Sekisui Fuller Company, Ltd. Patent applications |
Patent application number | Title | Published |
20160122606 | ADHESIVE COMPOSITION - The present invention provides an adhesive composition excellent in adhesive strength. The adhesive composition of the present invention contains 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1 to 20 parts by weight of an epoxy resin, 0.1 to 10 parts by weight of an epoxysilane coupling agent, 0.5 to 20 parts by weight of a ketimine compound, and 1 to 100 parts by weight of fatty acid-treated calcium oxide. | 05-05-2016 |
20160083634 | CURABLE COMPOSITION AND JOINT STRUCTURE PRODUCED USING SAME - A curable composition is characterized by containing a polyalkylene oxide (A) having a hydrolyzable silyl group, an acrylic polymer (B) having a hydrolyzable silyl group, and an alkoxysilane oligomer (C) which is a hydrolysis-condensation product obtained from an alkylalkoxysilane and an aminoalkoxysilane and contains nitrogen atoms in an amount of 1% by weight or more. | 03-24-2016 |
20150337184 | ADHESIVE FOR FLOOR STRUCTURE - The present invention provides an adhesive for floor structure that can provide a floor structure inhibiting floor squeaks or joint gaps from occurring and that enables a floor finishing material to be peeled easily from a sub-floor material when repairing the floor finishing material. | 11-26-2015 |