus, a semiconductor device in which a driver circuit is miniaturized is provided. | 03-15-2012 |
| 20120063206 | SEMICONDUCTOR MEMORY DEVICE - An object is to provide a semiconductor memory device capable of copying memory data without using an external circuit. The semiconductor memory device includes a bit line to which first terminals of a plurality of memory cells are connected in common; a pre-charge circuit which is connected to the bit line and pre-charges the bit line with a specific potential in data reading; a data holding circuit comprising a capacitor which temporarily holds data read out from the memory cell or data which is written to the memory cell; and an inverted data output circuit which outputs inverted data of data held in the data holding circuit to the bit line. The inverted data output circuit includes a means for controlling output of inverted data of data held in the data holding circuit. | 03-15-2012 |
| 20120063205 | SEMICONDUCTOR DEVICE - A semiconductor device in which stored data can be held even when power is not supplied and there is no limitation on the number of writing operations is provided. A semiconductor device is formed using a material which can sufficiently reduce the off-state current of a transistor, such as an oxide semiconductor material that is a wide-gap semiconductor. When a semiconductor material which can sufficiently reduce the off-state current of a transistor is used, the semiconductor device can hold data for a long period. In addition, by providing a capacitor or a noise removal circuit electrically connected to a write word line, a signal such as a short pulse or a noise input to a memory cell can be reduced or removed. Accordingly, a malfunction in which data written into the memory cell is erased when a transistor in the memory cell is instantaneously turned on can be prevented. | 03-15-2012 |
| 20120063204 | SEMICONDUCTOR DEVICE - One object is to provide a novel semiconductor device which can hold stored data even when not powered and which has an unlimited number of writing operations. Another object is to reduce a circuit size and to improve reliability of writing and reading of data. When a memory cell using a transistor including an oxide semiconductor layer is subjected to the verification operation and reading of data, a dual-gate transistor showing different threshold voltages is used as a resistor; thus, stable verification operation and reading operation can be performed by only a reference potential circuit. | 03-15-2012 |
| 20120063203 | DRIVING METHOD OF SEMICONDUCTOR DEVICE - A driving method of a semiconductor device is provided. In a semiconductor device including a bit line, a selection line, a selection transistor, m (m is a natural number greater than or equal to 2) writing word lines, m reading word lines, a source line, and first to m-th memory cells, each memory cell includes a first transistor and a second transistor that holds charge accumulated in a capacitor. The second transistor includes a channel formed in an oxide semiconductor layer. In a driving method of a semiconductor device having the above structure, when writing to a memory cell is performed, the first transistor is turned on so that a first source terminal or a first drain terminal is set to a fixed potential; thus, a potential is stably written to the capacitor. | 03-15-2012 |
| 20120062814 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - Provided is a method to manufacture a liquid crystal display device in which a contact hole for the electrical connection of the pixel electrode and one of the source and drain electrode of a transistor and a contact hole for the processing of a semiconductor layer are formed simultaneously. The method contributes to the reduction of a photography step. The transistor includes an oxide semiconductor layer where a channel formation region is formed. | 03-15-2012 |
| 20120062813 | TRANSISTOR, LIQUID CRYSTAL DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF - Photolithography and etching steps for forming an island-shaped semiconductor layer are omitted, and a liquid crystal display device is manufactured with four photolithography steps: a step of forming a gate electrode (including a wiring formed using the same layer as the gate electrode), a step of forming source and drain electrodes (including a wiring formed using the same layer as the source and drain electrodes), a step of forming a contact hole (including the removal of an insulating layer and the like in a region other than the contact hole), and a step of forming a pixel electrode (including a wiring formed using the same layer as the pixel electrode). By the reduction in the number of photolithography steps, a liquid crystal display device can be provided at low cost and high productivity. Formation of a parasitic channel is prevented by an improvement in shape and potential of a wiring. | 03-15-2012 |
| 20120062811 | LIQUID CRYSTAL DISPLAY DEVICE - An object of the present invention is to provide a liquid crystal display device which allows a desirable storage capacitor to be ensured in a pixel without decreasing the aperture ratio in response to changes in frame frequency. In a liquid crystal display device including a pixel transistor and two capacitive elements using an oxide semiconductor material in each pixel, one of the capacitive elements comprises a light-transmitting material to improve the aperture ratio of the pixel. Furthermore, through the use of characteristics of the light-transmitting capacitive element, the size of the storage capacitor in the pixel is varied by adjusting the voltage value of a capacitance value in response to the frame frequency varied depending on images displayed. | 03-15-2012 |
| 20120062809 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - There is disclosed a semiconductor device and a method of fabricating the semiconductor device in which a heat treatment time required for crystal growth is shortened and a process is simplified. Two catalytic element introduction regions are arranged at both sides of one active layer and crystallization is made. A boundary portion where crystal growth from one catalytic element introduction region meets crystal growth from the other catalytic element introduction region is formed in a region which becomes a source region or drain region. | 03-15-2012 |
| 20120062614 | METHOD FOR DRIVING LIQUID CRYSTAL DISPLAY DEVICE - The image quality of a liquid crystal display device that can display stereoscopic images is improved without the decrease in resolution. In a method for driving a liquid crystal display device that displays stereoscopic images by a wavelength division method, a first image seen with left eye and a second image seen with right eye are displayed using R, G, and B whose wavelength bands are different from each other by a field-sequential method. In the field-sequential method, writing of video signals and lighting of a backlight are sequentially performed not in the entire pixel portion but in each given region of the pixel portion. | 03-15-2012 |
| 20120062612 | DISPLAY DEVICE AND ELECTRONIC APPARATUS - The invention provides a display device and an electronic apparatus which can reduce power consumption in the case of being driven by using a digital time grayscale method. According to the invention, a row in which all the pixels display black is focused on in a plurality of pixels arranged in matrix, and sampling of data which is to be inputted to the pixels arranged in the row is not performed. Then, in a period during which the data sampling is not performed, the operation of a shift register in a source driver and, sampling operation of a video signal in a first latch circuit are stopped. The invention which has the aforementioned characteristics can temporally stop operation of the source driver to reduce power consumption. In particular, the invention can stop operation of the source driver which consumes much power in the display device, leading to dramatic reduction in power consumption. | 03-15-2012 |
| 20120062538 | EL DISPLAY DEVICE, DRIVING METHOD OF EL DISPLAY DEVICE, AND ELECTRONIC DEVICE - The present invention relates to an EL display device in which a stereoscopic image is perceived and eyeglasses having a switching means with which an image for a left eye or an image for a right eye is selectively perceived. The image for the left eye and the image for the right eye are displayed in a display portion of the EL display device by holding an image signal from a signal line in a first capacitor in a first period, holding the image signal held in the first capacitor in a second capacitor to control current that flows through an emission-control transistor in a second period, and turning on a driving transistor to control light emission of a light-emitting element and holding an image signal from a signal line in the first capacitor in a third period. | 03-15-2012 |
| 20120062529 | DISPLAY DEVICE - Provided is to secure a data-writing period to a source line and reduce the number of the IC chips used. N image data (e.g., three image data, RGB) are sequentially input to one input terminal. Three switches, three first memory elements, three transfer switches, three second memory elements, and three buffers are connected in parallel to the input terminal. The three switches are turned on respectively. RGB image data are held in the three respective first memory elements. In a selection period of a gate line of an (m−1)-th row, image data of an m-th row are written to the first memory elements. When the three transfer switches are turned on in a selection period of a gate line of an m-th row, the image data are transferred to and held in the second memory elements. Then, the image data are output to each source line through each buffer. | 03-15-2012 |
| 20120062528 | SEMICONDUCTOR DEVICE - A semiconductor device where delay or distortion of a signal output to a gate signal line in a selection period is reduced is provided. The semiconductor device includes a gate signal line, a first and second gate driver circuits which output a selection signal and a non-selection signal to the gate signal line, and pixels electrically connected to the gate signal line and supplied with the two signals. In a period during which the gate signal line is selected, both the first and second gate driver circuits output the selection signal to the gate signal line. In a period during which the gate signal line is not selected, one of the first and second gate driver circuits outputs the non-selection signal to the gate signal line, and the other gate driver circuit outputs neither the selection signal nor the non-selection signal to the gate signal line. | 03-15-2012 |
| 20120062315 | PLL CIRCUIT AND SEMICONDUCTOR DEVICE HAVING THE SAME - A PLL circuit includes a phase detector, a loop filter (LF), a voltage-controlled oscillator (VCO), and a frequency divider. The phase detector compares a phase of a signal Fs which is input from outside with a phase of a signal Fo/N which is input from the frequency divider. The loop filter generates a signal Vin by removing alternating current components from a signal input from the phase detector. The voltage-controlled oscillator outputs a signal Fo based on the signal Vin input from the loop filter. The frequency divider converts the signal Fo output from the voltage-controlled oscillator into Fo/N (frequency division by N), and outputs it to the phase detector. | 03-15-2012 |
| 20120062267 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR INSPECTING THE SAME - A potential of a gate of the transistor of the memory cell is held at a predetermined potential VGM which is between a potential VGL used in normal holding and a threshold of the transistor Vth. When the potential is held for a predetermined period, the memory cell becomes in a similar state in which the memory cell is held at a potential VGL in 10 years. A memory cell, which does not hold data sufficiently at this time, can be judged not to hold data for 10 years in normal use. | 03-15-2012 |
| 20120062240 | CURRENT DETECTION CIRCUIT - An object is to widen detection range of current. A current detection circuit includes a first resistor, which is connected to a first connection terminal and a second connection terminal; a second resistor, which is connected to the first resistor; a third resistor, which is connected to the first resistor; a first transistor, a source of which is connected to the second resistor; a second transistor, a source of which is connected to the third resistor, and a drain and a gate of which is connected to a gate of the first transistor; a third transistor, a source of which is connected to the source of the second transistor, and a gate of which is connected to the drain of the first transistor; and a fourth resistor, which is connected to the drain of the third transistor, and to which a voltage is input. | 03-15-2012 |
| 20120062174 | POWER RECEIVING DEVICE AND WIRELESS POWER FEED SYSTEM - An electric field coupling type wireless power feed system including a power transmitting device and a power receiving device which is unlikely to be affected by a noise and which has a reduced size is provided. A capacitive coupling type wireless power feed system includes a power receiving device including a first electrode using an oxide semiconductor film, and a battery and a power transmitting device including a second electrode, wherein the battery is charged by a voltage generated based on an electric field generated between the first electrode and the second electrode. The charging of the battery may be stopped by applying a positive direct-current voltage from a charge control circuit to the first electrode. | 03-15-2012 |
| 20120062039 | POWER FEEDING DEVICE, WIRELESS POWER FEEDING SYSTEM USING THE SAME AND WIRELESS POWER FEEDING METHOD - An object is to provide a power feeding device, a power feeding system, and a power feeding method which are more convenient for a power feeding user at the power receiving end. The power feeding device includes a means of controlling a frequency of a power signal transmitted to a power receiver, based on a proportion of signals, among power signals output to an antenna circuit, that return from the power receiver to the antenna circuit without feeding power to the power receiver. | 03-15-2012 |
| 20120061841 | SEMICONDUCTOR INTEGRATED CIRCUIT, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE USING SEMICONDUCTOR INTEGRATED CIRCUIT - A step of forming a through hole in a semiconductor substrate, or a step of polishing the semiconductor substrate from its back surface requires a very long time and causes decrease of productivity. In addition, when semiconductor substrates are stacked, a semiconductor integrated circuit which is formed of the stack is thick and has poor mechanical flexibility. A release layer is formed over each of a plurality of substrates, layers each having a semiconductor element and an opening for forming a through wiring are formed over each of the release layers. Then, layers each having the semiconductor element are peeled off from the substrates, and then overlapped and stacked, a conductive layer is formed in the opening, and the through wiring is formed; thus, a semiconductor integrated circuit is formed. | 03-15-2012 |
| 20120061677 | SEMICONDUCTOR DEVICE - To provide a semiconductor device including a transistor formed using a highly reliable oxide semiconductor. To provide a semiconductor device which can be manufactured with high productivity and high yield by reducing the number of photolithography steps. The semiconductor device includes a first wiring, a second wiring, and a third wiring whose potential is lower than those of the first wiring and the second wiring between the first wiring and the second wiring. In the semiconductor device, the first wiring is electrically connected to the third wiring through a first transistor in which a gate electrode layer is electrically connected to a source electrode layer, the second wiring is electrically connected to the third wiring through a second transistor in which the gate electrode layer is electrically connected to the source electrode layer, and a continuous oxide semiconductor film used for a semiconductor region of the first transistor and the second transistor is provided above or below the first wiring, the second wiring, and the third wiring. | 03-15-2012 |
| 20120061676 | THIN FILM TRANSISTOR - A highly reliable transistor in which change in electrical characteristics is suppressed is provided. A highly reliable transistor in which change in electrical characteristics is suppressed is manufactured with high productivity. A display device with less image deterioration over time is provided. An inverted staggered thin film transistor which includes, between a gate insulating film and impurity semiconductor films functioning as source and drain regions, a semiconductor stacked body including a microcrystalline semiconductor region and a pair of amorphous semiconductor regions. In the microcrystalline semiconductor region, the nitrogen concentration on the gate insulating film side is low and the nitrogen concentration in a region in contact with the amorphous semiconductor is high. Further, an interface with the amorphous semiconductor has unevenness. | 03-15-2012 |
| 20120061673 | METHOD FOR MANUFACTURING LIGHT-EMITTING DISPLAY DEVICE - It is an object of one embodiment of the present invention to manufacture a light-emitting display device by simplifying a manufacturing process of a transistor, without an increase in the number of steps as well as the number of photomasks as compared to those in the conventional case. A step for processing a semiconductor layer into an island shape is omitted by using a high-resistance oxide semiconductor which is intrinsic or substantially intrinsic for the semiconductor layer, used to form transistors. Formation of an opening in the semiconductor layer or an insulating layer formed over the semiconductor layer and etching of an unnecessary portion of the semiconductor layer are performed at the same time; thus, the number of photolithography steps is reduced. | 03-15-2012 |
| 20120061671 | SEMICONDUCTOR DEVICE AND LIGHT-EMITTING DEVICE - To provide a highly reliable semiconductor device including an oxide semiconductor. Further to provide a highly reliable light-emitting device including an oxide semiconductor. A second electrode sealed together with a semiconductor element including an oxide semiconductor hardly becomes inactive. A hydrogen ion and/or a hydrogen molecule produced by reaction of the active second electrode with moisture remaining in the semiconductor device and/or moisture entering from the outside of the device increase the carrier concentration in the oxide semiconductor, which causes a reduction in the reliability of the semiconductor device. An adsorption layer of a hydrogen ion and/or a hydrogen molecule may be provided on the other surface side of the second electrode having one surface in contact with the organic layer. Further, an opening which a hydrogen ion and/or a hydrogen molecule passes through may be provided for the second electrode. | 03-15-2012 |
| 20120061670 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Described is a method for manufacturing a semiconductor device. A mask is formed over an insulating film and the mask is reduced in size. An insulating film having a projection is formed using the mask reduced in size, and a transistor whose channel length is reduced is formed using the insulating film having a projection. Further, in manufacturing the transistor, a planarization process is performed on a surface of a gate insulating film which overlaps with a top surface of a fine projection. Thus, the transistor can operate at high speed and the reliability can be improved. In addition, the insulating film is processed into a shape having a projection, whereby a source electrode and a drain electrode can be formed in a self-aligned manner. | 03-15-2012 |
| 20120061668 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an IC chip including a driver circuit for driving of the gate and signal lines by bonding or the like. A pixel portion and a driver circuit for driving the pixel portion are provided over the same substrate, and at least part of the driver circuit includes a thin film transistor using an oxide semiconductor interposed between gate electrodes provided above and below the oxide semiconductor. Therefore, when the pixel portion and the driver portion are provided over the same substrate, manufacturing cost can be reduced. | 03-15-2012 |
| 20120061666 | SEMICONDUCTOR DEVICE AND DISPLAY DEVICE - A semiconductor device including a first gate electrode and a second gate electrode formed apart from each other over an insulating surface, an oxide semiconductor film including a region overlapping with the first gate electrode with a gate insulating film interposed therebetween, a region overlapping with the second gate electrode with the gate insulating film interposed therebetween, and a region overlapping with neither the first gate electrode nor the second gate electrode, and an insulating film covering the gate insulating film, the first gate electrode, the second gate electrode, and the oxide semiconductor film, and being in direct contact with the oxide semiconductor film is provided. | 03-15-2012 |
| 20120061665 | LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A photolithography step and an etching step for forming an island-shaped semiconductor layer is omitted, and a liquid crystal display device is manufactured through the following four photolithography steps: a step for forming a gate electrode (including a wiring or the like formed from the same layer), a step for forming a source electrode and a drain electrode (including a wiring or the like formed from the same layer), a step for forming a contact hole (including removal of an insulating layer or the like in a region other than the contact hole), and a step for forming a pixel electrode (including a wiring or the like formed from the same layer). In the step of forming the contact hole, a groove portion in which the semiconductor layer is removed is formed, so that formation of parasitic channels is prevented. | 03-15-2012 |
| 20120061664 | LIGHT-EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - Provided is a method to manufacture a light-emitting display device in which a contact hole for the electrical connection of the pixel electrode and one of the source and drain electrode of a transistor and a contact hole for the processing of a semiconductor layer are formed simultaneously. The method contributes to the reduction of a photography step. The transistor includes an oxide semiconductor layer where a channel formation region is formed. | 03-15-2012 |
| 20120061663 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al | 03-15-2012 |
| 20120061662 | SEMICONDUCTOR DEVICE, POWER DIODE, AND RECTIFIER - An object is to provide a semiconductor device having electrical characteristics such as high withstand voltage, low reverse saturation current, and high on-state current. In particular, an object is to provide a power diode and a rectifier which include non-linear elements. An embodiment of the present invention is a semiconductor device including a first electrode, a gate insulating layer covering the first electrode, an oxide semiconductor layer in contact with the gate insulating layer and overlapping with the first electrode, a pair of second electrodes covering end portions of the oxide semiconductor layer, an insulating layer covering the pair of second electrodes and the oxide semiconductor layer, and a third electrode in contact with the insulating layer and between the pair of second electrodes. The pair of second electrodes are in contact with end surfaces of the oxide semiconductor layer. | 03-15-2012 |
| 20120061655 | LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND ELECTRONIC DEVICE - One feature of the present invention is to provide a buffer layer made of a composite material for a light emitting element including aromatic hydrocarbon containing at least one vinyl skeleton and metal oxide in part of a light emitting substance containing layer, in the light emitting element formed by interposing the light emitting substance containing layer between a pair of electrodes. The composite material for a light emitting element for forming the buffer layer of the present invention has high conductivity and is superior in transparency. | 03-15-2012 |
| 20120061652 | SEMICONDUCTOR DEVICE AND LIGHT-EMITTING DEVICE, AND MANUFACTUIRNG METHOD THEREOF - In a semiconductor device including an organic layer containing a light-emitting substance between a first electrode connected to a source or drain electrode layer of an enhancement-type transistor that has a channel formation region using an oxide semiconductor and a second electrode overlapped with the first electrode, an active, electrically conductive material which produces a hydrogen ion or a hydrogen molecule by reducing an impurity including a hydrogen atom (e.g., moisture) is excluded from the second electrode. The semiconductor device including an oxide semiconductor is formed using especially an inert, electrically conductive material which hardly causes production a hydrogen ion or a hydrogen molecule by reacting with water. Specifically, the semiconductor device is formed using any of a metal, an alloy of metals, and a metal oxide each having a higher oxidation-reduction potential than the standard hydrogen electrode. | 03-15-2012 |
| 20120060750 | METHOD OF FORMING CRYSTALLINE OXIDE SEMICONDUCTOR FILM - An oxide semiconductor film with excellent crystallinity is formed. At the time when an oxide semiconductor film is formed, as a substrate is heated to a temperature of higher than or equal to a first temperature and lower than a second temperature, a part of the substrate having a typical length of 1 nm to 1 μm is heated to a temperature higher than or equal to the second temperature. Here, the first temperature means a temperature at which crystallization occurs with some stimulation, and the second temperature means a temperature at which crystallization occurs spontaneously without any stimulation. Further, the typical length is defined as the square root of a value obtained in such a manner that the area of the part is divided by the circular constant. | 03-15-2012 |
| 20120058612 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In the method for manufacturing a semiconductor device of the invention, a bonding layer is formed over a substrate, an insulating film and a storage capacitor portion lower electrode are formed over the bonding layer, a single crystal silicon layer is formed over the insulating film, a storage capacitor portion insulating film is formed over the storage capacitor portion lower electrode, a wiring is formed over the storage capacitor portion insulating film, a channel forming region and a low concentration impurity region are formed over the single crystal silicon layer, and a gate insulating film and a gate electrode are formed over the single crystal silicon layer. The storage capacitor portion insulating film is formed by depositing a YSZ film with a single crystal silicon layer used as a base film, whereby the permittivity increases and thus the leakage current from the storage capacitor portion is suppressed. | 03-08-2012 |
| 20120058600 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An object is to increase field effect mobility of a thin film transistor including an oxide semiconductor. Another object is to stabilize electrical characteristics of the thin film transistor. In a thin film transistor including an oxide semiconductor layer, a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor is formed over the oxide semiconductor layer, whereby field effect mobility of the thin film transistor can be increased. Further, by forming a semiconductor layer or a conductive layer having higher electrical conductivity than the oxide semiconductor between the oxide semiconductor layer and a protective insulating layer of the thin film transistor, change in composition or deterioration in film quality of the oxide semiconductor layer is prevented, so that electrical characteristics of the thin film transistor can be stabilized. | 03-08-2012 |
| 20120058599 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The semiconductor device includes a thin film transistor which includes a gate electrode layer, a gate insulating layer over the gate electrode layer, a source electrode layer and a drain electrode layer over the gate insulating layer, a buffer layer over the source electrode layer and the drain electrode layer, and a semiconductor layer over the buffer layer. A part of the semiconductor layer overlapping with the gate electrode layer is over and in contact with the gate insulating layer and is provided between the source electrode layer and the drain electrode layer. The semiconductor layer is an oxide semiconductor layer containing indium, gallium, and zinc. The buffer layer contains a metal oxide having n-type conductivity. The semiconductor layer and the source and drain electrode layers are electrically connected to each other through the buffer layer. | 03-08-2012 |
| 20120058598 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Electrical characteristics of transistors using an oxide semiconductor are greatly varied in a substrate, between substrates, and between lots, and the electrical characteristics are changed due to heat, bias, light, or the like in some cases. In view of the above, a semiconductor device using an oxide semiconductor with high reliability and small variation in electrical characteristics is manufactured. In a method for manufacturing a semiconductor device, hydrogen in a film and at an interface between films is removed in a transistor using an oxide semiconductor. In order to remove hydrogen at the interface between the films, the substrate is transferred under a vacuum between film formations. Further, as for a substrate having a surface exposed to the air, hydrogen on the surface of the substrate may be removed by heat treatment or plasma treatment. | 03-08-2012 |
| 20120058251 | Film Forming Apparatus And Method Of Manufacturing Light Emitting Device - The problem regarding volatileness of a solvent in an EL forming material, which occurs in adopting printing, are solved. An EL layer is formed in a pixel, portion of a light emitting device by printing. Upon formation of the EL layer, a printing chamber is pressurized to reach a pressure equal to or higher than the atmospheric pressure, and the printing chamber is filled with inert gas or set to a solvent atmosphere. Thus the difficulty in forming an EL layer by printing is eliminated. | 03-08-2012 |
| 20120057613 | LASER ANNEALING METHOD AND LASER ANNEALING DEVICE - The energy distribution in the short-side direction of a rectangular laser beam applied to an amorphous semiconductor film (amorphous silicon film) is uniformized. It is possible to the energy distribution in the short-side direction of the rectangular laser beam by the use of a cylindrical lens array | 03-08-2012 |
| 20120057397 | METHOD FOR DRIVING SEMICONDUCTOR DEVICE - In a driving method of a semiconductor device which conducts a multilevel writing operation, a signal line for controlling on/off of a writing transistor for conducting a writing operation on a memory cell using a transistor including an oxide semiconductor layer is disposed along a bit line, and a multilevel writing operation is conducted with use of, also in a writing operation, a voltage which is applied to a capacitor at a reading operation. The potential of a bit line is detected while data writing is conducted, and thereby whether a potential corresponding to the written data is normally applied to the floating gate can be confirmed without a writing verify operation. | 03-08-2012 |
| 20120057396 | SEMICONDUCTOR DEVICE AND DRIVING METHOD OF SEMICONDUCTOR DEVICE - An object is to provide a semiconductor device having a novel structure, which can hold stored data even when not powered and which has an unlimited number of write cycles. A semiconductor device is provided with both a memory circuit including a transistor including an oxide semiconductor (in a broader sense, a transistor whose off-state current is sufficiently small) and a peripheral circuit such as a driver circuit including a transistor including a material other than an oxide semiconductor (in other words, a transistor capable of operating at sufficiently high speed). The peripheral circuit is provided in a lower portion and the memory circuit is provided in an upper portion; thus, the area and size of the semiconductor device can be decreased. | 03-08-2012 |
| 20120057376 | POWER SUPPLY CIRCUIT - It is an object to obtain a detection circuit for detecting feedback voltage without variation in output voltage/current or in output voltage by the operation temperature, and a power supply circuit including thereof. A power supply circuit includes a detection circuit, an amplifier circuit outputting an output voltage, a control circuit, and a divider circuit. The detection circuit includes first and second reference voltage generation circuits and an input signal adjustment circuit. The control circuit is electrically connected to the amplifier circuit and includes the detection circuit, an error amplifier circuit, a pulse width modulation driver, a triangle-wave generation circuit, and a capacitor. The divider circuit is electrically connected to the amplifier circuit and the control circuit and inputs a voltage obtained by dividing the output voltage to the second reference voltage generation circuit. Note that the first and second reference voltage generation circuits are each a reference voltage circuit. | 03-08-2012 |
| 20120056862 | DISPLAY DEVICE AND ELECTRONIC APPARATUS - To provide a display device whose display can be recognized even in dark places or under the strong outside light. The display device performs display by controlling the number of gray scales in accordance with the intensity of outside light, which means a display mode can be switched in accordance with the data to be displayed on the display screen. A video signal generation circuit is controlled in each display mode in such a manner that it directly outputs an input video signal with an analog value, outputs a signal with a binary digital value, or outputs a signal with a multivalued digital value. As a result, gray scales displayed in pixels are timely changed. Accordingly, clear images can be displayed while maintaining high visibility in various environments, in the wide range from, for example, dark places or indoors (e.g., under a fluorescent lighting) to outdoors (e.g., under the sunlight). | 03-08-2012 |
| 20120056861 | SEMICONDUCTOR DEVICE - The semiconductor device includes a plurality of photosensors arranged in matrix. The photosensors each include a photoelectric conversion element and an amplifier circuit. A backlight is turned on, an object to be detected is irradiated with light, and the photosensor in a p-th row performs the reset operation and the storage operation. After that, the backlight is turned off, and the photosensor in a (p+1)th row performs the reset operation and the storage operation. Then, the photosensors in all the rows sequentially perform the selection operation. A difference between output signals obtained from the photosensors in adjacent rows is obtained. Using the difference, a captured image of the object is generated and a region where the object exists is detected. The amplifier circuit includes a transistor for holding stored electric charge, in which a channel is formed in an oxide semiconductor layer. | 03-08-2012 |
| 20120056860 | DISPLAY DEVICE - To suppress fluctuation in the threshold voltage of a transistor, to reduce the number of connections of a display panel and a driver IC, to achieve reduction in power consumption of a display device, and to achieve increase in size and high definition of the display device. A gate electrode of a transistor which easily deteriorates is connected to a wiring to which a high potential is supplied through a first switching transistor and a wiring to which a low potential is supplied through a second switching transistor; a clock signal is input to a gate electrode of the first switching transistor; and an inverted clock signal is input to a gate electrode of the second switching transistor. Thus, the high potential and the low potential are alternately applied to the gate electrode of the transistor which easily deteriorates. | 03-08-2012 |
| 20120056647 | SEMICONDUCTOR DEVICE AND DRIVING METHOD THEREOF - The semiconductor device includes a memory cell including a first transistor including a first channel formation region, a first gate electrode, and first source and drain regions; a second transistor including a second channel formation region provided so as to overlap with at least part of either of the first source region or the first drain region, a second source electrode, a second drain electrode electrically connected to the first gate electrode, and a second gate electrode; and an insulating layer provided between the first transistor and the second transistor. In a period during which the second transistor needs in an off state, at least when a positive potential is supplied to the first source region or the first drain region, a negative potential is supplied to the second gate electrode. | 03-08-2012 |
| 20120056646 | SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - An object is to alleviate the concentration of an electric field in a semiconductor device. A gate electrode and a drain electrode are provided not to overlap with each other, and an electric-field control electrode is provided between the gate electrode and the drain electrode over a top surface. Insulating layers are provided between the gate electrode and a semiconductor layer and between the electric-field control electrode and the semiconductor layer, and the insulating layer provided between the electric-field control electrode and the semiconductor layer has a larger thickness than the insulating layer provided between the gate electrode and the semiconductor layer. Further, when the semiconductor device is driven, the potential of the electric-field control electrode may be higher than or equal to a source potential and lower than a gate potential, and for example, connection between the electric-field control electrode and the source potential enables such a structure. | 03-08-2012 |
| 20120056537 | EL DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME - An object is to suppress luminance variation due to change in the amount of current flowing through a light-emitting element, caused by change in environmental temperature. A monitor circuit for compensating the cathode potential of the light-emitting element in accordance with environmental temperature is provided in the vicinity of a pixel portion in order to compensate a change in properties, due to environmental temperature, of a transistor including an oxide semiconductor layer and the light-emitting element. The monitor circuit includes a monitor power supply line, a monitor transistor including an oxide semiconductor layer, a monitor light-emitting element, a current source circuit, and an amplification circuit that compensates the cathode potential of the light-emitting element. The potential of the monitor power supply line is lower than the potential of a power supply line in the pixel. | 03-08-2012 |
| 20120056252 | ELECTRONIC DEVICE - An object is to provide a pixel structure of a display device including a photosensor which prevents changes in an output of the photosensor and a decrease in imaging quality. The display device has a pixel layout structure in which a shielding wire is disposed between an FD and an imaging signal line (a PR line, a TX line, or an SE line) or between the FD and an image-display signal line in order to reduce or eliminate parasitic capacitance between the FD and a signal line for the purpose of suppressing changes in the potential of the FD. An imaging power supply line, image-display power supply line, a GND line, a common line, or the like whose potential is fixed, such as a common potential line, is used as a shielding wire. | 03-08-2012 |
| 20120056214 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device of the invention includes a thin film transistor, an insulating layer covering the thin film transistor, an electrode which is electrically connected to the thin film transistor through a contact hole formed on the insulating layer, and a light emitting element formed by interposing a light emitting layer between a first electrode which is electrically connected to the electrode and a second electrode. The light emitting device further includes a layer formed of a different material from that of the insulating layer only between the electrode and the first electrode over the insulating layer and the insulating layer. | 03-08-2012 |
| 20120056204 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting device which includes a first TFT, a second TFT, a first pixel electrode, a second pixel electrode, an organic compound layer, a first opposing electrode and a second opposing electrode. The organic compound layer is formed on the first pixel electrode and the second pixel electrode. The first opposing electrode and a second opposing electrode are formed on the organic compound layer. When the first pixel electrode and the second opposing electrode are anodes, the second pixel electrode and the first opposing electrode are cathodes. When the first pixel electrode and the second opposing electrode are cathodes, the second pixel electrode and the first opposing electrode are anodes. | 03-08-2012 |
| 20120056176 | SPUTTERING TARGET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to provide a deposition technique for depositing an oxide semiconductor film. Another object is to provide a method for manufacturing a highly reliable semiconductor element using the oxide semiconductor film. A novel sputtering target obtained by removing an alkali metal, an alkaline earth metal, and hydrogen that are impurities in a sputtering target used for deposition is used, whereby an oxide semiconductor film containing a small amount of those impurities can be deposited. | 03-08-2012 |
| 20120056175 | FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A structure with which the zero current of a field effect transistor using a conductor-semiconductor junction can be reduced is provided. A floating electrode ( | 03-08-2012 |
