SANKYO KASEI CO., LTD.
|SANKYO KASEI CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20120107522||METHOD FOR PRODUCING FORMED CIRCUIT COMPONENT - Disclosed is a method for producing a formed circuit component, wherein the surface of a substrate is roughened by being irradiated with laser ray instead of being etched using a chemical agent, thereby assuring sufficient adhesive strength with an electroless plating. Specifically disclosed is a method for producing a formed circuit component, which comprises: a first step of forming a substrate (||05-03-2012|