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SAMSUNG LED CO.,LTD.

Suwon, KR

SAMSUNG LED CO.,LTD. Patent applications
Patent application numberTitlePublished
20120030940Method of manufacturing component embedded printed circuit board - A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.02-09-2012