SANYO TUNER INDUSTRIES CO., LTD.
|SANYO TUNER INDUSTRIES CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20130307401||LIGHT-EMITTING DEVICE PACKAGE - Provided is a light-emitting device package having a high reflectance and strength. In a light-emitting device package (||11-21-2013|
|20100246135||ELECTRONIC DEVICE - An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base.||09-30-2010|
|20100213811||PACKAGE FOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME - The package for a light emitting element according to the present invention comprises a base substrate made of ceramic including glass, and a frame body made of ceramic. The frame body is arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the light emitting element. A part of the glass included in the base substrate is precipitated in an area of the top surface of the base substrate, which is a bottom surface of the cavity, and a crystallinity degree of the precipitated glass is greater than 3%. In the manufacturing method of the package according to the present invention, a ceramic body which is to be the package is fired at a temperature of 840 degrees C. or higher and lower than 950 degrees C.||08-26-2010|
|20100182791||PACKAGE FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE - In a package for a light emitting element according to the present invention, a light reflecting plate is buried in a base substrate at a position below a cavity with a light reflecting surface thereof facing upward, a part of the ceramic forming the base substrate is interposed between the light reflecting surface of the light reflecting plate and a top surface of the base substrate, and at least the part is light-transmitting. A light emitting device comprises the package, and the light emitting element accommodated in the cavity of the package. In another light emitting device, a first reflector which is made of a metal material and reflects a light emitted from the light emitting element is buried in a frame body.||07-22-2010|
|20100181105||PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT - A package for an electron element comprises: a base substrate made of ceramic; a frame body made of ceramic arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the electron element; a via formed in the base substrate below the cavity, penetrating the base substrate from the top surface to a bottom surface thereof and filled with a thermally-conductive material; and a projecting part formed on an inner wall of the via and projecting toward a center of the via. The projecting part has a length along a direction perpendicular to a penetration direction of the via not less than a thickness along the penetration direction. An electronic component comprises the package and the electron element mounted thereon. The electron element is accommodated in the cavity defined inside the frame body of the package and arranged above the via.||07-22-2010|
|20100018035||FABRICATION METHOD OF BATTERY PACK DEVICE - A fabrication method of battery pack device includes the steps of: preparing a plurality of protection circuit substrates disposed apart from each other in a space of a frame, and supported to the frame via a bridge member; attaching a connector component to a top face side of each of the protection circuit substrates; moving a leading end of a sealing material feeder towards the connector component from a bottom side of the protection circuit substrate and supplying a sealing material to a bottom end of the connector component; infiltrating the sealing material into a gap between the connector component and the protection circuit substrate, along a circumference at the bottom end of the connector component to seal the gap with the sealing material.||01-28-2010|
|20090086859||RECEIVING UNIT RECEIVING DIGITAL TELEVISION BROADCASTING - In a receiving unit, an AGC circuit controls the gain of a high frequency amplifier based on an output signal of a mixer, that is, an intermediate frequency signal obtained before an unnecessary frequency component is removed by a BPF. Therefore, deterioration in the distortion characteristic of the mixer can be suppressed more effectively than a conventional case where the gain of the high frequency amplifier is controlled based on an intermediate frequency signal that has passed through the BPF and amplified by an intermediate frequency amplifier.||04-02-2009|
|20090079880||Television Tuner - A correction circuit comprised of a capacitor and a switch is attached to a resonator such that a single resonance circuit is used to cover the television signals of a plurality of bands. Furthermore, the number of the components in the tuner circuit is reduced. A television tuner functions to receive a television broadcast signal divided into a plurality of frequency bands for conversion into an intermediate frequency signal of a predetermined frequency. The television tuner includes a resonance circuit controlling a frequency of a local oscillation signal which oscillates within a predetermined frequency band. During reception of a first frequency band, a tuning voltage is applied to a variable circuit element included in the resonance circuit to control the frequency of the local oscillation signal. During reception of a second frequency band, the tuning voltage is applied to the variable circuit element included in the resonance circuit and a correction control signal is applied to a non-variable circuit element connected to the variable circuit element to control the frequency of the local oscillation signal.||03-26-2009|
|20080265837||CONNECTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND BATTERY PACK USING THE SAME - A connector device includes a circuit board and a connector body, and the connector body includes a housing and a connection terminal provided inside the housing. A silicon resin is applied to fill a gap between the connector body and the circuit board. The application of the silicon resin can prevent a mold resin used to seal the connector device and a battery pack body from entering from the gap into the housing. Thereby, a connector device reliably establishing conduction and a battery pack applying such a connector device can be obtained.||10-30-2008|
|20080211970||TELEVISION RECEPTION CIRCUIT AND TELEVISION RECEPTION APPARATUS - A television reception circuit includes a high-frequency amplifier amplifying a received television signal, a mixer frequency-converting the amplified television signal to an intermediate-frequency signal, a filter attenuating a component outside a prescribed frequency band in the resultant intermediate-frequency signal, a first AGC circuit outputting a first gain control signal for setting a level of the intermediate-frequency signal output from the mixer to a prescribed value, a second AGC circuit outputting a second gain control signal for setting a level of the signal that has passed through the filter to a prescribed value, and a switch selecting any one of the first gain control signal and, the second gain control signal and outputting the selected gain control signal to the high-frequency amplifier, and the high-frequency amplifier amplifies the television signal with gain based on the gain control signal received from the switch.||09-04-2008|
Patent applications by SANYO TUNER INDUSTRIES CO., LTD.