| Santa Barbara Infrared Patent applications |
| Patent application number | Title | Published |
|---|
| 20110114707 | Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures - A method for making thermally conductive high aspect ratio large area contact between devices with different coefficients of thermal expansion. The method of the invention includes the creation or placement of sparse structures on at least one of two surfaces or between the surfaces to maintain enough thickness that an interposed bonding material remains sufficiently compliant that relative thermal motion of the two devices can occur without damage to the devices or the bond during changes in temperature. | 05-19-2011 |
| 20110114705 | Method for creating thermal bonds while minimizing heating of parts - A method for making thermally conductive high aspect ratio large area contact between devices while reducing the heating of the devices. The method of the invention includes the use of reactive foils to solder two devices together at room temperature while imparting significantly less temperature rise and resultant residual stress in the bulk devices when compared with conventional reflow solder techniques. | 05-19-2011 |
