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SAPA PROFILES, INC.
| SAPA PROFILES, INC. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100230162 | EXTRUDED FRAME STRUCTURES TO HOUSE A CONDUCTOR - Embodiments of the present disclosure provide extruded frame structures to house a conductor and associated techniques and configurations. An apparatus includes an extruded frame structure having a frame profile configured to house a conductor and insulator. Other embodiments may be described and/or claimed. | 09-16-2010 |