| SCHOTT SOLAR AG Patent applications |
| Patent application number | Title | Published |
|---|
| 20110309555 | METHOD FOR THE SOLIDIFICATION OF A NON-METAL MELT - A method is proposed for the solidification of a non-metal melt ( | 12-22-2011 |
| 20110266876 | POWER SUPPLY SYSTEM AND PHOTOVOLTAIC DEVICE THEREFOR - A power supply system (SYS) and a photovoltaic device (PVE) intended therefor and comprising a plurality of DC voltage-generating photovoltaic modules (PVM) are proposed, wherein the photovoltaic modules (PVM) for generating a DC voltage (Udc*) exceeding the withstand voltage or dialectric strength (Umodmax) of the photovoltaic modules (PVM) and suitable for the high-voltage DC transmission are connected in parallel or in series to one another, wherein the power supply system (SYS) comprises a converter substation (UFS) that can be connected to a power supply network (SVN) installed for users, and includes a high-voltage DC transmission power line (HGUE) so as to transmit in the high voltage range the DC voltage (Udc*) generated by the photovoltaic device (PVE) to the converter substation (UFS). | 11-03-2011 |
| 20110204126 | METHOD AND APPARATUS FOR APPLYING SOLDER TO A WORK PIECE - The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature T | 08-25-2011 |
| 20110201196 | METHOD FOR PRODUCING A METAL CONTACT ON A SEMICONDUCTOR SUBSTRATE PROVIDED WITH A COATING - A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate. | 08-18-2011 |
| 20110183524 | METHOD FOR CHEMICALLY TREATING A SUBSTRATE - A method for chemically treating a disc-shaped substrate having a bottom surface, a top surface and side surfaces by contacting a process medium that is fluid-chemically active with at least the bottom surface of the substrate. The substrate is moved relative to the process medium while forming a triple line between the substrate, the substrate medium and the atmosphere surrounding the substrate and medium. In order to chemically remove errors, particularly in the side surfaces, relative motion should be carried out while avoiding a contacting of the process medium with the top surface of the substrate, where the triple line is formed at a desired height of the side surface facing away from the process medium flow side in relation to the relative motion between the substrate and the process medium. In this way, the atmosphere can be adjusted in relation to the partial pressures of the components in the process medium such that the top surface preserves hydrophobic characteristics. | 07-28-2011 |
| 20110165726 | METHOD AND ARRANGEMENT FOR PRODUCING A FUNCTIONAL LAYER ON A SEMICONDUCTOR COMPONENT - A method for producing at least one functional layer on at least one region of a surface of a semiconductor component by applying a liquid to at least the one region, where the functional layer has a layer thickness d | 07-07-2011 |
| 20110132451 | SOLDER SUPPORTING LOCATION FOR SOLAR MODULES AND SEMICONDUCTOR DEVICE - A soldered connection between an outer surface of a semiconductor device, connected to a substrate by means of an adhesive layer, and a connector in the form of a strip. In order that tensile forces acting on the connector do not cause the semiconductor device to become detached from the substrate or the adhesive layer, it is proposed that a supporting location extends from the outer surface of the semiconductor device, which supporting location is formed of solderable material and makes contact with the outer surface by way of a contact surface A, in or on which the connector is soldered while maintaining a distance a from the outer surface where a≧10μ; and/or that the distance b between the edge of the contact surface between the supporting surface and the outer surface and the entry of the connector into the supporting location or the beginning of contact therebetween is b≧50μ. | 06-09-2011 |
| 20110065231 | PROCESS FOR PRODUCING A CONTACT AREA OF AN ELECTRONIC COMPONENT - A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed. | 03-17-2011 |
| 20110030236 | Procedure for increasing the long-term stability of transport aids - The invention is related to a procedure for the heat treatment of semiconductor elements, which are fed through a process chamber in the continuous-flow procedure. With it, ceramic transport aids used for the transport of the semiconductor elements demonstrate a clearly better long-term mechanical stability compared with known procedures; it is proposed that at least, by way of example, one specific humid atmosphere be adjusted in the process chamber. | 02-10-2011 |
| 20100186813 | Photovoltaic module - For fastening the contact strip ( | 07-29-2010 |
